JPH03112947U - - Google Patents

Info

Publication number
JPH03112947U
JPH03112947U JP1990020981U JP2098190U JPH03112947U JP H03112947 U JPH03112947 U JP H03112947U JP 1990020981 U JP1990020981 U JP 1990020981U JP 2098190 U JP2098190 U JP 2098190U JP H03112947 U JPH03112947 U JP H03112947U
Authority
JP
Japan
Prior art keywords
main body
fixing frame
cooling duct
printed board
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990020981U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990020981U priority Critical patent/JPH03112947U/ja
Publication of JPH03112947U publication Critical patent/JPH03112947U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
JP1990020981U 1990-02-28 1990-02-28 Pending JPH03112947U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990020981U JPH03112947U (de) 1990-02-28 1990-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990020981U JPH03112947U (de) 1990-02-28 1990-02-28

Publications (1)

Publication Number Publication Date
JPH03112947U true JPH03112947U (de) 1991-11-19

Family

ID=31524060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990020981U Pending JPH03112947U (de) 1990-02-28 1990-02-28

Country Status (1)

Country Link
JP (1) JPH03112947U (de)

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