JPH03112971U - - Google Patents
Info
- Publication number
- JPH03112971U JPH03112971U JP2243290U JP2243290U JPH03112971U JP H03112971 U JPH03112971 U JP H03112971U JP 2243290 U JP2243290 U JP 2243290U JP 2243290 U JP2243290 U JP 2243290U JP H03112971 U JPH03112971 U JP H03112971U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic component
- mounting structure
- connection part
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910000978 Pb alloy Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案に係る電子部品の実装構造の
一例を示す断面図、第２図は第１図のの部分の
拡大断面図、第３図は同電子部品を両面回路用配
線基板に実装した例を示す断面図、第４図は電子
部品をプリント配線基板の表面側に実装した例を
示す断面図である。
１，２１……配線基板、２……導電パターン、
４……電子部品、５……外部端子、６……ろう材
、７……ろう付け接続部、８……防錆被膜。
Figure 1 is a cross-sectional view showing an example of the electronic component mounting structure according to this invention, Figure 2 is an enlarged cross-sectional view of the part shown in Figure 1, and Figure 3 is the electronic component mounted on a double-sided circuit wiring board. FIG. 4 is a sectional view showing an example in which electronic components are mounted on the front surface side of a printed wiring board. 1, 21... Wiring board, 2... Conductive pattern,
4...Electronic component, 5...External terminal, 6...Brazing metal, 7...Brazing connection part, 8...Rust prevention coating.
Claims (1)
のろう材でろう付けして電気的に接続される電子
部品とを備え、上記ろう付け接続部の表面に防錆
被膜を形成したことを特徴とする電子部品の実装
構造。 It is characterized by comprising a wiring board and an electronic component to which external terminals are electrically connected to the wiring board by brazing with a lead alloy brazing material, and a rust-preventive coating is formed on the surface of the brazed connection part. Mounting structure of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2243290U JPH03112971U (en) | 1990-03-06 | 1990-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2243290U JPH03112971U (en) | 1990-03-06 | 1990-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112971U true JPH03112971U (en) | 1991-11-19 |
Family
ID=31525441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2243290U Pending JPH03112971U (en) | 1990-03-06 | 1990-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112971U (en) |
-
1990
- 1990-03-06 JP JP2243290U patent/JPH03112971U/ja active Pending