JPH03113835U - - Google Patents

Info

Publication number
JPH03113835U
JPH03113835U JP2402790U JP2402790U JPH03113835U JP H03113835 U JPH03113835 U JP H03113835U JP 2402790 U JP2402790 U JP 2402790U JP 2402790 U JP2402790 U JP 2402790U JP H03113835 U JPH03113835 U JP H03113835U
Authority
JP
Japan
Prior art keywords
resin
lead terminals
electronic
electronic element
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2402790U
Other languages
Japanese (ja)
Other versions
JP2571795Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990024027U priority Critical patent/JP2571795Y2/en
Publication of JPH03113835U publication Critical patent/JPH03113835U/ja
Application granted granted Critical
Publication of JP2571795Y2 publication Critical patent/JP2571795Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は一実施例を示す垂直断面図、第２図は
同実施例で封止される電子素子を示す斜視図、第
３図、第４図、第５図及び第６図はそれぞれ他の
実施例を示す垂直断面図である。 ２，２０，２４……電子素子、４……圧電基板
、６……振動電極、８……端子電極、１０……リ
ード端子、１２，１８，２２……内側樹脂層、１
４……高靭性エポキシ樹脂層。 FIG. 1 is a vertical sectional view showing one embodiment, FIG. 2 is a perspective view showing an electronic device sealed in the same embodiment, and FIGS. FIG. 2, 20, 24... Electronic element, 4... Piezoelectric substrate, 6... Vibrating electrode, 8... Terminal electrode, 10... Lead terminal, 12, 18, 22... Inner resin layer, 1
4...High toughness epoxy resin layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード端子をもつ電子素子がリード端子を露出
させて樹脂により封止されている電子部品におい
て、電子素子を封止している樹脂の外装が高靭性
エポキシ樹脂であることを特徴とする樹脂封止形
電子部品。 An electronic component in which an electronic element having lead terminals is sealed with a resin with the lead terminals exposed, characterized in that the exterior of the resin sealing the electronic element is a high-toughness epoxy resin. shaped electronic components.
JP1990024027U 1990-03-08 1990-03-08 Resin-sealed electronic components Expired - Lifetime JP2571795Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990024027U JP2571795Y2 (en) 1990-03-08 1990-03-08 Resin-sealed electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990024027U JP2571795Y2 (en) 1990-03-08 1990-03-08 Resin-sealed electronic components

Publications (2)

Publication Number Publication Date
JPH03113835U true JPH03113835U (en) 1991-11-21
JP2571795Y2 JP2571795Y2 (en) 1998-05-18

Family

ID=31527006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990024027U Expired - Lifetime JP2571795Y2 (en) 1990-03-08 1990-03-08 Resin-sealed electronic components

Country Status (1)

Country Link
JP (1) JP2571795Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018814A (en) * 2009-07-10 2011-01-27 Nippon Chemicon Corp Capacitor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027441U (en) * 1983-08-01 1985-02-25 日本電気株式会社 Hybrid integrated circuit device
JPS6365316U (en) * 1986-10-17 1988-04-30
JPS63116451A (en) * 1986-11-04 1988-05-20 Mitsubishi Electric Corp Hybrid integrated circuit device
JPH01289146A (en) * 1988-05-16 1989-11-21 Nec Corp Hybrid integrated circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027441U (en) * 1983-08-01 1985-02-25 日本電気株式会社 Hybrid integrated circuit device
JPS6365316U (en) * 1986-10-17 1988-04-30
JPS63116451A (en) * 1986-11-04 1988-05-20 Mitsubishi Electric Corp Hybrid integrated circuit device
JPH01289146A (en) * 1988-05-16 1989-11-21 Nec Corp Hybrid integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018814A (en) * 2009-07-10 2011-01-27 Nippon Chemicon Corp Capacitor

Also Published As

Publication number Publication date
JP2571795Y2 (en) 1998-05-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term