JPH03116891A - multilayer resin film - Google Patents

Abstract

PURPOSE:To obtain a multilayered resin film which can be formed into an optional shape and easily manufactured by a method wherein the resin film is provided with a continuous part which is easily deformable by heat. CONSTITUTION:A circuit wiring is formed on a resin film 11 of, for instance, polycarbonate, polyvinyl chloride, polystyrene, saturated polyester, or the like, and furthermore resin films 12-15 are piled thereon. At this point, the films 12-15 are piled separately from each other on the lower resin film 11, which are thermocompressed into an integral structure. That is, in the above multilayered resin film, the parts where the layers 12-15 are separate from each other are thin as compared with the other part, so that the separation parts concerned are easily deformed by heat as compared with the other part when this multilayered board is hot-pressed into an integral structure, and thus a multilayered resin film, which can be formed into an optional shape taking advantage of parts which are easily deformed by heat, can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a multilayer resin film, and particularly to a multilayer resin film that facilitates deformation during thermal processing of the resin film.

(Prior Art) Conventionally, in electronic devices, a metal core substrate has been used as a case-integrated substrate. This metal core board is usually produced by pressing the board 1 shown in FIG. 4(A) and then mounting electronic components as shown in FIG. 4(B).

However, according to the conventional metal core substrate, 1IjJ 9 points described below are H.

(1) When integrating the electronic component 2 with the board 1, the board 1 is pressed into a case, and then the sub-components 2 are mounted, so the degree of freedom in processing is small.

(2) After pressing the board 1, the electronic components 2 are mounted, so 7? It is difficult to inspect ST1 part 2.

(3) The applied pressure during processing of metal etc. is large, reducing work efficiency.

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and is a multilayer resin film in which a plurality of resin films on which electric circuits are formed are integrally laminated by thermocompression bonding. The purpose of the present invention is to provide a multilayer resin film that has an arbitrary shape and is easy to manufacture by having heat-deformable parts.

[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention provides a multilayer resin film in which a plurality of resin films on which electric circuits are formed are integrally laminated by thermocompression bonding. This is a multilayer resin film characterized by having a deformable portion.

Materials for the resin film according to the present invention include polycarbonate, polyvinyl chloride, and polystyrene.

Examples include thermoplastic resins such as saturated polyester.

Electronic components according to the present invention include electronic elements such as ICs and capacitors, as well as wiring patterns.

According to the present invention, in a multilayer resin film in which a plurality of resin films on which electric circuits are formed are integrally laminated by heat-pressing, an arbitrary shape can be formed by having a continuous heat-deformable portion. It has the advantage of being able to easily produce a multilayer resin film with

(Example) An embodiment of the present invention will be described below with reference to FIG.

11 in the figure is, for example, polycarbonate, polyvinyl chloride, polystyrene, or saturated polyester resin.

Polystyrene, polypropylene, polyphenylene oxide, polysulfone, polyphenylene sulfide,
It is a resin film made of polyacetal, boilyamide, etc. On this resin film 11, circuit wiring (not shown) is formed by printing a conductor layer mainly made of silver, copper, nickel, gold, or the like. Further, the resin film 11 has circuit wiring formed by printing a conductive layer of silver or the like, and also has resin films 12 to IE laminated thereon. Here, these resin films 12-I
As is clear from FIG. 1, S is laminated on the lower resin film I2 so as to be spaced apart from each other, and is integrally formed by heat-pressing blue.

゛In other words, in the above multilayer resin film, the thickness of the substrate in the spaced apart portion is thinner than in other portions,
When this board is integrated by heat pressing, this separated part is more easily thermally deformed than other parts, and a multilayer resin with a shape of (r::t?) is formed around this U heat deformed part. A film is produced.

Therefore, for example, if a heat deformable area is formed on the multilayer resin film at the periphery of the contact position, the multilayer resin film can be molded to follow the shape of the electronic component block during hot pressing. I can do it.

Specifically, as shown in FIG. 3, a multilayer resin film 17 with a radiation-thermal deformable area formed around the position where the electronic component block is mounted is placed in a mold 2o equipped with a heater 19, and pressure is applied. In addition, this thermally deformable portion can be selectively bent to realize a case-integrated electronic circuit board having a desired shape.

In addition, in the above-described embodiment, a case has been described in which, when thermocompression bonding is performed to integrate a plurality of resin films, the deformed portions are simultaneously deformed so as to obtain a desired shape, but the present invention is not limited to this. For example, after heat-pressing multiple resin films to create an integrated multilayer resin film,
The radiation heat deformation portion may be deformed so as to have a desired shape.

In addition, although a case is described in which a part of the resin film is spaced apart like a notch to form a heat deformable part, for example, a part of the resin film is replaced with a material with a low softening temperature to form a heat deformable part. It can also be configured.

[Effects of the Invention] As detailed above, according to the present invention, in a multilayer resin film in which a plurality of resin films on which electric circuits are formed are integrally laminated by thermocompression bonding, continuous radiation deformable portions are formed. By doing so, it is possible to provide a multilayer resin film that has an arbitrary shape and is easy to manufacture.

[Brief explanation of drawings]

FIG. 1 is a plan view of a multilayer resin film according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line X-X in FIG. An explanatory diagram, FIG. 4, is an explanatory diagram of a conventional bending process of a multilayer resin film. 11-15...Resin film, 18...Electronic component block, 19...Heater, 20...Model.

Claims (1)

[Claims] 1. A multilayer resin film in which a plurality of resin films on which electric circuits are formed are integrally laminated by thermocompression bonding, the multilayer resin film having a continuous heat-deformable portion.