JPH031176Y2 - - Google Patents

Description

[Detailed explanation of the invention] [Industrial application field] The present invention is a long polishing machine mainly used for dry polishing (centerless polishing, etc.) of materials such as metal products, stone products, ceramic products, and plastic products. It concerns the structure of a large cylindrical grindstone.

[Conventional technology]

Making a large cylindrical whetstone at once requires a large and expensive mold, so traditionally, instead of making the entire whetstone at once, small whetstones were made divided into several sections, and these small The method used was to stack the grindstones coaxially and tighten them to obtain a grindstone of the required size.

According to this method, the required molds are small and can be manufactured at low cost, but the molds are still expensive and production takes a long time. In addition, the large cylindrical grindstones for dry polishing made using this stacking method have shallow chip pockets, so they are prone to clogging, and once clogging occurs and the grinding ability decreases, dressing work is performed to restore this ability. The disadvantage was that it required a huge amount of labor and power, and the production cost increased significantly.

[The problem that the idea aims to solve]

The purpose of the present invention is to provide a cylindrical grindstone for dry polishing that can reduce manufacturing costs and manufacturing days, and has a function that can be significantly effective in preventing clogging.

[Means to solve the problem]

The dry cylindrical grindstone of the present invention consists of a plurality of thin-walled grindstones made by sintering an annular abrasive grain layer with approximately the same thickness as the substrate on the outer edge of a circular substrate. It has a structure that is integrated without any gaps by re-sintering inside. In this thin-walled grindstone, when an annular abrasive grain layer is sintered on the outer periphery of the substrate, at the same time, multiple grooves with openings are arranged on the outer periphery of the abrasive grain layer almost radially on both the front and back sides of the abrasive grain layer. Furthermore, the invention of the present application is a grooved grindstone in which the arrangement phase of the grooves is alternately shifted between the front side and the back side, and the thickness of the circular substrate and the abrasive grain layer are almost the same. Patent Application No. 1936-1931 (Japanese Unexamined Patent Publication No. 58-102677), which was first developed by
It has the same structure as the diamond saw shown in No.

The object of the above-mentioned prior patent is a cutter that is mass-produced for cutting hard materials such as stone, and is used one by one, whereas the object of this patent is a large dry grinder made by stacking multiple thin-walled grindstones. Both grindstones are used for completely different purposes.

[Effect]

The cylindrical grindstone of the present application is constructed by stacking thin-walled grindstones each having a plurality of grooves radially arranged on both sides of an annular abrasive grain layer, so the outer peripheral surface of the completed cylindrical grindstone has: The outer end openings of the grooves described above are distributed and the small holes are formed in a distributed manner. Since these small holes are large and deep, they can provide a much more pronounced clogging prevention effect than the chip pockets that exist on the surface of conventional cylindrical grindstones.

〔Example〕

Embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 is a front view of the proposed cylindrical grindstone used for dry polishing work, Figure 2 is a sectional view taken along line A-A' in Figure 1,
Fig. 3 is a partial plan view of the abrasive grain layer of the grooved thin-walled grindstone that constitutes the proposed cylindrical grindstone, Fig. 4 is a partial front view of the abrasive grain layer, and Fig. 5 is the groove of the adjacent grooved thin-walled grindstone. FIG. 6 is a partial plan view of the case in which the grooves are not directly opposed.

In FIG. 1, reference numeral 1 is a substrate, 2 is an annular abrasive grain layer, 3 is a base metal, 4 is a hole provided on the side surface of the substrate, and 5 is a shaft hole. The symbols 1', 1'', etc. in Fig. 2 indicate the substrate, 2',
2″... etc. are annular abrasive grain layers with approximately the same thickness as the substrate,
3 is a base metal, and 5 is a shaft hole. Each abrasive grain layer is a mixture of metal bond and abrasive grains, has approximately the same thickness as the substrate, and when sintered to the outer periphery of the substrate, simultaneously a plurality of grooves 7, 7' having openings on the outer periphery are abraded. They are arranged almost radially on both sides of the grain layer. Note that any abrasive grains such as diamond, cubic boron nitride, alumina, and silicon carbide can be used as the abrasive grains. The one shown in Figure 2 is a thin grooved grindstone made by sintering the substrate and abrasive grain layer using the method described above, with silver solder powder and flux thinly applied to the substrate surface, and multiple pieces coaxially stacked one on top of the other. A cylindrical grindstone is formed by resintering in a post-reducing atmosphere and is fixed to a base metal 3.

FIG. 2 shows the structure of the cylindrical grindstone according to the present invention, in which grooves 7 and 7' arranged almost radially on both sides of each abrasive grain layer have openings on the outer periphery of the grindstone.
It reaches from the inner circumference to the outer circumference of the abrasive grain layer. In addition, since the depth of the groove is made to be 1/2 the thickness of the abrasive grain layer, the effective circumference of the part of the outer circumferential surface of the cylindrical grinding wheel that contacts the workpiece is the same at any part of the cylindrical grinding wheel. The long length eliminates uneven polishing caused by uneven contact, resulting in a beautifully polished surface.

The code 2 in Fig. 3 is the abrasive grain layer of the thin-walled grindstone, 7, 7'
In Fig. 4, 1 is the substrate of the thin grinding wheel, 2 is the groove.
indicates an abrasive layer, and 7 indicates a groove. In Figure 5, 7,
7' is a groove between the abrasive grain layers 2' and 2'' of adjacent thin-walled grindstones,
A case is shown in which the grooves are assembled with the grooves directly facing each other, and FIG. 6 shows a case in which the grooves 7 and 7' are not directly opposed but are deviated from each other. In the case of Fig. 5, the area of one hole formed by the grooves 7 and 7' appearing on the outer surface of the cylindrical grinding wheel is twice that of the case of Fig. 6, but in both cases. Since the total area of the holes is constant, good cutting quality can be maintained. Therefore, the worker can choose whichever is more convenient depending on the content of the work.

The proposed cylindrical grindstone has the above structure, and there is no need to create a coolant flow path unlike in wet polishing work, so the thickness of the annular abrasive grain layer of the thin-walled grindstone and the thickness of the substrate are almost the same. A manufacturing method in which the grindstone is made to the same size, a thin coat of silver wax powder and flux is applied to the surface of the substrate, and each thin-walled grindstone is brought into close contact with each other, and then the whole is re-sintered in a reducing atmosphere and integrated to form a cylindrical grindstone. Take.
Grooves 7 and 7' visible on the outer circumferential surface of the completed cylindrical grindstone
The holes formed by this process serve as temporary storage areas for chips generated during work, so clogging conditions in which chips stick to the grinding wheel surface are less likely to occur, and chips in the holes can be easily removed by blowing air. It can also be removed.

[Effect of idea]

As mentioned above, the dry cylindrical whetstone of the present invention does not cause clogging on the polishing surface, so the outer peripheral surface of the whetstone always maintains the same excellent sharpness as when it was new. This performance is achieved because the grooves arranged on the sides of the annular abrasive grain layer of the thin-walled whetstone continue from the inner periphery of the abrasive grain layer to the outer periphery of the abrasive grain layer. can be secured. With conventional cylindrical grindstones, when clogging occurs, a lot of time is spent on dressing work to remove chips stuck to the outer circumferential surface of the grindstone. However, with the use of the cylindrical grindstone of this invention, the dressing work is much easier. This has the advantage that the production cost of dry polishing work can be significantly reduced.

Furthermore, since the individual thin-walled grindstones constituting the dry cylindrical grindstone of the present invention can be similar to those that are mass-produced as cutters for cutting stone materials, there is no need to prepare a special expensive mold. This eliminates the huge expense and long time required to make molds, and furthermore, the production time is significantly shortened. Therefore, the manufacturing cost of the long dry cylindrical grindstone according to the present invention, which is made by stacking such thin-walled grindstones, can be significantly reduced.

As explained above, the development of the dry cylindrical grindstone of the present invention will greatly contribute to lowering the manufacturing cost of long cylindrical grindstones used for centerless polishing work, etc., and by eliminating clogging, the grindstone will last until the end of its life. It has the advantage of being able to maintain the sharpness of a new product, and there is no need for dressing work to remove chips stuck to the outer surface of the grinding wheel when clogging occurs, so there are significant benefits based on reduced costs of polishing work. The economic benefits are significant.

[Brief explanation of the drawing]

Fig. 1 is a front view of the proposed cylindrical grindstone mainly used for dry grinding work, and Fig. 2 is A-A in Fig. 1.
A′ sectional view, Figure 3 is a partial plan view of the abrasive grain layer part of the grooved thin-walled grindstone that constitutes the proposed cylindrical grindstone, Figure 4 is a partial front view of the same part, and Figure 5 is the adjacent grooved thin-walled grindstone. FIG. 6 is a partial plan view of the grindstone assembled so that the grooves of the grindstone face each other directly, and FIG. 1, 1', 1''...Substrate, 2, 2', 2''...Abrasive grain layer, 3...Base metal, 4...Hole, 5...Shaft hole, 7,
7'...Groove.

Claims (1)

[Scope of utility model registration request] In a cylindrical grindstone formed by coaxially stacking a plurality of disc-shaped thin-walled grindstones, the thin-walled grindstone has a circular substrate 1.
An annular abrasive layer 2 having approximately the same thickness as that of the substrate is sintered on the outer edge of the abrasive layer. , and a large number of grooves 7 extending substantially radially toward the center of the substrate.
7' is arranged, and the arrangement phase of the groove is as follows:
A cylindrical whetstone in which the front side and back side of the abrasive grain layer are alternately staggered, and which has a structure in which a plurality of such thin-walled whetstones are stacked coaxially and the whole is integrated without any gaps by resintering. .