JPH0311787A - Electronic component mounting board - Google Patents
Electronic component mounting boardInfo
- Publication number
- JPH0311787A JPH0311787A JP1147821A JP14782189A JPH0311787A JP H0311787 A JPH0311787 A JP H0311787A JP 1147821 A JP1147821 A JP 1147821A JP 14782189 A JP14782189 A JP 14782189A JP H0311787 A JPH0311787 A JP H0311787A
- Authority
- JP
- Japan
- Prior art keywords
- fin
- recess
- metal plate
- heat dissipation
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体チップ等の電子部品の熱を放散するた
めのフィンを取り付けた。電子部品搭載用基板に関する
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention includes a fin for dissipating heat from an electronic component such as a semiconductor chip. Regarding a board for mounting electronic components.
従来、フィンを取り付けた電子部品搭載用基板は、第７
図に示すごとく１基板９の略中央部において、フィン３
を接合したものである。Conventionally, electronic component mounting boards with fins attached have a 7th
As shown in the figure, at approximately the center of one substrate 9, the fin 3
It is made by joining.
即ち、上記フィン３は、基板９に設けた凹所９０内に放
熱用金属板８を配設し１該放熱用金属板８の平滑な上面
に接合されている。また、該フィン３は、フィン本体３
０と脚部３１とよりなる。That is, the fin 3 has a heat dissipating metal plate 8 disposed in a recess 90 provided in the substrate 9, and is bonded to the smooth upper surface of the heat dissipating metal plate 8. Further, the fin 3 has a fin main body 3
0 and leg portions 31.
そして、該脚部３１は、上記放熱用金属板８の上面の略
中央部において接合されている。The leg portions 31 are joined at approximately the center of the upper surface of the heat dissipation metal plate 8.
また、上記放熱用金属板８は、下面の略中央部に設けた
凹部５０内において、半導体チップ５を搭載している。Further, the heat dissipation metal plate 8 has the semiconductor chip 5 mounted in a recess 50 provided at approximately the center of the lower surface.
そして、該放熱用金属板８は、その下面側の接合層８２
が上記基板９に接着されている。また、上記半導体チッ
プ５は、ワイヤーボンディング５１により基板９上に配
設した導体回路９１に接続されている。また、該半導体
チップ５は、その周縁部を金属キャップ５２により覆っ
ている。The heat dissipation metal plate 8 has a bonding layer 82 on its lower surface side.
is adhered to the substrate 9. Further, the semiconductor chip 5 is connected to a conductive circuit 91 disposed on the substrate 9 by wire bonding 51. Further, the semiconductor chip 5 has its peripheral portion covered with a metal cap 52.
また、上記基板９は８貫通孔により形成されたスルーホ
ール９３を有する。該スルーホール９３内には、上記導
体回路９１と電気的に接続された金属被膜９３１を有す
る。また、該スルーホール９３は、開口部周縁部にドー
ナツ形状のランド部９２を有する。そして、該スルーホ
ール９３内には、リードピン４が嵌挿されている。Further, the substrate 9 has a through hole 93 formed by eight through holes. The through hole 93 has a metal coating 931 electrically connected to the conductor circuit 91 . Further, the through hole 93 has a donut-shaped land portion 92 at the periphery of the opening. The lead pin 4 is fitted into the through hole 93.
しかして、上記半導体チップ５に通電された場合には、
該半導体チンプ５より発熱する熱は、上記放熱用金属板
２及びフィン３より放熱する。However, when the semiconductor chip 5 is energized,
The heat generated by the semiconductor chimp 5 is radiated through the heat radiating metal plate 2 and the fins 3.
しかしながら、上記従来の基板は１次の間別点を有する
。However, the above-mentioned conventional substrate has a first-order difference.
即ち、上記フィン３は、上記放熱用金属板８の上面であ
る平滑面８０に接合されているため、フィン３の接着強
度が小さい、これは、該フィン３が 上記脚部３１の接
合面積が一定の大きさに制限されているからである。That is, since the fin 3 is bonded to the smooth surface 80 that is the upper surface of the heat dissipation metal plate 8, the adhesive strength of the fin 3 is small. This is because it is limited to a certain size.
また、上記フィン３は、その接合に当たり上記平滑面８
０の限られた小さい面積内に接合される。Further, the fin 3 has the smooth surface 8 when it is joined.
0 is bonded within a limited small area.
そのため、上記脚部３１は、接合に当たり、その位置決
めが困難となる。Therefore, it becomes difficult to position the leg portions 31 when joining them.
本発明は、上記従来の問題点に鑑みてなされたもので、
フィンの接着強度が大きく、またフィンの位置決めが容
易な、熱放散性に優れた電子部品搭載用基板を提供しよ
うとするものである。The present invention has been made in view of the above-mentioned conventional problems.
The present invention aims to provide a substrate for mounting electronic components, which has high adhesive strength of fins, allows easy positioning of the fins, and has excellent heat dissipation properties.
（課題の解決手段〕
本願における第１の発明は、基板に設けた凹所内に放熱
用金属板を配設してなり、該放熱用金属板の上面に設け
た凹部内にはフィンを接合してなることを特徴とする電
子部品搭載用基板にある。(Means for Solving the Problems) The first invention of the present application includes a heat dissipation metal plate disposed in a recess provided in a substrate, and a fin is bonded to the recess provided in the upper surface of the heat dissipation metal plate. A substrate for mounting electronic components is provided.
第１の発明において、上記凹所とは、上記放熱用金属板
を配設するために、上記基板の略中央部に設ける凹状溝
ないし貫通穴をいう。In the first invention, the recess refers to a concave groove or a through hole provided approximately at the center of the substrate for arranging the heat dissipating metal plate.
また、上記凹部とは、上記放熱用金属板の上面において
、上記フィンを接合するための凹状溝をいう、そして、
該凹部は、１つ又は２つ設けることか好ましい。また５
放熱用金属板は銅又はアルミニウムなどの良熱伝導体に
より構成する。また上記基板と放熱用金属板とは、その
上面が路間−であることが好ましい。ここにいう路間−
とは基板の上面と放熱用金属板の上面との隔差が２例え
ば３−以下であることをいう（第４図参照）。Further, the recessed portion refers to a recessed groove for joining the fin on the upper surface of the heat dissipation metal plate, and
Preferably, one or two recesses are provided. Also 5
The heat dissipation metal plate is made of a good heat conductor such as copper or aluminum. Further, it is preferable that the upper surfaces of the substrate and the heat dissipating metal plate are connected to each other. Roma referred to here-
This means that the difference in distance between the upper surface of the substrate and the upper surface of the heat dissipating metal plate is 2, for example, 3 or less (see FIG. 4).
また、第２の発明は、上記第１の発明において凹部がフ
ィンの下面と路間等の寸法形状を有することを特徴とす
る電子部品搭載用基板にある。フィンの下面は通常は凸
状である（実施例参照）。Further, a second invention resides in the electronic component mounting board according to the first invention, characterized in that the recess has a size and shape such as a gap between the lower surface of the fin and the groove. The underside of the fin is usually convex (see examples).
第２の発明において、上記フィンの下面と路間等の寸法
形状とは１例えば上記フィンの脚部の断面形状と、上記
放熱用金属板の上記凹部の開口形状とが略同形状である
ことを意味する。また、上記凹部を２以上設けた場合に
おいては、これに相応してフィンも上記凹部と路間等の
断面形状を有する脚部を有することになる。In the second aspect of the invention, the dimensions and shapes of the lower surface of the fin and the gap, etc., are defined as: 1. For example, the cross-sectional shape of the leg of the fin and the opening shape of the recess of the heat dissipation metal plate are approximately the same shape; means. Further, in the case where two or more of the recesses are provided, the fin will correspondingly have a leg portion having a cross-sectional shape between the recesses and the groove.
また、第３の発明は、第１の発明においてフィンが凹部
内に良熱伝導性接着剤を用い接着してなることを特徴と
する電子部品搭載用基板にある。Further, a third invention resides in the electronic component mounting board according to the first invention, characterized in that the fin is bonded within the recess using a highly heat conductive adhesive.
第３の発明において、上記良熱伝導性接着剤としては７
例えば半田ペースト、シリコン系接着剤等がある。In the third invention, the adhesive having good thermal conductivity is 7
Examples include solder paste, silicon adhesive, and the like.
また、第４の発明は、基板に設けた凹所内に放熱用金属
板を配設してなり、該放熱用金属板の上面にフィン取付
用の四部を設けたことを特徴とする電子部品搭載用基板
にある。Further, a fourth invention is an electronic component mounting device characterized in that a heat dissipation metal plate is disposed in a recess provided in a substrate, and four parts for attaching fins are provided on the upper surface of the heat dissipation metal plate. It is on the board for
第１の発明にかかる電子部品搭載用基板においては、放
熱用金属板の上面に設けた凹部内に、フィンを接合して
なる。そのため、フィンの脚部が増大し、該フィンの接
着強度が大きくなる。また。In the electronic component mounting board according to the first aspect of the invention, fins are bonded into the recesses provided on the upper surface of the heat dissipation metal plate. Therefore, the leg portion of the fin increases, and the adhesive strength of the fin increases. Also.
フィンを放熱用金属板に接合するに当たり、上記凹部内
にフィンの脚部を嵌合すればよいため、その位置決めが
容易となる。When joining the fins to the heat dissipation metal plate, the leg portions of the fins need only be fitted into the recesses, which facilitates their positioning.
したがって１本発明によれば、フィンの接着強度が大き
く、またフィンの位置決めが容易で接合部の熱伝導性が
良好な、熱放散性に優れた電子部品搭載用基板を提供す
ることができる。Therefore, according to the present invention, it is possible to provide an electronic component mounting board with high adhesive strength of the fins, easy positioning of the fins, good thermal conductivity of the joint portion, and excellent heat dissipation properties.
また、第２の発明においては、上記凹部は、フインの下
面と路間等の面積を存するため、フィンの接着強度が一
層向上すると共に、またフィンの位置決めがより一層容
易となる。Further, in the second invention, since the recess has an area between the lower surface of the fin and the groove, the adhesive strength of the fin is further improved, and the positioning of the fin is further facilitated.
また、第３の発明においては、フィンの接合に良熱伝導
性接着剤を用いるため、接合部において熱伝導性が良い
、そのため、該接合部を通じて放熱用金属板よりフィン
への熱伝導性が良くなり放熱性に優れることになる。In addition, in the third invention, since a good thermally conductive adhesive is used to join the fins, the joint part has good thermal conductivity.Therefore, the heat conductivity from the heat dissipation metal plate to the fins is higher through the joint part. This results in better heat dissipation.
また、第４の発明においては、放熱用金属板への フィ
ンの脚部の嵌合が容易である。Moreover, in the fourth invention, the legs of the fins can be easily fitted to the heat dissipation metal plate.
［実施例］
第１実施例
本例にかかる電子部品搭載用基板につき１第１図〜第４
図を用いて説明する。[Example] First Example: Figures 1 to 4 per electronic component mounting board according to this example.
This will be explained using figures.
即ち０本例の電子部品搭載用基板は、第１図に示すごと
く、基板ｌに設けた凹所１０内に放熱用金属板２を配設
してなり、該放熱用金属板２の上面に設けた凹部２０内
にフィン３を接合してなる。That is, as shown in FIG. 1, the electronic component mounting board of this example has a heat dissipating metal plate 2 disposed in a recess 10 provided in a board l, and a heat dissipating metal plate 2 is provided on the upper surface of the heat dissipating metal plate 2. The fin 3 is joined into the recess 20 provided.
また、上記凹部２０は、フィン３の脚部３１と路間等の
寸法形状を有する。Further, the recessed portion 20 has a size and shape that is similar to the leg portion 31 of the fin 3 and the groove.
また、上記凹部２０内には、フィン３の脚部３１が良熱
伝導性接着剤を用いて接合されている。Furthermore, the leg portions 31 of the fins 3 are bonded within the recessed portion 20 using a highly thermally conductive adhesive.
しかして１本例の電子部品搭載用基板は５次のようにし
て作成する。Thus, one example of a board for mounting electronic components is prepared in the following five steps.
まず、一定の大きさの銅張り積層板にスルーホール１１
用の穴を開ける。First, through holes 11 are made in a copper-clad laminate of a certain size.
Drill a hole for.
次に、上記積層板の所定の位置に、第２図に示すごとく
、凹所１０を設ける。該凹所ｌＯは、エンドミル等によ
るザグリ加工により形成する。そして、上記凹所１０内
の接着面２２等にエポキシ樹脂等の接着剤を塗布する。Next, a recess 10 is provided at a predetermined position in the laminate, as shown in FIG. The recess lO is formed by counterboring with an end mill or the like. Then, an adhesive such as epoxy resin is applied to the adhesive surface 22 and the like within the recess 10.
次いで、該凹所１０内に、銅製の放熱用金属板２を圧着
固定する。Next, a heat dissipating metal plate 2 made of copper is crimped and fixed in the recess 10.
次に、上記放熱用金属板２の上面において、該放熱用金
属板２の上面の約３分の２の面積を占める凹部２０を設
ける。該凹部２０は、後述のフィン３の脚部３１と路間
等の寸法形状を有する。Next, a recess 20 is provided on the upper surface of the heat dissipating metal plate 2, which occupies about two-thirds of the area of the upper surface of the heat dissipating metal plate 2. The recessed portion 20 has a size and shape that is similar to the leg portion 31 of the fin 3, which will be described later.
また、上記放熱用金属板２には、下面において。Moreover, on the bottom surface of the heat dissipation metal plate 2.
上記凹部２０よりもやや小さい凹部５０を設ける。A recess 50 slightly smaller than the recess 20 is provided.
該凹部５０は、後述の半導体チップ５を搭載するための
ものである。The recess 50 is for mounting a semiconductor chip 5, which will be described later.
次に、上記スルーホールｌｌ内及び所定のパターンの位
置に、導体回路１３を形成する。該導体回路１３は、ド
ライフィルムを用いてパターンメツキ、半田メツキ等を
行う、半田剥離法により形成する。そして、該導体回路
１３の表面には、該導体回路１３を保護するため、ソル
ダーレジスト膜１４を印刷塗布する。そして、該ソルダ
ーレジスト膜１４は、加熱又は光照射により熱硬化させ
る。Next, a conductor circuit 13 is formed in the through hole ll and at a predetermined pattern position. The conductor circuit 13 is formed by a solder peeling method in which pattern plating, solder plating, etc. are performed using a dry film. Then, a solder resist film 14 is printed and coated on the surface of the conductive circuit 13 in order to protect the conductive circuit 13. Then, the solder resist film 14 is thermally cured by heating or light irradiation.
次に、必要な所にニッケル（Ｎ ｉ ）又は金（ＡＵ）
メツキを施す。Next, add nickel (N i ) or gold (AU) where necessary.
Apply plating.
しかる後、該基板１を所定の大きさに切断し。After that, the substrate 1 is cut into a predetermined size.
第２図に示すごとく１個々の電子部品搭載用基板を得た
。As shown in FIG. 2, one individual electronic component mounting board was obtained.
また、上記スルーホールｌｌ内には、リードビン４を嵌
挿する。そして、必要に応じて５上記スルーホール１１
内において、半田により上記り−ドビン４をスルーホー
ル内壁１１０と接合する。Further, the lead bin 4 is inserted into the through hole ll. Then, if necessary, 5 above-mentioned through holes 11
Inside, the above-mentioned dobbin 4 is joined to the through-hole inner wall 110 by soldering.
このようにして作成された電子部品搭載用基板は、第１
図に示すごとく、上記凹部５０内に半導体チップ５を搭
載する。また、該半導伸子ノブ５の周辺部には金属キャ
ップ５２等を用いて封止する。The electronic component mounting board created in this way is
As shown in the figure, the semiconductor chip 5 is mounted in the recess 50. Further, the periphery of the semiconductor expansion knob 5 is sealed using a metal cap 52 or the like.
次いで、上記放熱用金属板２の上面に設けた凹所２０内
に、該凹所２０と路間等の寸法形状の脚部３１を有する
フィン３を接合する。該フィン３は１ｗ４又はアルミニ
ウムよりなり、上面に多数の冷却用の羽根３０を有する
。また、上記フィン３の脚部３１を接合するに当たり、
半田ペースト等の良熱伝導性接着剤を用いる。Next, a fin 3 having a leg portion 31 having a size and shape such as a gap between the recess 20 and the recess 20 is joined into the recess 20 provided on the upper surface of the heat dissipation metal plate 2. The fin 3 is made of 1W4 or aluminum and has a large number of cooling vanes 30 on its upper surface. In addition, when joining the leg portions 31 of the fin 3,
Use adhesive with good thermal conductivity such as solder paste.
また、上記放熱用金属板２は、上面の高さを上記基板１
の上に形成した導体回路１３の表面と実質的に路間−水
平面としている。その理由は次の通りである。Further, the height of the upper surface of the heat dissipating metal plate 2 is set to be lower than that of the substrate 1.
The surface of the conductor circuit 13 formed thereon is substantially a horizontal plane between the circuits. The reason is as follows.
即ち、第３図に示すごとく、基板１に上記半田剥離法に
より上記−金属回路１３等を形成するに当たり、ドライ
フィルム６を熱圧着する。このとき。That is, as shown in FIG. 3, when forming the metal circuit 13 and the like on the substrate 1 by the solder peeling method described above, the dry film 6 is thermocompression bonded. At this time.
上記凹所１０内に空気Ａが溜まる。そのため、上記ドラ
イフィルム６と基板１上に形成した上記導体回路１３の
表面との密着不良が発生する。また。Air A accumulates in the recess 10. Therefore, poor adhesion between the dry film 6 and the surface of the conductive circuit 13 formed on the substrate 1 occurs. Also.
これに起因して露光時に十分な真空吸引ができない。そ
のため、カブリ（ドライフィルムのパターン形成不良）
と称する現象が生じ易くなる。Due to this, sufficient vacuum suction cannot be achieved during exposure. As a result, fog (defective dry film pattern formation)
A phenomenon called .
ぞれ故、上記の問題点を解決するためには、第４図に示
すごとく、上記放熱用金属Ｆｉ２の上面２１と上記ソル
ダーレジスト膜１４の表面との階差ｔは、３ＩＩＩ１１
以下にすることが好ましい。Therefore, in order to solve the above problems, as shown in FIG.
It is preferable to do the following.
以下９本例の作用効果につき説明する。The effects of the nine examples will be explained below.
本例においては、放熱用金属板２の上面２１に設けた凹
部２０内に、フィン３の脚部３１を接合してなるため、
該フィン３の接着強度が大きくなる。また、フィン３を
放熱用金属板２に接合するに当たり、その位置決めが容
易となる。In this example, the legs 31 of the fins 3 are joined into the recesses 20 provided in the upper surface 21 of the heat dissipation metal plate 2.
The adhesive strength of the fins 3 increases. Furthermore, positioning of the fins 3 when joining them to the heat-radiating metal plate 2 becomes easy.
また、上記凹部２０は、フィン３の脚部３１と路間等の
寸法形状を有するため、フィン３の接合が一層向上する
と共に、フィン３の位置決めが一層容易となる。Further, since the recess 20 has a size and shape that is similar to the leg portion 31 of the fin 3, the bonding of the fin 3 is further improved and positioning of the fin 3 is further facilitated.
また、上記凹部２０内において、フィン３を上記半田ペ
ーストを用いて接合しているため、接合の信頼性が向上
すると共に、放熱用金属板２からフィン３への熱伝導性
も向上する。Furthermore, since the fins 3 are bonded within the recess 20 using the solder paste, the reliability of the bond is improved and the thermal conductivity from the heat dissipating metal plate 2 to the fins 3 is also improved.
また、上記凹部２０は、放熱用金属板２を凹所ｌＯに接
合する前に、予め形成しておくこともできる。このよう
にすれば、咳凹部２０の寸法精度が向上する。また、半
導体チップ５を搭載する凹部５０を予め形成した放熱用
金属板２を用いる場合も、同様に精度が良くなる。Further, the recess 20 can be formed in advance before the heat dissipation metal plate 2 is joined to the recess 1O. In this way, the dimensional accuracy of the cough recess 20 is improved. Furthermore, when using the heat dissipation metal plate 2 in which the recess 50 on which the semiconductor chip 5 is mounted is used, the accuracy is similarly improved.
したがって５本例によれば、フィン３の接着強度が大き
く、またフィン３の位置決めが容易で接合部の熱伝導性
が良好な熱放散性に優れた電子部品搭載用基板を得るこ
とができる。Therefore, according to the five examples, it is possible to obtain an electronic component mounting board that has high adhesive strength of the fins 3, easy positioning of the fins 3, good thermal conductivity of the joint portion, and excellent heat dissipation.
第２実施例
本例にかかる電子部品搭載用基板につき、第５図及び第
６図を用いて説明する。Second Embodiment An electronic component mounting board according to this embodiment will be explained with reference to FIGS. 5 and 6.
即ち１本例の電子部品搭載用基板は、第５図に示すごと
く、上記第１実施例におけるフィン３に代えて、２本の
脚部３２１，３２２を有するフィン３２を用いたもので
ある。その他の構成は２上記第１実施例と同様とした。That is, as shown in FIG. 5, this electronic component mounting board uses a fin 32 having two legs 321 and 322 in place of the fin 3 in the first embodiment. The other configurations were the same as those in the first embodiment described above.
即ち２本例の電子部品搭載用基板は、まず第６図に示す
ごとく、２つの凹部２５０，２５１を有する放熱用金属
板２５を、基板ｌの略中央部に設けた凹所１０内に接合
面２５２を介して接合する。That is, in the two examples of electronic component mounting boards, first, as shown in FIG. 6, a heat dissipating metal plate 25 having two recesses 250 and 251 is bonded into a recess 10 provided approximately at the center of the board l. They are joined via the surface 252.
次に、第５図に示すごとく、上記凹部２５０２５１内に
、フィン３２の２本の脚部３２１，３２２を半田ペース
トを用いて接合する。Next, as shown in FIG. 5, the two legs 321 and 322 of the fin 32 are joined into the recess 250251 using solder paste.
しかして１本例によれば、２ケ所の凹部においてフィン
の接合を行うので上記第１実施例と同様の効果が得られ
る外、−層接着強度が大きく、かつ接合時の位置決めが
容易な、電子部品搭載用基板を得ることができる。According to this example, since the fins are joined at two concave portions, the same effects as in the first embodiment described above can be obtained. A substrate for mounting electronic components can be obtained.
第１図〜第４図は第１実施例の電子部品搭載用基板を示
し、第１図はその断面図、第２図は基板に放熱用金属板
を接合した状態の側面図、第３図及び第４図は放熱用金
属板の取付は状態の説明図。
第５図及び第６図は第２実施例の電子部品搭載用基板を
示し、第５図はその断面図、第６図は基板に放熱用金属
板を接合した状態の側面図、第７図は従来の電子部品搭
載用基板の断面図を示す。
１０１．基板
１０、、、凹所。
１３、、、導体回路。
２．２５．、、放熱用金属板
２０ ２５０．２５１．、、凹部
３．３２．、、フィン
３４．３２１，３２２゜
５６１、半導体チップ
フィンの脚部1 to 4 show the electronic component mounting board of the first embodiment, FIG. 1 is a cross-sectional view thereof, FIG. 2 is a side view of a state in which a heat dissipation metal plate is bonded to the board, and FIG. 3 and FIG. 4 is an explanatory diagram of the state in which the heat dissipation metal plate is installed. 5 and 6 show a substrate for mounting electronic components according to the second embodiment, FIG. 5 is a cross-sectional view thereof, FIG. 6 is a side view of a state in which a heat dissipation metal plate is bonded to the substrate, and FIG. 7 shows a cross-sectional view of a conventional electronic component mounting board. 101. Substrate 10, recess. 13. Conductor circuit. 2.25. ,, Heat dissipation metal plate 20 250.251. ,, recess 3.32. ,,Fin34.321,322゜561,Semiconductor chip fin leg
Claims (4)
り，該放熱用金属板の上面に設けた凹部内にはフィンを
接合してなることを特徴とする電子部品搭載用基板。(1) For mounting electronic components, characterized in that a metal plate for heat dissipation is arranged in a recess provided in a substrate, and a fin is bonded in the recess provided on the upper surface of the metal plate for heat dissipation. substrate.
フィンの下面と略同等の寸法形状を有することを特徴と
する電子部品搭載用基板。(2) The electronic component mounting board according to claim 1, wherein the recessed portion of the heat dissipating metal plate has a size and shape that is substantially the same as a lower surface of the fin.
性接着剤を用いて接合してなることを特徴とする電子部
品搭載用基板。(3) The electronic component mounting board according to claim 1, wherein the fins are bonded within the recesses using a highly thermally conductive adhesive.
り，該放熱用金属板の上面にフィン取付用の凹部を設け
たことを特徴とする電子部品搭載用基板。(4) A board for mounting electronic components, characterized in that a metal plate for heat dissipation is disposed in a recess provided in the board, and a recess for attaching a fin is provided on the upper surface of the metal plate for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1147821A JP2795280B2 (en) | 1989-06-09 | 1989-06-09 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1147821A JP2795280B2 (en) | 1989-06-09 | 1989-06-09 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0311787A true JPH0311787A (en) | 1991-01-21 |
| JP2795280B2 JP2795280B2 (en) | 1998-09-10 |
Family
ID=15438992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1147821A Expired - Lifetime JP2795280B2 (en) | 1989-06-09 | 1989-06-09 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2795280B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1027978A (en) * | 1996-07-09 | 1998-01-27 | Nec Corp | Electronic component cooling structure |
| JP2022025833A (en) * | 2020-07-30 | 2022-02-10 | 日本特殊陶業株式会社 | Semiconductor package and semiconductor package array |
| CN115209611A (en) * | 2022-07-13 | 2022-10-18 | 江西福昌发电路科技有限公司 | Circuit board with copper blocks embedded and manufacturing process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6239039A (en) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | Chip carrier for electronic device |
| JPS6252991A (en) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | Chip carrier for electronic element |
-
1989
- 1989-06-09 JP JP1147821A patent/JP2795280B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6239039A (en) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | Chip carrier for electronic device |
| JPS6252991A (en) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | Chip carrier for electronic element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1027978A (en) * | 1996-07-09 | 1998-01-27 | Nec Corp | Electronic component cooling structure |
| JP2022025833A (en) * | 2020-07-30 | 2022-02-10 | 日本特殊陶業株式会社 | Semiconductor package and semiconductor package array |
| CN115209611A (en) * | 2022-07-13 | 2022-10-18 | 江西福昌发电路科技有限公司 | Circuit board with copper blocks embedded and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2795280B2 (en) | 1998-09-10 |
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