JPH03117902A - Method and device for coating electronic parts with conductive paste - Google Patents
Method and device for coating electronic parts with conductive pasteInfo
- Publication number
- JPH03117902A JPH03117902A JP1256017A JP25601789A JPH03117902A JP H03117902 A JPH03117902 A JP H03117902A JP 1256017 A JP1256017 A JP 1256017A JP 25601789 A JP25601789 A JP 25601789A JP H03117902 A JPH03117902 A JP H03117902A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- hole
- holes
- electronic component
- dielectric filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 239000011248 coating agent Substances 0.000 title description 2
- 238000000576 coating method Methods 0.000 title description 2
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は電子部品の製造方法及びその装置に関し、特に
、その貫通孔に導電ペーストを塗布する電子部品の導電
ペースト塗布方法及びその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for manufacturing electronic components, and more particularly to a method for applying conductive paste to electronic components and an apparatus for applying conductive paste to through holes thereof.
〔従来の技術］
従来、例えば誘電体フィルター等の電子部品の製造方法
にあっては、誘電材に形成した共振孔に電極を形成する
方法として、リーマ、ドリル、あるいはブラシ等を使用
してその１！ｊ通孔の内周表面に導電ペーストを塗布す
ることが行われて−）た。[Prior Art] Conventionally, in the manufacturing method of electronic components such as dielectric filters, electrodes are formed in resonance holes formed in a dielectric material by using a reamer, drill, brush, etc. 1! A conductive paste was applied to the inner peripheral surface of the through hole.
［発明が解決しようとする課題］
しかしながら、上記の従来技術による製造方法及び装置
では、リーマ、ドリル、ブラシ等を使用して貫通孔の内
周表面に導電ペーストを塗布しようとする場合、内周面
全体に均一に塗布することは難しく、その一部が途切れ
てしまう、いわゆるカスレ現象が発生してしまう。この
現象を防止するため、導電ペーストを複数回塗布する作
業等が行われているが、これでもなお形成される導電電
極の膜厚が不安定かつ不均一であり、その生産性、特に
製品の歩留りが低いという問題点を有していた。[Problems to be Solved by the Invention] However, in the manufacturing method and apparatus according to the above-mentioned prior art, when applying conductive paste to the inner peripheral surface of the through hole using a reamer, drill, brush, etc. It is difficult to apply it uniformly to the entire surface, and a so-called smearing phenomenon occurs where a portion of the surface is cut off. In order to prevent this phenomenon, methods such as applying conductive paste multiple times are being carried out, but even with this method, the thickness of the conductive electrode formed is unstable and uneven, and the productivity is affected, especially the product quality. The problem was that the yield was low.
そこで本発明は、上記の従来技術における問題点に鑑み
、表面に少なくとも一の貫通孔を形成した電子部品の上
記貫通孔の内周面に導電ペーストを安定かつ均一に塗布
することが出来、さらに、その生産性にも優れた電子部
品の導電ペースト塗布方法及び装置をを提供することに
ある。In view of the problems in the prior art described above, the present invention makes it possible to stably and uniformly apply a conductive paste to the inner circumferential surface of the through hole of an electronic component having at least one through hole formed on the surface thereof. It is an object of the present invention to provide a method and apparatus for applying conductive paste for electronic components, which is also excellent in productivity.
［課題を解決するための手段］
すなわち、上記目的を達成するため、本発明では、まず
第一に、表面に少なくとも一の貫通孔を形成した電子部
品の上記貫通孔の内周面に導電ペーストを塗布する電子
部品の導電ペースト塗布方法において、上記貫通孔の一
方の端部付近に導電ペーストを所定１だけ注入し、その
後、上記貫通孔の他方の端部から真空ポンプにて吸引す
ることによって上記導電ペーストを上記貫通孔の内周面
に塗布する電子部品の導電ペースト塗布方法と提供する
。[Means for Solving the Problems] That is, in order to achieve the above object, the present invention first provides a method of applying a conductive paste to the inner peripheral surface of the through hole of an electronic component having at least one through hole formed on the surface. In the method for applying conductive paste for electronic components, a predetermined amount of conductive paste is injected near one end of the through hole, and then suctioned from the other end of the through hole with a vacuum pump. A method for applying a conductive paste for an electronic component is provided, in which the conductive paste is applied to the inner circumferential surface of the through hole.
第二に、表面に少なくとも一の貫通孔を形成した電子部
品を保持する電子部品保持手段と、上記電子部品の上記
貫通孔の一方の端部付近に所定■の導電ペーストを注入
する導電ペースト注入手段と、上記電子部品保持手段に
取り付けられ、上記電子部品の上記導電ペースト注入側
とは反対の端部から吸引する真空吸引手段とを備える電
子部品の導電ペースト塗布装置を提供する。Second, an electronic component holding means for holding an electronic component having at least one through hole formed on its surface, and a conductive paste injection for injecting a predetermined conductive paste into the vicinity of one end of the through hole of the electronic component. and a vacuum suction means attached to the electronic component holding means and sucking from an end of the electronic component opposite to the conductive paste injection side.
［作 用コ
すなわち、上記の電子部品の導電ペースト塗布方法及び
その装置によれば、表面に少なくとも一の貫通孔を形成
した電子部品の上記貫通孔の一方の端部に導電ペースト
を所定■だけ注入した後、上記貫通孔の他方の端部から
真空ポンプにて吸引することにより、上記導電ペースト
が上記貫通孔の内周面に付着する。この手段では、多数
の貫通孔であっても、これらに導電ペーストを何れも均
一な膜厚に安定して同時に塗布することが出来、その作
業も簡略化され、自動化に適し、生産性に優れる。[Function] That is, according to the method and apparatus for applying conductive paste to an electronic component described above, a predetermined amount of conductive paste is applied to one end of the through hole of an electronic component having at least one through hole formed on the surface. After being injected, the conductive paste adheres to the inner circumferential surface of the through hole by suction from the other end of the through hole using a vacuum pump. With this method, even if there are a large number of through-holes, conductive paste can be applied to all of them at the same time in a stable manner with a uniform thickness, and the work is simplified, suitable for automation, and has excellent productivity. .
［実 施 例］
以下、本発明の実施例について、添付の図面を参照しな
がら説明する。[Examples] Examples of the present invention will be described below with reference to the accompanying drawings.
第１図には、本考案の実施例による電子部品の導電ペー
スト塗布方法を実施するための装置の概略が示されてい
る。図において、例えば誘電セラミック等を所定の形状
に形成した誘電体フィルター素地１が、ソケット状の保
持部２の中央部に形成した四部３の中に挿入され得る様
になっている。この誘電体フィルター素地ｌは、添付の
第２図（ａ）及び（ｂ）にも示す様に、角柱状あるいは
断面１６円の円柱状に形成され、その断面の中央部には
例えば２個の貫通孔４．４が形成され、この２個の貫通
孔４．４の内周面に電極を形成する。この貫通孔４．４
は、例えば５市φ程度の径となっている。FIG. 1 schematically shows an apparatus for carrying out a method of applying conductive paste to electronic components according to an embodiment of the present invention. In the figure, a dielectric filter base 1 made of, for example, dielectric ceramic and formed into a predetermined shape can be inserted into four parts 3 formed at the center of a socket-shaped holding part 2. As shown in the attached FIGS. 2(a) and (b), this dielectric filter base l is formed into a prismatic shape or a cylindrical shape with a cross section of 16 circles, and there are, for example, two pieces in the center of the cross section. Through holes 4.4 are formed, and electrodes are formed on the inner peripheral surfaces of these two through holes 4.4. This through hole 4.4
has a diameter of, for example, about 5 cities φ.
一方、上記保持部２は、第１図の断面部分にも示される
様に、上記凹部３とその下部の真空室５は仕切壁６で仕
切られている。この仕切壁６には、上記誘電体フィルタ
ー素地ｌに形成された２個の貫通孔４．４に対応した位
置に、いわゆる吸入孔７．７が形成されている。また、
上記真空室５の壁面の一部には真空導入孔８が形成され
、この真空導入孔８は、例えば配管用チューブ９を介し
て真空ポンプ（ＶＰ）１０に接続される。また、上記真
空導入孔８と真空ポンプ（ＶＰ）１０との間には開閉用
のバルブ１１が設けられている。On the other hand, in the holding section 2, as shown in the cross section of FIG. This partition wall 6 has so-called suction holes 7.7 formed at positions corresponding to the two through holes 4.4 formed in the dielectric filter base l. Also,
A vacuum introduction hole 8 is formed in a part of the wall surface of the vacuum chamber 5, and the vacuum introduction hole 8 is connected to a vacuum pump (VP) 10 via, for example, a piping tube 9. Further, an opening/closing valve 11 is provided between the vacuum introduction hole 8 and the vacuum pump (VP) 10.
一方、上記保持部２の上方には、二股に形成された導電
ペーストのデイスペンサーニードル１２が配置されてお
り、このデイスペンサーニードル１２はその先端の孔か
ら一定■の導電ペーストを注出することが出来るもので
ある。また、図の中の符号１３は、上記真空室５の底部
に溜まった蓄積ペーストを示している。On the other hand, above the holding part 2, a bifurcated conductive paste dispenser needle 12 is arranged, and this dispenser needle 12 pours out a certain amount of conductive paste from a hole at its tip. This is something that can be done. Further, the reference numeral 13 in the figure indicates the accumulated paste accumulated at the bottom of the vacuum chamber 5.
次に、上記電子部品の専電ペースト塗布装はの動作につ
いて、以下に、第３図（ａ）及び（ｂ）を参照しながら
説明する。Next, the operation of the above-mentioned electric paste application equipment for electronic components will be explained below with reference to FIGS. 3(a) and 3(b).
まず、第３図（ａ）には、上記保持部２の凹部３の中に
、＃電ペーストをその貫通孔４．４に塗布すべき誘電体
フィルター素地ｉｆｊ：挿入する。それから、上記デイ
スペンサーニードル１２を誘電体フィルター素地ｌの表
面上に移動して上記貫通孔４．４の真上に配置し、その
先端から一定量の導電ペース１−１３．１３を上記貫通
孔４．４の上方端部付近に注入する。その後、開閉用の
パルプ１１を一定時間だけ開いて上記貫通孔４．４の他
方（下方）の端部から真空ポンプｌＯにより吸引する。First, as shown in FIG. 3(a), the dielectric filter base material ifj: to be coated with #electrical paste in the through hole 4.4 is inserted into the recess 3 of the holding portion 2. Then, the dispenser needle 12 is moved onto the surface of the dielectric filter base l and placed directly above the through hole 4.4, and a certain amount of conductive paste 1-13.13 is applied from its tip to the through hole. 4. Inject near the upper end of 4. Thereafter, the opening/closing pulp 11 is opened for a certain period of time and suction is applied from the other (lower) end of the through hole 4.4 by the vacuum pump IO.
この吸引作用により、第３図（ｂ）に示す様に、上記貫
通孔４．４内には矢印で示す方向に空気が流れようとし
、これに伴って、上記貫通孔４．４の上方端部付近に注
入された上記導電ベース）１３．１３は、上記貫通孔４
．４の内周面に、同時にかつ一瞬にして、むらなく塗布
される。また、上記デイスペンサーニードル１２から注
入される導電ペースト１２のユを正確に管理することに
より、均一でかつ安定な膜厚の導電ペースト膜１４を容
易に形成することが可能になる。Due to this suction action, as shown in FIG. 3(b), air tends to flow into the through hole 4.4 in the direction shown by the arrow, and along with this, the upper end of the through hole 4.4 The conductive base (13.13) injected near the through hole 4
．． It is applied evenly to the inner circumferential surfaces of 4 at the same time and instantaneously. Furthermore, by accurately controlling the volume of the conductive paste 12 injected from the dispenser needle 12, it becomes possible to easily form the conductive paste film 14 with a uniform and stable thickness.
また、上記の実施例では、上記誘電体フィルター素地１
の表面に形成された貫通孔４．４は２個として説明した
が、本発明による導電ペースト塗布方法及び装置によれ
ば、それ以上の数の貫通孔４．４・・・についても、同
時に一度で、その内周面に導電ペーストを塗布すること
ができる。そして、何れの貫通孔４．４・・・も同じ条
件で導電ペーストが塗布されるため、形成された導電ペ
ースト膜１４は、何れも均一な膜厚を存する。Further, in the above embodiment, the dielectric filter base 1
Although the explanation has been made assuming that two through holes 4.4 are formed on the surface of Then, a conductive paste can be applied to the inner peripheral surface. Since the conductive paste is applied to all the through holes 4, 4 under the same conditions, the formed conductive paste film 14 has a uniform thickness.
さらに、上記の説明では、上記貫通孔４．４は断面円形
のもののみを示したが、本発明はこれだけに限られず、
例えば三角形や四角形等の断面形状を存する貫通孔にも
容易に適用することが可能である。Furthermore, in the above description, only the through hole 4.4 having a circular cross section was shown, but the present invention is not limited to this.
For example, it can be easily applied to a through hole having a triangular or quadrangular cross-sectional shape.
［発明の効果］
以上の説明からも明らかなように、本発明による電子部
品の導電ペースト塗布方法及び装置によれば、塗布膜厚
の均一化による製品の品質の安定化と、自動化による生
産性の向上が図れるという効果が得られる。[Effects of the Invention] As is clear from the above explanation, the method and apparatus for applying conductive paste for electronic components according to the present invention stabilize product quality by making the coating film thickness uniform, and improve productivity by automation. This has the effect of improving the performance.
第１図は本考案の実施例による電子部品の導電ペースト
塗布方法の実施装置の概略図、第２図（ａ）及び（ｂ）
は、上記導電ペースト塗布方法及び装置により導電ペー
ストを塗布する誘電体フィルター素地構造の例を示す斜
視図、そして、第３図は上記装置の導電ペースト塗布動
作を示すための説明断面図である。
■・・・誘電体フィルター素地 ２・・・保持部 ３・
・・凹部 ４・・・貫通孔 ５・・・真空室 ６・・・
仕切壁７・・・吸入孔 ８・・・真空導入孔 ９・・・
配管用チューブ １０・・・真空ポンプ １１・・・バ
ルブ １２・・・デイスペンサーニードル １３・・・
導電ペースト
■
４・・・導電ペースト膜Figure 1 is a schematic diagram of an apparatus for implementing a method of applying conductive paste to electronic components according to an embodiment of the present invention, and Figures 2 (a) and (b)
3 is a perspective view showing an example of a dielectric filter base structure to which a conductive paste is applied by the above-mentioned conductive paste application method and apparatus, and FIG. 3 is an explanatory cross-sectional view showing the conductive paste application operation of the above-mentioned apparatus. ■...Dielectric filter base 2...Holding part 3.
...Recessed portion 4...Through hole 5...Vacuum chamber 6...
Partition wall 7...Suction hole 8...Vacuum introduction hole 9...
Piping tube 10...Vacuum pump 11...Valve 12...Dispenser needle 13...
Conductive paste ■ 4... Conductive paste film
Claims (2)
の上記貫通孔の内周面に導電ペーストを塗布する電子部
品の導電ペースト塗布方法において、上記貫通孔の一方
の端部付近に導電ペーストを所定量だけ注入し、その後
、上記貫通孔の他方の端部から真空ポンプにて吸引する
ことによって上記導電ペーストを上記貫通孔の内周面に
塗布することを特徴とする電子部品の導電ペースト塗布
方法。(1) In a method for applying a conductive paste for an electronic component, the conductive paste is applied to the inner peripheral surface of the through hole of an electronic component having at least one through hole formed on the surface, the conductive paste is applied near one end of the through hole. A conductive paste for an electronic component, characterized in that the conductive paste is applied to the inner peripheral surface of the through hole by injecting a predetermined amount of the conductive paste and then sucking it from the other end of the through hole with a vacuum pump. Application method.
を保持する電子部品保持手段と、上記電子部品の上記貫
通孔の一方の端部付近に所定量の導電ペーストを注入す
る導電ペースト注入手段と、上記電子部品保持手段に取
り付けられ、上記電子部品の上記導電ペースト注入側と
は反対の端部から吸引する真空吸引手段とを備えること
を特徴とする電子部品の導電ペースト塗布装置。(2) electronic component holding means for holding an electronic component having at least one through hole formed on its surface; and conductive paste injection means for injecting a predetermined amount of conductive paste into the vicinity of one end of the through hole of the electronic component. and a vacuum suction means that is attached to the electronic component holding means and sucks from an end of the electronic component opposite to the side where the conductive paste is injected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1256017A JPH06101645B2 (en) | 1989-09-30 | 1989-09-30 | Method and apparatus for applying conductive paste to electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1256017A JPH06101645B2 (en) | 1989-09-30 | 1989-09-30 | Method and apparatus for applying conductive paste to electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03117902A true JPH03117902A (en) | 1991-05-20 |
| JPH06101645B2 JPH06101645B2 (en) | 1994-12-12 |
Family
ID=17286754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1256017A Expired - Fee Related JPH06101645B2 (en) | 1989-09-30 | 1989-09-30 | Method and apparatus for applying conductive paste to electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06101645B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5630272A (en) * | 1994-11-02 | 1997-05-20 | Lpkf Cad/Cam Systeme Gmbh | Method of forming contacts through bores in multi-layer circuit boards |
| WO2003099460A1 (en) * | 2002-05-28 | 2003-12-04 | Emilsson Haakan | An apparatus and a method for applying a liquid onto surfaces within internal cavities in an object |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939932A (en) * | 1972-08-26 | 1974-04-15 | ||
| JPS4976244U (en) * | 1972-10-23 | 1974-07-02 | ||
| JPS4972656A (en) * | 1972-11-17 | 1974-07-13 | ||
| JPS52380A (en) * | 1975-06-20 | 1977-01-05 | Nippon Electric Co | Device for making wiring circuit |
| JPS6053097A (en) * | 1983-09-01 | 1985-03-26 | 松下電器産業株式会社 | Method of forming conductor in through hole |
| JPS6175505A (en) * | 1984-09-21 | 1986-04-17 | 日本電気株式会社 | Manufacture of element for type variable resistor |
| JPS62130768A (en) * | 1985-12-02 | 1987-06-13 | Rohm Co Ltd | Inspecting method for application of paste |
| JPS6421770U (en) * | 1987-07-27 | 1989-02-03 |
-
1989
- 1989-09-30 JP JP1256017A patent/JPH06101645B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939932A (en) * | 1972-08-26 | 1974-04-15 | ||
| JPS4976244U (en) * | 1972-10-23 | 1974-07-02 | ||
| JPS4972656A (en) * | 1972-11-17 | 1974-07-13 | ||
| JPS52380A (en) * | 1975-06-20 | 1977-01-05 | Nippon Electric Co | Device for making wiring circuit |
| JPS6053097A (en) * | 1983-09-01 | 1985-03-26 | 松下電器産業株式会社 | Method of forming conductor in through hole |
| JPS6175505A (en) * | 1984-09-21 | 1986-04-17 | 日本電気株式会社 | Manufacture of element for type variable resistor |
| JPS62130768A (en) * | 1985-12-02 | 1987-06-13 | Rohm Co Ltd | Inspecting method for application of paste |
| JPS6421770U (en) * | 1987-07-27 | 1989-02-03 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5630272A (en) * | 1994-11-02 | 1997-05-20 | Lpkf Cad/Cam Systeme Gmbh | Method of forming contacts through bores in multi-layer circuit boards |
| WO2003099460A1 (en) * | 2002-05-28 | 2003-12-04 | Emilsson Haakan | An apparatus and a method for applying a liquid onto surfaces within internal cavities in an object |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06101645B2 (en) | 1994-12-12 |
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