JPH03120068U - - Google Patents

Info

Publication number
JPH03120068U
JPH03120068U JP2896290U JP2896290U JPH03120068U JP H03120068 U JPH03120068 U JP H03120068U JP 2896290 U JP2896290 U JP 2896290U JP 2896290 U JP2896290 U JP 2896290U JP H03120068 U JPH03120068 U JP H03120068U
Authority
JP
Japan
Prior art keywords
mounting plate
boards
terminals
wiring structure
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2896290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2896290U priority Critical patent/JPH03120068U/ja
Publication of JPH03120068U publication Critical patent/JPH03120068U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/932Plan-view shape, i.e. in top view
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Combinations Of Printed Boards (AREA)
JP2896290U 1990-03-20 1990-03-20 Pending JPH03120068U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2896290U JPH03120068U (cs) 1990-03-20 1990-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2896290U JPH03120068U (cs) 1990-03-20 1990-03-20

Publications (1)

Publication Number Publication Date
JPH03120068U true JPH03120068U (cs) 1991-12-10

Family

ID=31531746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2896290U Pending JPH03120068U (cs) 1990-03-20 1990-03-20

Country Status (1)

Country Link
JP (1) JPH03120068U (cs)

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