JPH03124475U - - Google Patents
Info
- Publication number
- JPH03124475U JPH03124475U JP3304890U JP3304890U JPH03124475U JP H03124475 U JPH03124475 U JP H03124475U JP 3304890 U JP3304890 U JP 3304890U JP 3304890 U JP3304890 U JP 3304890U JP H03124475 U JPH03124475 U JP H03124475U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- integrated circuit
- hybrid integrated
- bent
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例の斜視図、同図ｂ
は縦面図、第２図ａは本考案の他の実施例の斜視
図、同図ｂは縦面図である。
１，２……混成集積回路基板、３ａ……真直な
リード端子、３ｂ……曲げられたリード端子、４
……半田溜。
Figure 1a is a perspective view of an embodiment of the present invention, Figure 1b
2 is a longitudinal view, FIG. 2a is a perspective view of another embodiment of the present invention, and FIG. 2b is a longitudinal view. 1, 2... Hybrid integrated circuit board, 3a... Straight lead terminal, 3b... Bent lead terminal, 4
... Handa Tame.
Claims (1)
記リード端子の折曲げがなされている混成集積回
路装置において、前記リード端子の折曲げ後に半
田めつきが施され、前記リード端子の折曲げ部に
半田溜が形成さていることを特徴とする混成集積
回路装置。 In a hybrid integrated circuit device in which the lead terminals are bent after the lead terminals are attached to the hybrid integrated circuit board, solder plating is applied after the lead terminals are bent, and solder is applied to the bent portions of the lead terminals. A hybrid integrated circuit device characterized in that a reservoir is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3304890U JPH03124475U (en) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3304890U JPH03124475U (en) | 1990-03-29 | 1990-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124475U true JPH03124475U (en) | 1991-12-17 |
Family
ID=31536401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3304890U Pending JPH03124475U (en) | 1990-03-29 | 1990-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124475U (en) |
-
1990
- 1990-03-29 JP JP3304890U patent/JPH03124475U/ja active Pending