JPH03128936U - - Google Patents
Info
- Publication number
- JPH03128936U JPH03128936U JP1990402342U JP40234290U JPH03128936U JP H03128936 U JPH03128936 U JP H03128936U JP 1990402342 U JP1990402342 U JP 1990402342U JP 40234290 U JP40234290 U JP 40234290U JP H03128936 U JPH03128936 U JP H03128936U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990402342U JPH03128936U (mo) | 1990-12-27 | 1990-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990402342U JPH03128936U (mo) | 1990-12-27 | 1990-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128936U true JPH03128936U (mo) | 1991-12-25 |
Family
ID=31699965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990402342U Pending JPH03128936U (mo) | 1990-12-27 | 1990-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128936U (mo) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105970A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Assembling method for semiconductor device |
| JPS53123078A (en) * | 1977-04-01 | 1978-10-27 | Nec Corp | Integrated circuit device |
| JPS57153442A (en) * | 1981-02-20 | 1982-09-22 | Siemens Ag | Semiconductor device |
-
1990
- 1990-12-27 JP JP1990402342U patent/JPH03128936U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105970A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Assembling method for semiconductor device |
| JPS53123078A (en) * | 1977-04-01 | 1978-10-27 | Nec Corp | Integrated circuit device |
| JPS57153442A (en) * | 1981-02-20 | 1982-09-22 | Siemens Ag | Semiconductor device |