JPH03128943U - - Google Patents
Info
- Publication number
- JPH03128943U JPH03128943U JP1990037903U JP3790390U JPH03128943U JP H03128943 U JPH03128943 U JP H03128943U JP 1990037903 U JP1990037903 U JP 1990037903U JP 3790390 U JP3790390 U JP 3790390U JP H03128943 U JPH03128943 U JP H03128943U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding jig
- holding
- semiconductor wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990037903U JPH03128943U (2) | 1990-04-09 | 1990-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990037903U JPH03128943U (2) | 1990-04-09 | 1990-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128943U true JPH03128943U (2) | 1991-12-25 |
Family
ID=31545429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990037903U Pending JPH03128943U (2) | 1990-04-09 | 1990-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128943U (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319613A (ja) * | 2001-04-23 | 2002-10-31 | Topcon Corp | ウェーハ保持装置 |
| JP2004134725A (ja) * | 2002-08-09 | 2004-04-30 | Fuji Electric Device Technology Co Ltd | 半導体ウエハ保持治具および半導体素子の製造方法 |
| JP2006228883A (ja) * | 2005-02-16 | 2006-08-31 | Bridgestone Corp | サセプタ |
| JPWO2013039080A1 (ja) * | 2011-09-16 | 2015-03-26 | 住友重機械工業株式会社 | 基板製造装置 |
-
1990
- 1990-04-09 JP JP1990037903U patent/JPH03128943U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319613A (ja) * | 2001-04-23 | 2002-10-31 | Topcon Corp | ウェーハ保持装置 |
| JP2004134725A (ja) * | 2002-08-09 | 2004-04-30 | Fuji Electric Device Technology Co Ltd | 半導体ウエハ保持治具および半導体素子の製造方法 |
| JP2006228883A (ja) * | 2005-02-16 | 2006-08-31 | Bridgestone Corp | サセプタ |
| JPWO2013039080A1 (ja) * | 2011-09-16 | 2015-03-26 | 住友重機械工業株式会社 | 基板製造装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6410343U (2) | ||
| JPH0412647U (2) | ||
| JPH0485731U (2) | ||
| JPH0368985U (2) | ||
| JPH01161334U (2) | ||
| JPS6177187U (2) | ||
| JPS62166625U (2) | ||
| JPH0193735U (2) | ||
| JPS6169824U (2) | ||
| JPH0326439U (2) | ||
| JPS60100748U (ja) | フオトレジスト塗布装置 | |
| JPS63174446U (2) | ||
| JPH0265341U (2) | ||
| JPH01109390U (2) | ||
| JPS6333630U (2) | ||
| JPH01156835U (2) | ||
| JPS6127339U (ja) | 半導体基板のチヤツク機構 | |
| JPH0423140U (2) | ||
| JPH0487629U (2) | ||
| JPS6455553U (2) | ||
| JPH0357439U (2) | ||
| JPH0350786U (2) | ||
| JPH01146535U (2) | ||
| JPS6118860U (ja) | 半導体ウエ−ハのレ−ザ刻印装置 | |
| JPS6278745U (2) |