JPH03128982U - - Google Patents
Info
- Publication number
- JPH03128982U JPH03128982U JP3700190U JP3700190U JPH03128982U JP H03128982 U JPH03128982 U JP H03128982U JP 3700190 U JP3700190 U JP 3700190U JP 3700190 U JP3700190 U JP 3700190U JP H03128982 U JPH03128982 U JP H03128982U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- housing
- boss
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例によるハウジングと
プリント基板を示す取付前の斜視図、第２図ａは
その平面図、第２図ｂはその縦断面図、第３図ａ
はボスを熱かしめした後の正面図、第３図ｂはそ
の縦断面図、第４図は従来のプリント基板をハウ
ジング内に取付ける状態を示す斜視図、第５図は
従来のプリント基板固定時の他の例を示す斜視図
、第６図ａは従来のプリント基板固定時のハウジ
ングとプリント基板を示す平面図、第６図ｂはそ
の縦断面図、第６図ｃは固定後の正面図、第６図
ｄは正しく取付けられなかつた状態を示す断面図
である。
１１……プリント基板、１２……切欠き、１３
……ハウジング、１４……ボス。
Fig. 1 is a perspective view showing a housing and a printed circuit board according to an embodiment of the present invention before installation, Fig. 2a is a plan view thereof, Fig. 2b is a longitudinal sectional view thereof, and Fig. 3a is
is a front view of the boss after it has been heat caulked, Figure 3b is its vertical cross-sectional view, Figure 4 is a perspective view showing the conventional printed circuit board installed in the housing, and Figure 5 is the conventional printed circuit board when it is fixed. FIG. 6a is a plan view showing the housing and the printed circuit board when the conventional printed circuit board is fixed, FIG. 6 b is a vertical sectional view thereof, and FIG. 6 c is a front view after fixation. , FIG. 6d is a cross-sectional view showing a state in which it is not properly installed. 11...Printed circuit board, 12...Notch, 13
...Housing, 14...Boss.
Claims (1)
る電子機器であつて、 前記プリント基板は端部に切欠きが形成された
ものであり、前記ハウジングには前記プリント基
板の厚さに実質的に等しい厚さの段を有するボス
を設け、該ボスをかしめることによつてプリント
基板を取付けたことを特徴とする電子機器。[Claims for Utility Model Registration] An electronic device having a printed circuit board attached to a housing, wherein the printed circuit board has a notch formed at an end, and the housing has a thickness of the printed circuit board. 1. An electronic device characterized in that a boss is provided with a step having a thickness substantially equal to , and a printed circuit board is attached by caulking the boss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3700190U JPH03128982U (en) | 1990-04-05 | 1990-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3700190U JPH03128982U (en) | 1990-04-05 | 1990-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128982U true JPH03128982U (en) | 1991-12-25 |
Family
ID=31543724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3700190U Pending JPH03128982U (en) | 1990-04-05 | 1990-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128982U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091105A (en) * | 2009-10-20 | 2011-05-06 | Shinko Electric Ind Co Ltd | Package for semiconductor laser, semiconductor laser device, and method of manufacturing the same |
| KR101237102B1 (en) * | 2010-07-30 | 2013-02-25 | 가부시키가이샤 덴소 | Portable device for vehicle |
-
1990
- 1990-04-05 JP JP3700190U patent/JPH03128982U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091105A (en) * | 2009-10-20 | 2011-05-06 | Shinko Electric Ind Co Ltd | Package for semiconductor laser, semiconductor laser device, and method of manufacturing the same |
| KR101237102B1 (en) * | 2010-07-30 | 2013-02-25 | 가부시키가이샤 덴소 | Portable device for vehicle |