JPH0313687B2 - - Google Patents
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- Publication number
- JPH0313687B2 JPH0313687B2 JP55086833A JP8683380A JPH0313687B2 JP H0313687 B2 JPH0313687 B2 JP H0313687B2 JP 55086833 A JP55086833 A JP 55086833A JP 8683380 A JP8683380 A JP 8683380A JP H0313687 B2 JPH0313687 B2 JP H0313687B2
- Authority
- JP
- Japan
- Prior art keywords
- joint
- copper
- wire
- copper material
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
本発明は、化合物超電導素線（以下素線と略
記）を安定化銅材（以下銅材と略記）に接合して
一体化した化合物超電導導体に関するもので、特
に従来に比較して多量の銅材の接合が容易で、素
線と銅材との接触抵抗を下げ、接合部の機械的強
度を高め、かつ巻線後に超電導化熱処理（以下熱
処理と略記）の可能な導体を提供するためのもの
である。
従来化合物超電導導体には次のような導体が用
いられている。
(A) 化合物超電導構成体、例えばNb、Snの一方
の元素（Sn）を含む銅マトリツクス中に、他
方の元素（Nb）のロツドを多数埋め込んだ複
合体を所定形状に減面加工して素線を形成し、
これを熱処理してから銅材と半田付けにより一
体化した導体。
(B) 前記複合体を拡散障壁材（バリヤー）を介し
て銅材と複合し、これに押出加工と引抜加工を
加えて素線を形成し、これに熱処理を施した導
体。
(C) 前記押出加工と引抜加工により形成した素線
を複数本撚合せ、これをロール成形して所望の
成形撚線とした後、これに熱処理を施してから
銅材と半田付けにより接合一体化した導体。
しかしながら(A)及び(C)の導体の銅材の接合を半
田付けで行うため、素線又は撚線と銅材を接合一
体化してから熱処理を施すと、半田が再溶融する
ため、接合一体化してから熱処理することができ
ない。従つて熱処理して脆い超電導化合物が生成
した素線又は撚線を焼鈍した銅材に半田付けする
ことになり、半田付け作業が極めてデリケートな
ものとなるばかりか、コイル成形等においても細
心の注意が必要となる。また半田付けのため接合
部の機械的強度が劣るばかりか、接合部のボイド
発生を防止することができず、機械的強度が不安
定なものとなる。更に半田は電気抵抗が大きいた
め、半田を介して銅材に流れる電流のバイパス効
果（安定化）が低下する欠点がある。
また(B)の導体は押出加工により障壁材が破損し
易く、これが破損すると、その後の熱処理におい
て銅材が汚染（合金化）し、電気抵抗が高くなり
電流のバイパス効果が低下する欠点があり、特に
多量の銅材と複合して押出加工を行なうと素線に
断線が起り易いため、複合する銅材の量に制限が
あり、これが大電流容量の導体を製造する上で致
命的欠点となつている。
本発明はこれに鑑み、種々検討の結果多量の銅
材との接合が容易で、素線と銅材との接触抵抗を
下げ、接合部の機械的強度を高めると共に巻線等
の成形後に熱処理の可能な化合物超電導導体を開
発したもので、素線を銅材と接合して一体化した
化合物超電導導体において、化合物超電導素線と
安定化銅材とを、両者の直接接合部と両者の間に
銀ロウを介在させた間接接合部とにより一体化し
てなり、かつ上記間接接合部の全接合部に対する
面積比を0.5以下0.2以上としたことを特徴とする
ものである。
これを平角状素線の両側面に帯状銅材を重さね
合せて一体化した化合物超電導導体について図面
を用いて説明する。
第１図は本発明導体の一例を示す側面図、第２
図は同縦断面図を示す。図より本発明超電導導体
は、平角状素線１の両側面に部分的に銀ロウ３，
３′を配置（図は４本の巾の狭い銀ロウテープを
間隔を設けて長手方向に配置した例を示す）し、
その上に帯状銅材２，２′を重さね合せ、これを
加熱することにより、該素線１と帯状銅材２，
２′との直接接合部（図中Ａで示す）及び該素線
１と帯状銅材２，２′との間に銀ロウ３，３′を介
在させての間接接合部（図中Ｂで示す）を有し、
これら接合部Ａ，Ｂにより両者を一体化したもの
である。
平角状素線１としては熱処理を施したものでも
また施さないものでもよく、特に熱処理を施さな
いものでは、帯状銅材と接合一体化した後所定の
巻線等の加工を行なつてから熱処理を施すことが
できる。ただしこの場合は接合条件が熱処理温度
より高い温度の銀ロウを用いる必要がある。
また平角状素線と帯状銅材の接合界面に部分的
に銀ロウを介在させたのは、銀ロウが介在してな
い界面間での機械的接合により接触抵抗を小さく
するためで、銀ロウ付けにより接合界面が汚染し
て接触抵抗が増加するのを防止するため、銀ロウ
付けはフラツクスレスで行なう必要がある。
しかして、全接合界面の面積に対して、銀ロウ
を介在させた上記間接接合部の面積比を0.5〜0.2
としたのは、次のような理由によるものである。
即ち間接接合部の面積比が0.5以下であれば、
下記の実施例で示したように全面に銀ロウが介在
する場合に比べて接触抵抗値が約1/3となり、実
用上全く問題がない値となるからである。これに
対して面積比がこれを越えると何らかの外因で超
電導状態から常電導状態へ転移した場合に安定化
銅への電流の移動が速やかに行なわれないおそれ
がある。
そして間接接合部の面積比が0.2未満では十分
な接合強度が得られないからである。即ち半田付
け及び銀ロウ付けの接合強度は一般にそれぞれ３
及び30Kg／mm2程度である。そして上記のように全
面半田付けの接合でも実用されているが、より安
全な接合強度として、本発明ではこの全面半田付
け強度の２倍以上を目安とした。従つて接合強度
は使用する銀ロウの面積比にほぼ比例すると考え
られるので、間接接合部の面積比の下限値は0.2
とした。
また上記超電導導体の製造においては、接合後
若干の減面加工を加えることにより、素線と銅材
との直接接合部である機械的接合面の密着性を増
大し、さらに平角状素線と帯状銅材との接触抵抗
を小さくすることができる。
尚銀ロウに巾狭のテープを用いた例について説
明したが、これに限定するものではなく、例えば
線状のものでも同様の効果が得られる。
次に本発明の実施例について説明する。
巾8.4mm、厚さ２mmのCu−14.5％Su合金中に等
価径8μのNb芯を40000本埋め込んだ未熱処理の平
角状素線の両側面に、巾8.4mm，厚さ2.5mmの無酸
素銅条をAg71％、Cu29％でさらに以下の条件の
銀ロウを用いてロウ付けした。即ち本発明例とし
ては巾１mm、厚さ0.01mmのテープ状の銀ロウを用
い、また比較例としては巾２mm、厚さ0.01mmのテ
ープ状の銀ロウを用いてこれらについてそれぞれ
素線の両側面にそれぞれ４本づつ等間隔で長手方
向に配置し、その上に上記銅条を重さね合せ、こ
れを非酸化性雰囲気中で加熱冷却して銀ロウ付け
を行なつた。その後これを平角ダイスを用いて巾
８mm、厚さ６mmに伸線加工し、素線と銅条の機械
的接合面の密着性を高めた。これを直径600mmの
鉄製ボビンに巻き付けてコイル状にしてから650
℃、72時間の熱処理を行なつた。
これら本発明例と比較例の超電導導体について
接合面における室温での接触抵抗を測定してその
結果を第１表に示した。なお従来例として巾8.4
mm、厚さ0.01mmのテープ状の上記組成の銀ロウを
用いて接合面全体にわたつて銀ロウを介在させた
場合についても上記と同様にロウ付け及び熱処理
を行なつて接合面における接触抵抗を求めて第１
表に併記した。
さらに上記それぞれのコイルについて10T（テ
スラ）の磁場中で電流−電圧特性を測定して超電
導特性を評価した。これらの結果を第１表及び第
１図に示した。
The present invention relates to a compound superconducting conductor in which a compound superconducting wire (hereinafter abbreviated as "wire") is joined and integrated with a stabilized copper material (hereinafter abbreviated as "copper material"). In order to provide a conductor that is easy to join materials, reduces the contact resistance between the wire and copper material, increases the mechanical strength of the joint, and can be heat treated to make it superconducting (hereinafter abbreviated as heat treatment) after winding. It is something. Conventionally, the following conductors have been used as compound superconducting conductors. (A) Compound superconducting structure, for example, a composite in which many rods of one of the elements (Nb and Nb) are embedded in a copper matrix containing one of the elements (Sn) is processed into a predetermined shape to reduce the area. form a line,
This conductor is heat treated and then integrated with copper material by soldering. (B) A conductor in which the above-mentioned composite is combined with a copper material via a diffusion barrier material, extruded and drawn to form a wire, and the wire is heat-treated. (C) A plurality of wires formed by the extrusion and drawing processes are twisted together, roll-formed to form the desired stranded wire, heat treated, and then joined together with a copper material by soldering. conductor. However, since the copper materials of the conductors (A) and (C) are joined by soldering, if heat treatment is performed after joining the bare wire or stranded wire and the copper material, the solder will remelt, so It cannot be heat-treated after it has oxidized. Therefore, wires or stranded wires that have been heat-treated to form brittle superconducting compounds must be soldered to annealed copper material, which not only makes the soldering process extremely delicate, but also requires extreme care when forming coils, etc. Is required. Furthermore, because of soldering, not only is the mechanical strength of the joint inferior, but also the generation of voids in the joint cannot be prevented, resulting in unstable mechanical strength. Furthermore, since solder has a large electrical resistance, there is a drawback that the bypass effect (stabilization) of the current flowing through the solder to the copper material is reduced. In addition, the barrier material of the conductor (B) is easily damaged due to extrusion processing, and if this breaks, the copper material will be contaminated (alloyed) during subsequent heat treatment, increasing the electrical resistance and reducing the current bypass effect. In particular, when a large amount of copper material is combined with extrusion processing, wires are likely to break, so there is a limit to the amount of copper material that can be combined, and this is a fatal drawback in manufacturing conductors with large current capacity. It's summery. In view of this, and as a result of various studies, the present invention is easy to join with a large amount of copper material, reduces the contact resistance between the wire and the copper material, increases the mechanical strength of the joint, and is heat treated after forming the winding wire etc. We have developed a compound superconducting conductor that is capable of and an indirect joint with silver solder interposed therebetween, and is characterized in that the area ratio of the indirect joint to the total joint is 0.5 or less and 0.2 or more. This will be explained with reference to the drawings regarding a compound superconducting conductor in which strip-shaped copper material is overlapped and integrated on both sides of a rectangular strand. Figure 1 is a side view showing an example of the conductor of the present invention, Figure 2 is a side view showing an example of the conductor of the invention.
The figure shows a longitudinal sectional view of the same. As shown in the figure, the superconducting conductor of the present invention partially has silver solder 3 on both sides of the rectangular strand 1.
3' (the figure shows an example in which four narrow silver wax tapes are arranged at intervals in the longitudinal direction),
By stacking the strip copper materials 2 and 2' on top of it and heating it, the strand 1 and the strip copper material 2,
2' (indicated by A in the figure) and indirect joints (indicated by B in the figure) by interposing silver solder 3, 3' between the wire 1 and the strip-shaped copper materials 2, 2'. ),
The two are integrated by these joints A and B. The rectangular wire 1 may be heat-treated or not heat-treated, and in particular, in the case of a wire that is not heat-treated, the rectangular wire 1 may be heat-treated after being bonded and integrated with the strip copper material and then subjected to processing such as winding. can be applied. However, in this case, it is necessary to use silver solder whose bonding conditions are higher than the heat treatment temperature. In addition, the reason why silver solder is partially interposed at the bonding interface between the rectangular wire and the strip copper material is to reduce the contact resistance by mechanically joining the interface without silver solder. In order to prevent contamination of the bonding interface and increase in contact resistance due to soldering, silver brazing must be performed without flux. Therefore, the area ratio of the above-mentioned indirect joint with silver solder to the area of the entire joint interface was set at 0.5 to 0.2.
The reason for this is as follows. In other words, if the area ratio of the indirect joint is 0.5 or less,
This is because the contact resistance value is about 1/3 of that in the case where silver solder is interposed on the entire surface as shown in the example below, which is a value that causes no practical problems. On the other hand, if the area ratio exceeds this range, there is a risk that current will not be transferred quickly to the stabilizing copper when the superconducting state transitions to the normal conducting state due to some external cause. This is because if the area ratio of the indirect joint is less than 0.2, sufficient joint strength cannot be obtained. In other words, the joint strength of soldering and silver brazing is generally 3
and about 30Kg/ mm2 . As mentioned above, bonding by full-surface soldering is also in practice, but in the present invention, as a safer bonding strength, the standard is at least twice the full-surface soldering strength. Therefore, the joint strength is considered to be approximately proportional to the area ratio of the silver solder used, so the lower limit of the area ratio of indirect joints is 0.2
And so. In addition, in the production of the superconducting conductor mentioned above, by adding a slight surface reduction process after joining, the adhesion of the mechanical joint surface, which is the direct joint between the wire and the copper material, is increased, and the adhesion between the rectangular wire and the copper material is increased. Contact resistance with the strip copper material can be reduced. Although an example in which a narrow tape is used as the silver solder has been described, the present invention is not limited to this, and the same effect can be obtained by using a linear tape, for example. Next, examples of the present invention will be described. An oxygen-free wire with a width of 8.4 mm and a thickness of 2.5 mm is placed on both sides of an unheated rectangular wire in which 40,000 Nb cores with an equivalent diameter of 8 μ are embedded in a Cu-14.5% Su alloy with a width of 8.4 mm and a thickness of 2 mm. The copper strip was further soldered using silver solder with 71% Ag and 29% Cu under the following conditions. That is, as an example of the present invention, a tape-shaped silver solder with a width of 1 mm and a thickness of 0.01 mm was used, and as a comparative example, a tape-shaped silver solder with a width of 2 mm and a thickness of 0.01 mm was used. Four copper strips were arranged on each surface at equal intervals in the longitudinal direction, and the copper strips were stacked on top of each other, and silver brazing was performed by heating and cooling the copper strips in a non-oxidizing atmosphere. Thereafter, this wire was drawn to a width of 8 mm and a thickness of 6 mm using a rectangular die to improve the adhesion between the mechanical bonding surfaces of the strands and the copper strip. Wrap this around an iron bobbin with a diameter of 600 mm to form a coil, and then
Heat treatment was performed at ℃ for 72 hours. The contact resistance at room temperature at the joint surfaces of the superconducting conductors of the present invention examples and comparative examples was measured, and the results are shown in Table 1. In addition, as a conventional example, the width is 8.4
When silver solder with the above composition is used in the form of a tape with a thickness of 0.01 mm and the silver solder is interposed over the entire joint surface, brazing and heat treatment are performed in the same manner as above to determine the contact resistance at the joint surface. First in search of
Also listed in the table. Furthermore, the current-voltage characteristics of each of the above coils were measured in a magnetic field of 10 T (Tesla) to evaluate the superconducting characteristics. These results are shown in Table 1 and FIG.
【表】
第１表より化合物超電導素線と安定化金属であ
る無酸素銅条とを、その接合界面で銀ロウを介在
させた間接接合面の面積比が0.5以下の条件で一
体化した本発明例No.１は、接合界面の全面に介在
させた銀ロウにより接合した従来例No.３に比べて
接触抵抗が大幅に小さくなつている。
さらに間接接合の面積比が0.5より大きい比較
例No.３では接合界面で介在させた銀ロウの割合が
多過ぎたので、従来例No.３に比べて接触抵抗の低
下はわずかであつた。
尚表に示した接触抵抗の測定値は、室温におけ
る値であるが、液体He温度迄冷却した場合は、
銀ロウの抵抗値は約1/2にしか減少しないのに対
して、銅の抵抗値は約1/300に減少し、実際に使
用される液体He温度においては、接合界面に部
分的にしか銀ロウが存在しない場合には、電流の
大部分は銀ロウが存在しない部分を通つて安定化
銅に分流する様になる。従つて、接合界面に部分
的に銀ロウを介在させた本発明例No.１と従来例No.
３、比較例No.２との接触抵抗の差は液体He温度
においては、表に示した室温の場合に比べてより
大きくなるものと考えられる。
次に本発明例No.１及び従来例No.３の電流−電圧
特性の測定結果を示す第１図について説明する。
本発明例No.１の超電導導体は電流を増加してい
くと、Ａ点で臨界電流IC＝2600Aに達して超電導
状態が破れて電圧が発生するが（図中の実線曲線
AB1）、接合面における接触抵抗が低い為電流は
速やかに安定化金属である無酸素銅に伝播し
（B1点）、B1点以降は完全に無酸素銅を通して電
流が流れ（直線B1C）、バイパス効果が優れてい
る。この際無酸素銅に完全に分流する迄に発熱に
よつて発生するエネルギーロスは曲線AB1、直線
B1E1，E1Aにかこまれた部分である。
常電導状態に転移した後、電流を下げていく
と、直線B1C引き続いて実線曲線B1D1に沿つて
変化してゆき、D1点（回復電流IR＝1560A）で超
電導状態に復帰する。
一方従来例No.３の超電導導体は電流を増加して
いくと、同じくＡ点で臨界電流IC＝2600Aに達し
て超電導状態が破れて電圧が発生するが（図中の
点線曲線AB4）、接合面における接触抵抗が高い
為電流が無酸素銅に伝播するのに時間がかかり、
より大きい電流（B4）に達して初めて、完全に
無酸素銅を通して電流が流れる様になり、（直線
B4C）、バイパス効果が良くない。この際は発熱
によるエネルギーロスも点線曲線AB4，直線
B4E4，E4Aにかこまれた部分となり、本発明例
No.１よりも大きくなる。
常電導状態に転移した後、電流を下げていく
と、直線CB4及びB4B1引き続いて点線曲線B1D4
に沿つて変化してゆき、D4点（回復電流IR＝
1300A）で超電導状態に復帰する。
以上のことから安定化材−超電導材の接合は本
発明導体の方が従来のものに比較してより優れて
いることが判る。
またケーブル強度については実際にコイルに巻
いてクエンチさせた時の、ケーブルの損傷、即ち
安定化銅材と超電導素線のハクリとなつて現れる
ものであるが、上記のように両者の接合強度は十
分確保されているのでより優れていると考えられ
る。
このように本発明によれば、多量の銅材との接
合が容易で、接合部の機械的強度が優れ、かつ接
触抵抗が小さく、さらに超電導特性に優れた超電
導導体が得られ、特に未熱処理素線を用いたもの
ではロウ付け後に減面加工することにより更に密
着性が改善され、かつコイル状に成形してから熱
処理することが可能なため、巻線として一層信頼
性を高める顕著な効果を奏するものである。[Table] From Table 1, a compound superconducting wire and an oxygen-free copper strip, which is a stabilizing metal, are integrated under the condition that the area ratio of the indirect joint surface is 0.5 or less with silver solder interposed at the joint interface. Inventive example No. 1 has significantly lower contact resistance than conventional example No. 3, which was joined by silver solder interposed over the entire surface of the joining interface. Furthermore, in Comparative Example No. 3 in which the area ratio of indirect bonding was greater than 0.5, the proportion of silver solder interposed at the bonding interface was too large, so the contact resistance decreased only slightly compared to Conventional Example No. 3. The measured values of contact resistance shown in the table are values at room temperature, but when cooled to the temperature of liquid He,
While the resistance value of silver solder decreases by only about 1/2, the resistance value of copper decreases by about 1/300. If the silver solder is not present, most of the current will be shunted to the stabilized copper through the part where the silver solder is not present. Therefore, inventive example No. 1 and conventional example No. 1 in which silver solder was partially interposed at the bonding interface.
3. The difference in contact resistance with Comparative Example No. 2 is considered to be larger at the liquid He temperature than at room temperature shown in the table. Next, FIG. 1 showing the measurement results of the current-voltage characteristics of Invention Example No. 1 and Conventional Example No. 3 will be explained. As the current increases in the superconducting conductor of Invention Example No. 1, the critical current I C = 2600 A is reached at point A, the superconducting state is broken, and a voltage is generated (the solid line curve in the figure
AB 1 ), the contact resistance at the bonding surface is low, so the current quickly propagates to the oxygen-free copper, which is a stabilizing metal (point B 1 ), and from point B 1 onwards, the current flows completely through the oxygen-free copper (straight line B 1 C), excellent bypass effect. At this time, the energy loss caused by heat generation until the flow is completely diverted to oxygen-free copper is represented by curve AB 1 and straight line
This is the part surrounded by B 1 E 1 and E 1 A. After transitioning to the normal conductive state, as the current is lowered, it changes along the straight line B 1 C followed by the solid curve B 1 D 1 , and at point D 1 (recovery current I R = 1560 A) it changes to the superconducting state. Return. On the other hand, as the current increases in the superconducting conductor of Conventional Example No. 3, the critical current I C reaches 2600 A at point A, the superconducting state is broken, and a voltage is generated (dotted curve AB 4 in the figure). , because the contact resistance at the bonding surface is high, it takes time for the current to propagate through the oxygen-free copper,
Only when a larger current (B 4 ) is reached can the current flow completely through the oxygen-free copper (in a straight line).
B 4 C), bypass effect is not good. In this case, the energy loss due to heat generation is also represented by the dotted curve AB 4 and the straight line
This is the part surrounded by B 4 E 4 and E 4 A, which is the example of the present invention.
It will be larger than No.1. After transitioning to the normal conducting state, when the current is lowered, the straight lines CB 4 and B 4 B 1 are followed by the dotted curve B 1 D 4
D 4 points (recovery current I R =
1300A) to return to superconducting state. From the above, it can be seen that the conductor of the present invention is superior to the conventional one in terms of bonding between the stabilizing material and the superconducting material. Regarding cable strength, damage to the cable occurs when the cable is actually wound into a coil and quenched, that is, the stabilized copper material and the superconducting wire peel off, but as mentioned above, the bonding strength between the two is It is considered to be better because it is sufficiently secured. As described above, according to the present invention, a superconducting conductor can be obtained which can be easily joined to a large amount of copper material, has excellent mechanical strength at the joint part, has low contact resistance, and has excellent superconducting properties. For wires that use strands, the adhesion is further improved by reducing the area after brazing, and it is also possible to heat-treat after forming into a coil, which has the remarkable effect of further increasing reliability as a winding wire. It is something that plays.
第１図は本発明導体の一例を示す側面図、第２
図同断面図、第３図は本発明導体と従来導体の電
流−電圧特性を示す線図である。
１……平角状素線、２，２′……帯状銅材、３，
３′……銀ロウテープ。
Figure 1 is a side view showing an example of the conductor of the present invention, Figure 2 is a side view showing an example of the conductor of the invention.
The same sectional view and FIG. 3 are diagrams showing the current-voltage characteristics of the conductor of the present invention and the conventional conductor. 1... Rectangular wire, 2, 2'... Band-shaped copper material, 3,
3'...Silver wax tape.
Claims (1)
体化した化合物超電導導体において、化合物超電
導素線と安定化銅材とを、両者の直接接合部と両
者の間に銀ロウを介在させた間接接合部とにより
一体化してなり、かつ上記間接接合部の全接合面
に対する面積比を0.5以下0.2以上としたことを特
徴とする化合物超電導導体。1. In a compound superconducting conductor in which a compound superconducting wire is joined to a stabilized copper material and integrated, the compound superconducting wire and the stabilized copper material are interposed at the direct joint between the two and with silver solder between the two. 1. A compound superconducting conductor, characterized in that it is integrated with an indirect joint, and the area ratio of the indirect joint to the total joint surface is 0.5 or less and 0.2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8683380A JPS5711408A (en) | 1980-06-26 | 1980-06-26 | Compound superconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8683380A JPS5711408A (en) | 1980-06-26 | 1980-06-26 | Compound superconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5711408A JPS5711408A (en) | 1982-01-21 |
| JPH0313687B2 true JPH0313687B2 (en) | 1991-02-25 |
Family
ID=13897808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8683380A Granted JPS5711408A (en) | 1980-06-26 | 1980-06-26 | Compound superconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5711408A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3223328C2 (en) * | 1982-06-23 | 1987-04-09 | Robert Bosch Gmbh, 7000 Stuttgart | Device for detecting a periodically fluctuating variable of an internal combustion engine |
| CN102097180B (en) * | 2011-02-25 | 2012-05-09 | 华北电力大学 | NbTi/YBCO (yttrium barium copper oxide) composite superconducting wire with circular section |
| GB2565839A (en) * | 2017-08-25 | 2019-02-27 | Tokamak Energy Ltd | Superconducting joint using exfoliated ReBCO |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5218556A (en) * | 1975-08-02 | 1977-02-12 | Okamoto Tekko Kk | Air clutch |
-
1980
- 1980-06-26 JP JP8683380A patent/JPS5711408A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5711408A (en) | 1982-01-21 |
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