JPH031381B2 - - Google Patents

Info

Publication number
JPH031381B2
JPH031381B2 JP61270005A JP27000586A JPH031381B2 JP H031381 B2 JPH031381 B2 JP H031381B2 JP 61270005 A JP61270005 A JP 61270005A JP 27000586 A JP27000586 A JP 27000586A JP H031381 B2 JPH031381 B2 JP H031381B2
Authority
JP
Japan
Prior art keywords
carbon black
dispersion
hydroxide
particles
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61270005A
Other languages
English (en)
Other versions
JPS62260068A (ja
Inventor
Renaado Minten Kaaru
Jei Bateisutei Anjero
Pisumennaya Gariina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ORIN HANTO SABU ZA SAADO CORP
Original Assignee
ORIN HANTO SABU ZA SAADO CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ORIN HANTO SABU ZA SAADO CORP filed Critical ORIN HANTO SABU ZA SAADO CORP
Publication of JPS62260068A publication Critical patent/JPS62260068A/ja
Publication of JPH031381B2 publication Critical patent/JPH031381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Description

【発明の詳細な説明】
発明の分野 本発明は非導電性物質の表面、特にプリント配
線板PWBの貫通孔壁の導電性金属層を無電解メ
ツキする方法。 関連技術の説明 過去25年間プリント配線板工業はプリント配線
板中の貫通孔壁を電気メツキするのに無電解メツ
キによる銅の付着方法に依存してきた。貫通孔壁
のメツキはプリント配線板の両側又はこれに加え
て多層板の内層の、金属回路パターン間の接続を
行なうのに必要である。 貫通孔壁への無電解メツキによる銅の付着は典
型的にはPWBの予備クリーニングとそれに続く
次の工程図に従つて行なわれる。
【表】 ↓

Claims (1)

  1. 【特許請求の範囲】 １ ａ (1) 約3.0ミクロンより小さい平均粒径
    を有するカーボンブラツク粒子、 (2) 液体分散媒および (3) 前記カーボンブラツクを前記液体分散媒中
    に分散させるのに十分な量の界面活性剤 を含有するカーボンブラツク分散液をカーボンブ
    ラツクの量が非導電性物質表面をほとんど全部被
    覆するのに充分な量であり且つ分散液のうちの約
    ４重量％よりも少なくなるように調製し、 ｂ 前記分散液を非導電性物質の表面に適用し、 ｃ 前記カーボンブラツク粒子から実質的に全て
    の液体分散媒を除去しそれによつてカーボンブ
    ラツク粒子を前記非導電性表面上に実質的に連
    続した層状で付着させ、そして ｄ 付着したカーボンブラツク層と前記非導電性
    表面に実質的に連続した導電性金属層を無電解
    メツキする ことからなる非導電性物質の表面に導電性金属層
    を無電解メツキする方法。 ２ 非導電性物質が貫通孔を有するプリント配線
    板である特許請求の範囲第１項記載の方法。 ３ 前記ｄの無電解メツキによる導電性金属層上
    に実質的に連続した第２の金属層を電気メツキす
    る特許請求の範囲第１項記載の方法。 ４ 前記の分散液が分散液のpHを約10〜約14の
    範囲で上昇させるに充分な量の少なくとも１種の
    水酸化アルカリを含有する特許請求の範囲第１ま
    たは３項記載の方法。 ５ 水酸化アルカリが水酸化カリウム、水酸化ナ
    トリウム、水酸化リチウム、水酸化アンモニウム
    及び水酸化カルシウムからなる群から選ばれる特
    許請求の範囲第４項記載の方法。 ６ 分散液が更にヒユームドシリカ粒子と水酸化
    アルカリとの反応によつて形成されるアルカリシ
    リケートを含有する特許請求の範囲第４項記載の
    方法。 ７ 液体分散媒が水である特許請求の範囲第１項
    記載の方法。 ８ 液体分散媒が極性有機溶媒である特許請求の
    範囲第１項記載の方法。 ９ 分散液が約10重量％より少ない固形分を含有
    する特許請求の範囲第１項記載の方法。 １０ カーボンブラツク分散液の初めのpHが約
    １〜約7.5である特許請求の範囲第１項記載の方
    法。 １１ カーボンブラツク分散液の初めのpHが約
    ２〜約４である特許請求の範囲第１０項記載の方
    法。 １２ カーボンブラツク粒子が多孔質の粒子であ
    る特許請求の範囲第１項記載の方法。 １３ カーボンブラツク粒子が約45〜約1100m2／
    ｇの表面積を有する特許請求の範囲第１２項記載
    の方法 １４ カーボンブラツク粒子が約１〜約10重量％
    の揮発分を有する特許請求の範囲第１項記載の方
    法。 １５ 界面活性剤がリン酸エステルアニオン系界
    面活性剤である特許請求の範囲第１項記載の方
    法。 １６ 導電性金属が銅、ニツケル、金、パラジウ
    ム、銀および錫からなる群から選ばれる特許請求
    の範囲第１項記載の方法。 １７ 導電性金属が銅である特許請求の範囲第１
    ６項記載の方法。 １８ 工程ｂにおける非導電性物質の表面適用が
    非導電性物質をカーボンブラツク分散液中に浸漬
    することによつて行われる特許請求の範囲第１項
    記載の方法。 １９ 工程ｃにおける液体分散媒の除去が適用さ
    れたカーボンブラツク分散液を加熱することによ
    つて行われる特許請求の範囲第１項記載の方法。 ２０ 工程ｂの後工程ｃの前にプリント配線板の
    金属層をミクロエツチングして該金属層上に付着
    したカーボンブラツクを除去することからなる、
    特許請求の範囲第２項記載の方法。 ２１ ミクロエツチング工程の後に更に水洗工程
    を包含する特許請求の範囲第２０項記載の方法。
JP61270005A 1986-05-05 1986-11-14 非導電性物質の表面に導電性金属層をメツキする方法 Granted JPS62260068A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US859672 1986-05-05
US06/859,672 US4631117A (en) 1985-05-06 1986-05-05 Electroless plating process

Publications (2)

Publication Number Publication Date
JPS62260068A JPS62260068A (ja) 1987-11-12
JPH031381B2 true JPH031381B2 (ja) 1991-01-10

Family

ID=25331468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61270005A Granted JPS62260068A (ja) 1986-05-05 1986-11-14 非導電性物質の表面に導電性金属層をメツキする方法

Country Status (7)

Country Link
US (1) US4631117A (ja)
EP (1) EP0244535B1 (ja)
JP (1) JPS62260068A (ja)
KR (1) KR910004969B1 (ja)
DE (1) DE3672284D1 (ja)
HK (1) HK99890A (ja)
SG (1) SG83490G (ja)

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US4718993A (en) * 1987-05-29 1988-01-12 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US5065228A (en) * 1989-04-04 1991-11-12 Olin Corporation G-TAB having particular through hole
US5108553A (en) * 1989-04-04 1992-04-28 Olin Corporation G-tab manufacturing process and the product produced thereby
US4874477A (en) * 1989-04-21 1989-10-17 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
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US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
US4994153A (en) * 1990-06-28 1991-02-19 Olin Corporation Process for preparing nonconductive substrates
US5139642A (en) 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
US6303181B1 (en) 1993-05-17 2001-10-16 Electrochemicals Inc. Direct metallization process employing a cationic conditioner and a binder
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Also Published As

Publication number Publication date
JPS62260068A (ja) 1987-11-12
EP0244535B1 (en) 1990-06-27
KR870011273A (ko) 1987-12-22
KR910004969B1 (ko) 1991-07-20
DE3672284D1 (de) 1990-08-02
SG83490G (en) 1990-11-23
HK99890A (en) 1990-12-07
US4631117A (en) 1986-12-23
EP0244535A1 (en) 1987-11-11

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