JPH031496U - - Google Patents
Info
- Publication number
- JPH031496U JPH031496U JP5901089U JP5901089U JPH031496U JP H031496 U JPH031496 U JP H031496U JP 5901089 U JP5901089 U JP 5901089U JP 5901089 U JP5901089 U JP 5901089U JP H031496 U JPH031496 U JP H031496U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- circuit board
- printed circuit
- protrusion
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のシールドケースのプリント基
板への取付構造の縦断面図、第２図は第１図実施
例の横断面図、第３図は第１図実施例に用いられ
る基板の平面図である。
１，２……シールドケース、、１ａ，１ｂ，２
ａ，２ｂ……突起部、３……基板、４……導電体
、５……半田盛上部、６……スルーホール。
Fig. 1 is a vertical cross-sectional view of the mounting structure of the shield case of the present invention on a printed circuit board, Fig. 2 is a cross-sectional view of the embodiment of Fig. 1, and Fig. 3 is a plan view of the board used in the embodiment of Fig. 1. It is a diagram. 1, 2... Shield case, 1a, 1b, 2
a, 2b...protrusion, 3...substrate, 4...conductor, 5...solder mound, 6...through hole.
Claims (1)
ドケースを前記プリント基板に取り付けるシール
ドケースのプリント基板への取付構造において、
前記プリント基板に複数の半田盛上部を形成する
と共に、前記シールドケースの内壁面に前記半田
盛上部に対向する先端が尖鋭なる突起部を形成し
、前記シールドケースの取り付け時に前記突起部
の先端を前記半田盛上部に当接させてなることを
特徴とするシールドケースのプリント基板への取
付構造。 In a structure for attaching a shield case to a printed circuit board, the shield case is attached to the printed circuit board while covering at least a part of the printed circuit board,
A plurality of solder mounds are formed on the printed circuit board, and a protrusion with a sharp tip opposite to the solder mound is formed on the inner wall surface of the shield case, and when the shield case is attached, the tip of the protrusion is sharpened. A structure for attaching a shield case to a printed circuit board, characterized in that the shield case is brought into contact with the solder mound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5901089U JPH031496U (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5901089U JPH031496U (en) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031496U true JPH031496U (en) | 1991-01-09 |
Family
ID=31585131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5901089U Pending JPH031496U (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031496U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10326993A (en) * | 1997-05-23 | 1998-12-08 | Mitsubishi Electric Corp | Electronic circuit shield device |
-
1989
- 1989-05-22 JP JP5901089U patent/JPH031496U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10326993A (en) * | 1997-05-23 | 1998-12-08 | Mitsubishi Electric Corp | Electronic circuit shield device |