JPH0316319U - - Google Patents
Info
- Publication number
- JPH0316319U JPH0316319U JP7664089U JP7664089U JPH0316319U JP H0316319 U JPH0316319 U JP H0316319U JP 7664089 U JP7664089 U JP 7664089U JP 7664089 U JP7664089 U JP 7664089U JP H0316319 U JPH0316319 U JP H0316319U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- electrode
- metal
- parallel plate
- plate capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000003989 dielectric material Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例の平行平板形コンデ
ンサの斜視図、第２図は従来の平行平板形コンデ
ンサの斜視図、第３図は一体形成し誘電体基板か
ら切断分離して造る従来の平行平板形コンデンサ
の斜視図である。
１……誘電体平板、２……下地電極、３，３ａ
，３ｂ……電極被膜、４……電極、５……ひげ状
バリ。
Fig. 1 is a perspective view of a parallel plate capacitor according to an embodiment of the present invention, Fig. 2 is a perspective view of a conventional parallel plate capacitor, and Fig. 3 is a conventional parallel plate capacitor formed integrally and then cut and separated from a dielectric substrate. FIG. 2 is a perspective view of a parallel plate capacitor of FIG. 1... Dielectric flat plate, 2... Base electrode, 3, 3a
, 3b...electrode coating, 4...electrode, 5...whisker-like burrs.
Claims (1)
面に金属膜を被着して成る電極とから成る平行平
板形コンデンサに於いて、前記電極の最上層がヌ
ープ硬度９０以下の金属層であり、且つそれらの
金属層のうち一方の電極側の該金属層の厚さが１
〜３μｍであり他方の電極側の該金属層の厚さが
１５μｍ以上であることを特徴とする平行平板形
コンデンサ。 (2) 電極の最上層にあるヌープ硬度９０以下の
金属層が無光沢金メツキであることを特徴とする
請求項１記載の平行平板形コンデンサ。[Claims for Utility Model Registration] (1) In a parallel plate capacitor consisting of a flat dielectric material and an electrode formed by coating a metal film on the entire surface of both surfaces of the dielectric material, The uppermost layer is a metal layer with a Knoop hardness of 90 or less, and the thickness of the metal layer on one electrode side of these metal layers is 1
3 .mu.m, and the metal layer on the other electrode side has a thickness of 15 .mu.m or more. (2) The parallel plate capacitor according to claim 1, wherein the metal layer having a Knoop hardness of 90 or less on the uppermost layer of the electrode is matte gold plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7664089U JPH0316319U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7664089U JPH0316319U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316319U true JPH0316319U (en) | 1991-02-19 |
Family
ID=31618290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7664089U Pending JPH0316319U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316319U (en) |
-
1989
- 1989-06-29 JP JP7664089U patent/JPH0316319U/ja active Pending
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