JPH0316343U - - Google Patents
Info
- Publication number
- JPH0316343U JPH0316343U JP7655589U JP7655589U JPH0316343U JP H0316343 U JPH0316343 U JP H0316343U JP 7655589 U JP7655589 U JP 7655589U JP 7655589 U JP7655589 U JP 7655589U JP H0316343 U JPH0316343 U JP H0316343U
- Authority
- JP
- Japan
- Prior art keywords
- dicing
- blade
- semiconductor wafer
- interval
- adjusted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の一実施例に係るダイシングソ
ウの斜視図、第２図は同実施例のダイシングソウ
の側面図、第３図は同実施例のダイシングソウに
よる切断終了位置を示す側面図、第４図は従来の
ダイシングソウの斜視図である。
１，２……ダイシングブレード、９……半導体
ウエハ。
Fig. 1 is a perspective view of a dicing saw according to an embodiment of the present invention, Fig. 2 is a side view of the dicing saw of the embodiment, and Fig. 3 is a side view showing the end position of cutting by the dicing saw of the embodiment. , FIG. 4 is a perspective view of a conventional dicing saw. 1, 2...Dicing blade, 9...Semiconductor wafer.
Claims (1)
ブレードの間隔を半導体ウエハの直径長さの範囲
内で調節自在としたことを特徴とするダイシング
ソウ。 A dicing saw characterized in that a plurality of dicing blades are arranged in parallel, and the interval between each blade can be adjusted within the range of the diameter and length of a semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7655589U JPH0316343U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7655589U JPH0316343U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316343U true JPH0316343U (en) | 1991-02-19 |
Family
ID=31618132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7655589U Pending JPH0316343U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316343U (en) |
-
1989
- 1989-06-29 JP JP7655589U patent/JPH0316343U/ja active Pending