JPH0316397U - - Google Patents

Info

Publication number
JPH0316397U
JPH0316397U JP7583489U JP7583489U JPH0316397U JP H0316397 U JPH0316397 U JP H0316397U JP 7583489 U JP7583489 U JP 7583489U JP 7583489 U JP7583489 U JP 7583489U JP H0316397 U JPH0316397 U JP H0316397U
Authority
JP
Japan
Prior art keywords
pack
circuit board
printed circuit
housed
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7583489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7583489U priority Critical patent/JPH0316397U/ja
Publication of JPH0316397U publication Critical patent/JPH0316397U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す構成説明図、
第２図はパツクの要部拡大図、第３図および第４
図はそれぞれ本考案の他の実施例を示す構成説明
図である。 １……パツク、２……電子回路部品、３……プ
リント基板、４……冷却用不活性液体、５……ね
じ、６……ケース。 FIG. 1 is a configuration explanatory diagram showing an embodiment of the present invention;
Figure 2 is an enlarged view of the main parts of the pack, Figures 3 and 4.
The figures are configuration explanatory diagrams showing other embodiments of the present invention. 1... Pack, 2... Electronic circuit components, 3... Printed circuit board, 4... Inert liquid for cooling, 5... Screws, 6... Case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 可撓性を有するパツク内に、電子回路部品が実
装されたプリント基板が収納されるとともに、冷
却用不活性液体が充填密封されたことを特徴とす
る部品実装構造。 A component mounting structure characterized in that a printed circuit board on which electronic circuit components are mounted is housed in a flexible pack, and the pack is filled and sealed with an inert cooling liquid.
JP7583489U 1989-06-28 1989-06-28 Pending JPH0316397U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7583489U JPH0316397U (en) 1989-06-28 1989-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7583489U JPH0316397U (en) 1989-06-28 1989-06-28

Publications (1)

Publication Number Publication Date
JPH0316397U true JPH0316397U (en) 1991-02-19

Family

ID=31616762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7583489U Pending JPH0316397U (en) 1989-06-28 1989-06-28

Country Status (1)

Country Link
JP (1) JPH0316397U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178348A (en) * 1981-04-27 1982-11-02 Nippon Telegr & Teleph Corp <Ntt> Cooling unit for semiconductor integrated circuit device
JPS62136055A (en) * 1985-12-09 1987-06-19 Fujitsu Ltd Dipped vaporization type cooling container

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178348A (en) * 1981-04-27 1982-11-02 Nippon Telegr & Teleph Corp <Ntt> Cooling unit for semiconductor integrated circuit device
JPS62136055A (en) * 1985-12-09 1987-06-19 Fujitsu Ltd Dipped vaporization type cooling container

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