JPH0317623U - - Google Patents
Info
- Publication number
- JPH0317623U JPH0317623U JP1989076274U JP7627489U JPH0317623U JP H0317623 U JPH0317623 U JP H0317623U JP 1989076274 U JP1989076274 U JP 1989076274U JP 7627489 U JP7627489 U JP 7627489U JP H0317623 U JPH0317623 U JP H0317623U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- external lead
- bump electrode
- bump
- out electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/231—Shapes
- H10W72/234—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Wire Bonding (AREA)
Description
第１図、第３図、第４図及び第５図は本考案の
実施例を示す図、第２図は従来のバンプ電極を示
す図である。 １４…開口部、１５…インナーリード、１６…
バンプエリヤ、１７，３７…バンプ電極、１８…
接続部。
実施例を示す図、第２図は従来のバンプ電極を示
す図である。 １４…開口部、１５…インナーリード、１６…
バンプエリヤ、１７，３７…バンプ電極、１８…
接続部。
Claims (1)
- 【実用新案登録請求の範囲】 半導体素子表面上に設けられた外部導出電極に
形成されたバンプ電極において、 このバンプ電極と外部導出電極とが接続される
領域を前記外部導出電極の一部分とした事を特徴
とするバンプ電極。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076274U JPH0317623U (ja) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076274U JPH0317623U (ja) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317623U true JPH0317623U (ja) | 1991-02-21 |
Family
ID=31617590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989076274U Pending JPH0317623U (ja) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317623U (ja) |
-
1989
- 1989-06-30 JP JP1989076274U patent/JPH0317623U/ja active Pending