JPH0317645U - - Google Patents
Info
- Publication number
- JPH0317645U JPH0317645U JP7812489U JP7812489U JPH0317645U JP H0317645 U JPH0317645 U JP H0317645U JP 7812489 U JP7812489 U JP 7812489U JP 7812489 U JP7812489 U JP 7812489U JP H0317645 U JPH0317645 U JP H0317645U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- glass
- welded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000945 filler Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の電子部品の実装状態を示す正
面半断面図、第２図は本考案の他の実施例の正面
断面図、第３図は従来の電子部品の実装状態を示
す正面半断面図、第４図、第５図、第６図は従来
の電子部品の他の例の要部断面図である。
２９，４２…金属外環、３１，４３…リード線
、３２，３３，４４…ガラス、３７…プリント基
板、４５…フイラー入りガラス。
FIG. 1 is a front half sectional view showing the mounted state of the electronic component of the present invention, FIG. 2 is a front half sectional view of another embodiment of the present invention, and FIG. 3 is a front half sectional view showing the mounted state of the conventional electronic component. 4, 5, and 6 are cross-sectional views of main parts of other examples of conventional electronic components. 29, 42... Metal outer ring, 31, 43... Lead wire, 32, 33, 44... Glass, 37... Printed circuit board, 45... Filler-containing glass.
Claims (1)
一部にガラスを溶着させたことを特徴とする電子
部品。[Scope of Claim for Utility Model Registration] An electronic component having a lead wire, characterized in that glass is welded to a portion of the lead wire located away from the bottom surface of the electronic component body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7812489U JPH0317645U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7812489U JPH0317645U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317645U true JPH0317645U (en) | 1991-02-21 |
Family
ID=31621117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7812489U Pending JPH0317645U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317645U (en) |
-
1989
- 1989-06-30 JP JP7812489U patent/JPH0317645U/ja active Pending