JPH0317646U - - Google Patents

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Publication number
JPH0317646U
JPH0317646U JP7626389U JP7626389U JPH0317646U JP H0317646 U JPH0317646 U JP H0317646U JP 7626389 U JP7626389 U JP 7626389U JP 7626389 U JP7626389 U JP 7626389U JP H0317646 U JPH0317646 U JP H0317646U
Authority
JP
Japan
Prior art keywords
ceramic substrate
package
semiconductor device
fixed
semiconductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7626389U
Other languages
English (en)
Other versions
JPH0741166Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7626389U priority Critical patent/JPH0741166Y2/ja
Publication of JPH0317646U publication Critical patent/JPH0317646U/ja
Application granted granted Critical
Publication of JPH0741166Y2 publication Critical patent/JPH0741166Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本考案になる半導体装置用パツケージ
の一部截断縦断面図、第２図は従来の半導体装置
用パツケージの縦断面図である。 １１…セラミツク基板、１２…円錐孔、１３…
リードピン、１６…テーパ状フランジ部、１８…
リードピン頂部。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク基板上に半導体回路を固定しこの半
    導体回路をキヤツプで気密封止した半導体装置用
    パツケージにおいて、前記セラミツク基板面に対
    して垂直に所定数の円錐孔を所定の配列に設けた
    セラミツク基板と、該セラミツク基板の円錐孔に
    嵌合され固着されたテーパ状フランジ部を有する
    リードピンとを備えたことを特徴とする半導体装
    置用パツケージ。
JP7626389U 1989-06-30 1989-06-30 半導体装置用パッケージ Expired - Lifetime JPH0741166Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7626389U JPH0741166Y2 (ja) 1989-06-30 1989-06-30 半導体装置用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7626389U JPH0741166Y2 (ja) 1989-06-30 1989-06-30 半導体装置用パッケージ

Publications (2)

Publication Number Publication Date
JPH0317646U true JPH0317646U (ja) 1991-02-21
JPH0741166Y2 JPH0741166Y2 (ja) 1995-09-20

Family

ID=31617568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7626389U Expired - Lifetime JPH0741166Y2 (ja) 1989-06-30 1989-06-30 半導体装置用パッケージ

Country Status (1)

Country Link
JP (1) JPH0741166Y2 (ja)

Also Published As

Publication number Publication date
JPH0741166Y2 (ja) 1995-09-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term