JPH0317653U - - Google Patents

Info

Publication number
JPH0317653U
JPH0317653U JP1989078870U JP7887089U JPH0317653U JP H0317653 U JPH0317653 U JP H0317653U JP 1989078870 U JP1989078870 U JP 1989078870U JP 7887089 U JP7887089 U JP 7887089U JP H0317653 U JPH0317653 U JP H0317653U
Authority
JP
Japan
Prior art keywords
solid
imaging device
state imaging
package
tapered portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989078870U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989078870U priority Critical patent/JPH0317653U/ja
Publication of JPH0317653U publication Critical patent/JPH0317653U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案に係る固体撮像装置の取付機
構の一実施例を示す図、第２図は同実施例の固体
撮像装置を示す図、第３図は固体撮像装置の構造
を示す側断面図、第４図は３板式カラーカメラを
説明するための図、第５図は固体撮像装置の従来
の取付手段を示す図である。 １１…パツケージ、１２…導電性接着剤、１３
…固体撮像素子、１４…カバーガラス、１５…ワ
イヤボンデイング、１６…接続ピン、１７…プリ
ズム、１８…光伝達媒体、１９，２０…くさびガ
ラス、２１…固体撮像装置、２２…基準板面、２
３…接着剤、２４，２５…くさびガラス、２６…
パツケージ、２７…固体撮像素子、２８…カバー
ガラス、２９…ワイヤボンデイング、３０…接続
ピン、３１…固体撮像装置、３２…光伝達媒体、
３３…導電性接着剤、３４，３５…くさびガラス
。 Fig. 1 is a diagram showing an embodiment of the mounting mechanism of the solid-state imaging device according to this invention, Fig. 2 is a diagram showing the solid-state imaging device of the same embodiment, and Fig. 3 is a side cross section showing the structure of the solid-state imaging device. 4 are diagrams for explaining a three-plate color camera, and FIG. 5 is a diagram showing conventional mounting means for a solid-state imaging device. 11...Package, 12...Conductive adhesive, 13
... solid-state image sensor, 14 ... cover glass, 15 ... wire bonding, 16 ... connection pin, 17 ... prism, 18 ... optical transmission medium, 19, 20 ... wedge glass, 21 ... solid-state image sensor, 22 ... reference plate surface, 2
3... Adhesive, 24, 25... Wedge glass, 26...
Package, 27... Solid-state imaging device, 28... Cover glass, 29... Wire bonding, 30... Connection pin, 31... Solid-state imaging device, 32... Optical transmission medium,
33... Conductive adhesive, 34, 35... Wedge glass.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平面略四角形状のパツケージ内に固体撮像素子
を収容してなる固体撮像装置を、入射光を伝達す
る光伝達媒体に、位置調整を行つて取り付ける固
体撮像装置の取付機構において、前記パツケージ
の対向する２辺に、該パツケージの中央部から周
縁部に向かつて該パツケージの厚みを薄くするよ
うに形成されるテーパ部と、前記パツケージに形
成された２つのテーパ部にそれぞれ対応して設け
られ、第１の面に前記光伝達媒体が接触され、第
２の面に前記テーパ部が接触されるくさび状位置
調整部材とを具備してなることを特徴とする固体
撮像装置の取付機構。 In a mounting mechanism for a solid-state imaging device in which a solid-state imaging device is mounted in a package having a substantially rectangular planar shape and a solid-state imaging device is mounted on an optical transmission medium that transmits incident light by adjusting the position of the solid-state imaging device, A tapered portion is provided on two sides of the package so as to reduce the thickness of the package from the center toward the peripheral edge, and a tapered portion is provided on two sides of the package, corresponding to each of the two tapered portions formed on the package. 1. A mounting mechanism for a solid-state imaging device, comprising: a wedge-shaped position adjustment member having one surface in contact with the optical transmission medium and a second surface in contact with the tapered portion.
JP1989078870U 1989-07-04 1989-07-04 Pending JPH0317653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989078870U JPH0317653U (en) 1989-07-04 1989-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989078870U JPH0317653U (en) 1989-07-04 1989-07-04

Publications (1)

Publication Number Publication Date
JPH0317653U true JPH0317653U (en) 1991-02-21

Family

ID=31622524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989078870U Pending JPH0317653U (en) 1989-07-04 1989-07-04

Country Status (1)

Country Link
JP (1) JPH0317653U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006297492A (en) * 2005-04-15 2006-11-02 Kai R & D Center Co Ltd Whetstone stand
JP2008103846A (en) * 2006-10-17 2008-05-01 Sony Corp Imaging apparatus and manufacturing method thereof
JP2014222910A (en) * 2007-09-05 2014-11-27 ジーブイビービー ホールディングス エス．エイ．アール．エル． System and method for fixing image sensor to beam splitter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006297492A (en) * 2005-04-15 2006-11-02 Kai R & D Center Co Ltd Whetstone stand
JP2008103846A (en) * 2006-10-17 2008-05-01 Sony Corp Imaging apparatus and manufacturing method thereof
JP2014222910A (en) * 2007-09-05 2014-11-27 ジーブイビービー ホールディングス エス．エイ．アール．エル． System and method for fixing image sensor to beam splitter

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