JPH0317907B2 - - Google Patents
Info
- Publication number
- JPH0317907B2 JPH0317907B2 JP60214758A JP21475885A JPH0317907B2 JP H0317907 B2 JPH0317907 B2 JP H0317907B2 JP 60214758 A JP60214758 A JP 60214758A JP 21475885 A JP21475885 A JP 21475885A JP H0317907 B2 JPH0317907 B2 JP H0317907B2
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- electrode
- processed
- cathode material
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は放電電極に係り、特にマグネトロン放
電を生じさせるための陰極ターゲツト構造を改良
した放電電極に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a discharge electrode, and more particularly to a discharge electrode with an improved cathode target structure for generating magnetron discharge.
第3図は従来のスパツタリング等に用いられる
放電電極を示したもので、真空容器1の内部に
は、電極部材としてターゲツト等の陰極材2が配
設され、この陰極材2の下面側には、マグネツト
3が配設されている。また、上記陰極材2の上面
側には、例えば50〜100mm以上の間隔を持つて被
処理物4が配置されており、上記陰極材2と被処
理物4との間には、、放電電源5が接続されてい
る。さらに、上記真空容器1の下面には、真空ポ
ンプ等の真空排気系統6および処理ガスを導入す
るガス系統7がそれぞれ接続されている。
FIG. 3 shows a discharge electrode used in conventional sputtering, etc. A cathode material 2 such as a target is disposed inside a vacuum container 1 as an electrode member, and the lower surface of this cathode material 2 is , magnet 3 are arranged. Further, on the upper surface side of the cathode material 2, an object 4 to be treated is arranged with an interval of, for example, 50 to 100 mm or more, and between the cathode material 2 and the object 4, a discharge power source is placed. 5 is connected. Furthermore, an evacuation system 6 such as a vacuum pump and a gas system 7 for introducing processing gas are connected to the lower surface of the vacuum container 1, respectively.
上記装置においては、陰極材2と被処理物4と
の間に放電電源5により高電圧を印加してプラズ
マ放電を発生させ、この放電により陰極材2の材
料を飛散させて被処理物4の表面に薄膜を形成す
るようになされる。 In the above apparatus, a high voltage is applied between the cathode material 2 and the object to be processed 4 by a discharge power source 5 to generate plasma discharge, and the material of the cathode material 2 is scattered by this discharge, and the object to be processed 4 is It is made to form a thin film on the surface.
しかし、上記装置の場合、放電空間を得るため
に陰極材2と被処理物4との間隔を大きく確保し
ているので、プラズマ放電により飛散する陰極材
2材料が、被処理物4の表面以外の部分例えば真
空容器1の内壁等に付着してしまい、真空容器1
の汚染、ゴミの発生あるいは真空排気の遅延等を
招いていた。 However, in the case of the above-mentioned apparatus, since a large distance is secured between the cathode material 2 and the object to be treated 4 in order to obtain a discharge space, the material of the cathode material 2 scattered by plasma discharge is removed from the surface of the object to be treated 4. For example, the part may adhere to the inner wall of the vacuum container 1, and the vacuum container 1
This caused contamination, generation of dust, and delays in evacuation.
本発明は上記した点に鑑みてなされたもので、
不必要な部分への陰極材材料の飛散を防止するこ
とのできる放電電極を提供することを目的とする
ものである。
The present invention has been made in view of the above points, and
The object of the present invention is to provide a discharge electrode that can prevent cathode material from scattering to unnecessary parts.
上記目的を達成するるため、本発明に係る放電
電極は、陰極としての電極部材と陽極としての被
処理物との間に高電圧を印加することによりプラ
ズマ放電を発生させる放電電極において、上記電
極部材を一方に開口した有底筒状に形成するとと
もに、この開口のほぼ全域を閉塞する大きさに構
成した上記被処理物を該被処理物の周縁部におい
て上記開口に近接させて配置して、上記電極部材
と上記被処理物との間に上記電極部材および被処
理物で囲まれた放電空間を形成してなり、上記放
電空間内に放電プラズマを閉じ込めるようになさ
れている。
In order to achieve the above object, a discharge electrode according to the present invention is a discharge electrode that generates plasma discharge by applying a high voltage between an electrode member as a cathode and a workpiece as an anode. The member is formed into a bottomed cylindrical shape with an opening on one side, and the object to be processed is configured to have a size that closes almost the entire area of the opening, and the object to be processed is arranged close to the opening at the periphery of the object to be processed. A discharge space surrounded by the electrode member and the object to be processed is formed between the electrode member and the object to be processed, and discharge plasma is confined within the discharge space.
以下、本発明の実施例を第1図および第2図を
参照して説明する。
Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.
第1図は本発明に係る放電電極の一実施例を示
したもので、陰極材2の外周上方側に、同一材料
からなる他の筒状の陰極材8を設け、これら陰極
材2,8に囲まれた内側部分に放電空間9を形成
するようになされている。上記筒状の陰極材8の
上端は、被処理物4に近接して配置され、該上端
と被処理物4との間隔は放電プラズマが陰極材
2,8の外側に放出されないよう例えば2〜5mm
程度に形成されている。また、上記筒状の陰極材
8の外周側には、この陰極材8の内側部分に磁界
を発生させるためのマグネツト10が配設されて
いる。 FIG. 1 shows an embodiment of the discharge electrode according to the present invention, in which another cylindrical cathode material 8 made of the same material is provided above the outer periphery of the cathode material 2. A discharge space 9 is formed in an inner portion surrounded by. The upper end of the cylindrical cathode material 8 is placed close to the object to be processed 4, and the distance between the upper end and the object to be processed 4 is, for example, 2 to 5mm
It is formed to a certain extent. Further, a magnet 10 for generating a magnetic field inside the cathode material 8 is disposed on the outer circumferential side of the cylindrical cathode material 8.
なお、上記各陰極材2,8は、一体に形成する
ようにしてもよいし、放電プラズマが放電空間9
内に閉じ込められるのであれば、各陰極材2,8
の間に間〓を設けるようにしてもよい。 The cathode materials 2 and 8 may be formed integrally, or the discharge plasma may be formed in the discharge space 9.
If each cathode material 2, 8
A space may be provided in between.
本実施例においては、放電電源5により各陰極
材2,8と被処理物4との間に高電圧を印加し
て、各陰極材2,8の内側すなわち放電空間9内
にプラズマ放電を発生させ、陰極材2,8の材料
を飛散させる。このとき、放電プラズマは放電空
間9内に閉じ込められ、陰極材2,8の材料は放
電空間9の外側には飛散しない。 In this embodiment, a high voltage is applied between each of the cathode materials 2 and 8 and the object to be treated 4 by the discharge power source 5, and plasma discharge is generated inside each of the cathode materials 2 and 8, that is, in the discharge space 9. to scatter the materials of the cathode materials 2 and 8. At this time, the discharge plasma is confined within the discharge space 9, and the materials of the cathode materials 2 and 8 are not scattered outside the discharge space 9.
したがつて、被処理物4の表面のみに陰極材
2,8材料を付着させることができ、真空容器内
壁等不要な部分を汚染することがない。さらに、
上記のように不要部分へ陰極材材料が飛散しない
ので、第2図に示すように、従来のものと比較し
て、被処理物4の外周部における膜厚分布を大幅
に改善することができる。 Therefore, the cathode materials 2 and 8 can be attached only to the surface of the object 4, and unnecessary parts such as the inner wall of the vacuum container are not contaminated. moreover,
Since the cathode material does not scatter to unnecessary parts as described above, the film thickness distribution at the outer periphery of the object to be treated 4 can be significantly improved compared to the conventional method, as shown in FIG. .
以上述べたように本発明に係る放電電極は、電
極部材と被処理物とをわずかな間〓を有するよう
に配置するとともに、上記電極部材と被処理物と
に囲まれた放電空間を形成してなり、上記放電空
間内に放電プラズマを閉じ込めるようにしたの
で、電極部材の材料が不要な部分に飛散すること
を防ぐことができ、被処理物表面のみに上記材料
を付着させることができる。したがつて、真空容
器内の汚染やゴミの発生時を有効に防止すること
ができ、膜厚分布を向上させることができる等の
効果を奏する。
As described above, in the discharge electrode according to the present invention, the electrode member and the object to be treated are arranged with a slight distance between them, and a discharge space is formed surrounded by the electrode member and the object to be treated. Since the discharge plasma is confined within the discharge space, the material of the electrode member can be prevented from scattering to unnecessary parts, and the material can be attached only to the surface of the object to be treated. Therefore, it is possible to effectively prevent the occurrence of contamination and dust in the vacuum container, and it is possible to achieve effects such as being able to improve the film thickness distribution.
第1図は本発明の一実施例を示す構成図、第2
図は本発明と従来のものとの膜厚分布を示す説明
図、第3図は従来の放電電極を示す構成図であ
る。
1…真空容器、2,8…陰極材、3,10…マ
グネツト、4…被処理物、5…放電電源、6…真
空排気系統、7…ガス系統、9…放電空間。
FIG. 1 is a configuration diagram showing one embodiment of the present invention, and FIG.
The figure is an explanatory diagram showing the film thickness distribution of the present invention and the conventional one, and FIG. 3 is a configuration diagram showing the conventional discharge electrode. DESCRIPTION OF SYMBOLS 1... Vacuum container, 2, 8... Cathode material, 3, 10... Magnet, 4... Treated object, 5... Discharge power supply, 6... Vacuum exhaust system, 7... Gas system, 9... Discharge space.
Claims (1)
物との間に高電圧を印加することによりプラズマ
放電を発生させる放電電極において、上記電極部
材を一方に開口した有底筒状に形成するととも
に、この開口のほぼ全域を閉塞する大きさに構成
した上記被処理物を該被処理物の周縁部において
上記開口に近接させて配置して、上記電極部材と
上記被処理物との間に上記電極部材および被処理
物で囲まれた放電空間を形成したことを特徴とす
る放電電極。1. In a discharge electrode that generates plasma discharge by applying a high voltage between an electrode member as a cathode and a workpiece as an anode, the electrode member is formed into a bottomed cylindrical shape with an opening on one side, and The object to be processed is configured to have a size that closes almost the entire area of the opening, and the object to be processed is arranged close to the opening at the peripheral edge of the object, and the electrode is placed between the electrode member and the object to be processed. A discharge electrode characterized by forming a discharge space surrounded by a member and an object to be treated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21475885A JPS6277460A (en) | 1985-09-30 | 1985-09-30 | Discharge electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21475885A JPS6277460A (en) | 1985-09-30 | 1985-09-30 | Discharge electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6277460A JPS6277460A (en) | 1987-04-09 |
| JPH0317907B2 true JPH0317907B2 (en) | 1991-03-11 |
Family
ID=16661067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21475885A Granted JPS6277460A (en) | 1985-09-30 | 1985-09-30 | Discharge electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6277460A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2761875B2 (en) * | 1987-08-25 | 1998-06-04 | キヤノン株式会社 | Deposition film forming equipment by bias sputtering method |
| IT1211938B (en) * | 1987-11-27 | 1989-11-08 | Siv Soc Italiana Vetro | APPARATUS AND PROCEDURE FOR THE DEPOSITION OF A THIN LAYER ON A TRANSPARENT SUBSTRATE, IN PARTICULAR FOR THE REALIZATION OF GLASS |
| JPH03247761A (en) * | 1990-02-23 | 1991-11-05 | Yoshihisa Nakamura | Sputtering target device |
| GB9006073D0 (en) * | 1990-03-17 | 1990-05-16 | D G Teer Coating Services Limi | Magnetron sputter ion plating |
| US5496455A (en) * | 1993-09-16 | 1996-03-05 | Applied Material | Sputtering using a plasma-shaping magnet ring |
| SG171398A1 (en) * | 2008-12-15 | 2011-07-28 | Ulvac Inc | Sputtering apparatus and sputtering method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH659484A5 (en) * | 1984-04-19 | 1987-01-30 | Balzers Hochvakuum | ARRANGEMENT FOR COATING SUBSTRATES BY CATHODE SPRAYING. |
-
1985
- 1985-09-30 JP JP21475885A patent/JPS6277460A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6277460A (en) | 1987-04-09 |
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