JPH0318167U - - Google Patents
Info
- Publication number
- JPH0318167U JPH0318167U JP7690489U JP7690489U JPH0318167U JP H0318167 U JPH0318167 U JP H0318167U JP 7690489 U JP7690489 U JP 7690489U JP 7690489 U JP7690489 U JP 7690489U JP H0318167 U JPH0318167 U JP H0318167U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating liquid
- laminate
- material particles
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- MEIDRGPPJVWRKW-UHFFFAOYSA-N [F].[Ni] Chemical compound [F].[Ni] MEIDRGPPJVWRKW-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は、ロータハウジングの内周面にニツケ
ル・フツ素複合メツキを施す本考案にかかる複合
メツキ装置のメツキ槽を、ロータハウジングの短
軸方向にみた正面断面説明図である。第２図は、
第１図に示すメツキ槽をロータハウジングの長軸
方向にみた側面断面説明図である。第３図は、上
側筒状部材と最上部のシール部材とを取り外した
状態における、第１図に示すメツキ槽の平面説明
図である。第４図は、第１図に示すメツキ槽のメ
ツキ液導入部を示す図である。第５図は、ニツケ
ル・フツ素複合メツキ層の密着性とピツト発生の
有無の、液導入距離およびメツキ液流量に対する
特性を示す図である。第６図は、メツキ槽内でメ
ツキ液を下向きに流通させるようにした、従来の
複合メツキ装置のシステム構成図である。
ＭＳ……メツキ槽、Ｄ……中心陽電極、Ｓ……
積層体、１〜５……第１〜第５ロータハウジング
、６……シール部材、７……上側筒状部材、８…
…下側筒状部材、９……内部空間部、１１……ア
ノード、１４……保護ネツト、１６……第１整流
板、１７……第２整流板。
FIG. 1 is an explanatory front cross-sectional view of a plating tank of a composite plating device according to the present invention for applying nickel-fluorine composite plating to the inner circumferential surface of a rotor housing, as seen in the short axis direction of the rotor housing. Figure 2 shows
FIG. 2 is a side cross-sectional explanatory view of the plating tank shown in FIG. 1 when viewed in the longitudinal direction of the rotor housing. FIG. 3 is an explanatory plan view of the plating tank shown in FIG. 1 with the upper cylindrical member and the uppermost seal member removed. FIG. 4 is a diagram showing a plating liquid introduction part of the plating tank shown in FIG. 1. FIG. 5 is a diagram showing the characteristics of the adhesion of the nickel/fluorine composite plating layer and the presence or absence of pitting as a function of the liquid introduction distance and the plating liquid flow rate. FIG. 6 is a system configuration diagram of a conventional composite plating device in which the plating liquid is caused to flow downward in the plating tank. MS...Metsuki tank, D...Center positive electrode, S...
Laminated body, 1 to 5... First to fifth rotor housing, 6... Seal member, 7... Upper cylindrical member, 8...
... lower cylindrical member, 9 ... internal space section, 11 ... anode, 14 ... protection net, 16 ... first rectifier plate, 17 ... second rectifier plate.
Claims (1)
る積層体の内部空間部に、複合材料粒子を含むメ
ツキ液を充填し、被処理物の内周面に複合材料粒
子を含有する複合メツキを施すようにした複合メ
ツキ装置において、 積層体の内部空間部を流路としてメツキ液を流
すメツキ液流通手段を設ける一方、積層体の内部
空間部に中心陽電極を配置し、該中心陽電極に、
積層体の内部空間部に螺旋状のメツキ液の流れを
生じさせる整流板を設けたことを特徴とする複合
メツキ装置。[Claim for Utility Model Registration] A plating liquid containing composite material particles is filled into the internal space of a laminate formed by stacking a plurality of cylindrical objects to be processed, and the inner peripheral surface of the objects to be processed is coated with plating liquid containing composite material particles. In a composite plating device that performs composite plating containing composite material particles, a plating liquid distribution means is provided to flow the plating liquid through the inner space of the laminate as a flow path, and a center positive electrode is provided in the inner space of the laminate. is placed on the central positive electrode,
A composite plating device characterized by being provided with a rectifying plate that causes a spiral flow of plating liquid in the internal space of the laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076904U JPH072612Y2 (en) | 1989-06-29 | 1989-06-29 | Compound plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076904U JPH072612Y2 (en) | 1989-06-29 | 1989-06-29 | Compound plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0318167U true JPH0318167U (en) | 1991-02-22 |
| JPH072612Y2 JPH072612Y2 (en) | 1995-01-25 |
Family
ID=31618794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989076904U Expired - Lifetime JPH072612Y2 (en) | 1989-06-29 | 1989-06-29 | Compound plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH072612Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893896A (en) * | 1981-11-30 | 1983-06-03 | Matsushita Electric Works Ltd | Composite plating device |
| JPS6025758U (en) * | 1983-07-27 | 1985-02-21 | マツダ株式会社 | Internal plating device for articles |
-
1989
- 1989-06-29 JP JP1989076904U patent/JPH072612Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893896A (en) * | 1981-11-30 | 1983-06-03 | Matsushita Electric Works Ltd | Composite plating device |
| JPS6025758U (en) * | 1983-07-27 | 1985-02-21 | マツダ株式会社 | Internal plating device for articles |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH072612Y2 (en) | 1995-01-25 |
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