JPH03184625A - Method and device for working plate - Google Patents

Abstract

PURPOSE:To work a plate with satisfactory working accuracy by executing the plate working after bringing a reference hole of a work to image pickup and correcting its shift quantity, at the time of inverting the work and executing the plate working, after executing the plate working to a large work exceeding the maximum working area. CONSTITUTION:At the time of inverting a plate W and executing its working after executing the working to a large plate W exceeding the maximum working area, a reference hole 0 made in the plate W is brought to image pickup by a movable image pickup device 19. Subsequently, data by this reference hole 0 brought to image pickup is corrected by an image processor 27 and transferred to an NC device 15, and working is executed by NC control. Accordingly, even if the working is executed by inverting the plate W, such shifts as a variance of a dimension of the plate W and an error from a machine origin, etc., are brought to correction processing, therefore, the working is executed with satisfactory working accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a plate processing method and apparatus for processing a large workpiece larger than the maximum processing area with good processing accuracy.

(Prior art) In general, in a laser processing device used as a plate processing machine, for example, a laser beam oscillated by a laser oscillator is focused by a condensing lens provided in a processing head, and the focused laser beam is directed onto a workpiece. It is designed to perform laser processing by irradiating it.

In addition, an NC device is attached to the laser processing equipment, and by numerically controlling the workpiece or the laser optical axis, the cape and the laser optical axis can be moved relatively, and the workpiece can be processed into a predetermined planar shape. It looks like this.

Furthermore, in order to perform laser processing with good processing accuracy by correcting dimensional variations in the workpiece to be machined and alignment deviations of the laser beam, an imaging device is installed near the processing head, and an imaging device is installed in the vicinity of the processing head. An image processing device is connected to the imaging device to image the reference hole and perform correction processing.

(Problem to be Solved by the Invention) By the way, if the size of the workpiece is within the maximum processing area, laser processing with good processing accuracy can be performed using conventional laser processing equipment, but if the workpiece is larger than the maximum processing area, Therefore, laser processing cannot be performed at once. Therefore, after performing laser processing on the work before being turned over, the work is turned over and laser processing is performed on the portions that could not be processed.

However, when performing laser processing by inverting a large workpiece larger than the maximum machining area, since the reference position is not imaged by the imaging device, the size of the workpiece varies, so the correction amount after inversion is - Therefore, the amount of correction will be different. In addition, due to misalignment of the laser beam, the processing point (
The position of the focus point of the laser beam is not constant over time, and the above-mentioned correction amount after inversion can only be used continuously for a very short time.

Furthermore, since the program is created in an inverted form when programming the product shape, there is a problem that the program becomes complicated.

The purpose of this invention is to improve the above-mentioned problems, and when machining a plate over the maximum machining area by inverting the work, it is necessary to It is an object of the present invention to provide a plate processing method and an apparatus therefor, which allow plate processing with good processing accuracy by correcting deviations that occur.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for processing a large workpiece larger than the maximum machining area, and then inverting the workpiece to perform the plate processing. , is a plate material processing method in which a reference hole drilled in a workpiece is imaged with an imaging device, the amount of deviation is corrected, and then the plate material is processed.

In addition, this invention clamps a workpiece in which reference holes have been drilled in advance to serve as references before and after reversal, and
A movable workpiece clamp that can be moved in the axial and Y-axis directions, a processing head provided on a frame installed on the processing table to perform plate processing, and a reference hole for the workpiece provided on one side of the frame. a movable imaging device that takes an image of the reference hole; an image processing device that uses the imaging device to take an image of the reference hole and performs correction processing on at least a reference position for processing the plate material after inversion; and a reference that has been corrected with the image processing device. Transfer position data and based on this data N
A plate processing apparatus was constructed by including an NC device for C control.

(Function) By using the plate processing method and apparatus of the present invention, when processing a large workpiece larger than the maximum machining area, and then inverting the workpiece to perform plate processing, the reference hole made in the workpiece can be The hole is imaged by a movable imaging device, data based on the imaged reference hole is corrected by an image processing device and transferred to an NC device, and the plate material is processed under NC control.

Therefore, even if a workpiece larger than the maximum machining area is reversed and plate material is machined, deviations such as variations in workpiece dimensions and errors from the machine origin are corrected, so plate material processing with good processing accuracy can be performed. It will be done.

(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.

Referring to FIG. 1, for example, a laser processing apparatus 1 as a plate processing machine includes a laser oscillator 5 located behind a frame 3, a beam member 7 extending horizontally in front of the frame 3, and a laser oscillator 5 located behind a frame 3; A processing head provided in front of and below the beam member 7 and an optical system (not shown in FIG. 3 in detail in FIG. 3) that guides the laser beam oscillated by the laser oscillator 5 to the processing head 9. ), a processing table 11 fixedly disposed below the processing head 9 at a predetermined distance, and the like.

Further, the laser processing device 1 is a workpiece that is placed on the processing table 11, grips a workpiece W, and moves the workpiece W in the X-axis and Y-directions to bring the processing position of the workpiece W directly below the processing head 9. It has a clamp 13 and an NC device 15 that numerically controls the work clamp 13 on table coordinates.

Furthermore, the laser processing apparatus 1 shown in this example is provided with one imaging device on one side of the beam member 7, which is movable along the guide rail 17 in the Y-axis direction by, for example, an appropriate driving means, and this imaging device There is a processing table 1 directly below one device.
An illumination device 21 is provided below the imaging device 19 and is movable as the imaging device 19 moves. A device 27 is provided. The illumination device 21 is connected to the image processing device 27 by an illumination power supply line 29.

As shown in FIG. 3, the laser oscillator 5 oscillates a laser beam LB. Then, the oscillated laser beam LB
The laser beam LBI is reflected by a mirror 31 provided in the beam member 7 toward a condensing lens 33 provided in the processing head 9, and the reflected laser beam LBI is condensed by the condensing lens 33, and the laser beam W The black dots are connected on the top surface of the image.

The optical axis 35 of the laser beam LB is initially adjusted to coincide with the processing axis 37. In the state shown in FIG. 3, a predetermined process, for example, a cutting process, is performed at three processing points (focal points) of the beam LB.

FIG. 4 shows an enlarged view of the case where the optical axis 35 is deviated from the processing axis 37. In this way, when the optical axis misalignment occurs, the three machining points will be shifted by δ from the intersection point 37' of the work W and the machining axis 37 (the point to be machined). If this deviation δ is left as it is, the machining accuracy will be degraded by this amount.

The NC device 15 controls the positioning of the workpiece W on the processing table 11 by causing the workpiece clamp 13 to grip the workpiece W. This control is the same as the well-known one, and by applying drive signals to the servo motors Mx and My (see FIG. 5) around the X and Y axes, which are not shown in FIG. This is done by driving a moving mechanism (not shown) to align the machining point of the workpiece W with the machining axis 37.

The imaging device 19 is composed of a CCD camera, an ITV camera, etc., converts the captured image into a video signal, and outputs the video signal to the video signal line 23.

The mounting position of the imaging device 19 and details of the imaging method will be explained with reference to FIG.

The mounting position of one imaging device is on the side surface of the beam member 7 at a predetermined position (Xo, Yo) on the table coordinates. The origin (reference point) of the workpiece W is coincident with the origin 0 (0°O) of the table coordinates XY at the start of machining. One imaging device is located at the mounting position (Xo
, Yo), the surface state of the workpiece W, for example, the state in which a hole has been drilled, is imaged at a predetermined magnification. For this purpose, a hole of a predetermined size is drilled directly below the image pickup device 19 of the processing table 11, and a lighting device 21 such as an incandescent lamp or a fluorescent lamp is installed directly below the hole to capture a high-contrast image. is installed in an upward position.

As shown in the fifth factor, the image processing device 27 includes a binarization circuit 41, a frame memory 43, a CPU 45, and a ROM 4.
7, RAM 49, and input/output device 51.

The binarization circuit 41 converts the video signal, which is an analog signal, into 1,
This digital signal is digitized into a 0 code and stored in the frame memory 43 as image data. As shown in FIG. 6, the frame memory 43 stores a 1°0 signal in each pixel corresponding to the black and white portion of the image. Let the physical coordinates of the frame memory 43 be xy. This coordinate x
y is the mounting position (X
The coordinates (xo, yo) are made to correspond to the coordinates (xo, yo), and the relationship of displacement is as follows: X=kx−x Y −y−ky −−■. kx and ky are constants determined by the equivalent distance per pixel and the magnification of the imaging device 19.

The ROM 47 stores programs for arithmetic processing. The input/output device 51 is connected to the bus 53 of the image processing device 27 and the internal input/output device of the NC device 15, and has the role of transmitting a start signal from the NC device 15 and a data signal to the NC device 15. Do it. In addition, the input/output device 5
1 is connected to the relay R of the lighting device 21,
The image processing device 27 is capable of driving the ray R at the time of imaging to light up the illumination device 21.

In the laser processing apparatus 1 having the above configuration, the origin correction process of the NC device for dealing with the optical axis shift will be described.

In FIG. 8, step S1 indicates a determination to start execution of origin correction.

Execution of the origin correction process is started by the operator's finger, for example, immediately after the start of machining, or in the morning and afternoon of every day, or at any time when optical axis deviation is thought to have occurred, using the keyboard, etc. It is started by command.

In step S2, the servo motors Mx and M shown in FIG.
y is driven by the NC device 15, the clamp device 13 is moved, and then the center of the workpiece W is set to (Xo, yo)
This shows the process of making a hole of a size that falls within the field of view of the imaging device (camera) 19.

This hole is formed by moving the workpiece W to the position indicated by W' as shown in FIG.

In step 3, after drilling a reference hole, for example, at the point (Xo, Yo) of the work W, the work clamp 13 moves the center of the reference hole (Xo, Yo) to the imaging device (camera) 19.
Bring it directly below.

Step S4 shows a process in which a drive signal is output from the NC device 15 to the image processing device 27, and the hole is imaged with one imaging device (camera). In step S5, the image captured by the image capturing device 19 is converted into a video signal by the action of the binarization circuit 41 explained in FIG.
3 shows the storage process.

In this way, a diagram as shown in FIG. 7 is drawn on the physical coordinates xy of the frame memory 43 shown in FIG. Reference numeral 55 indicates the shape of a reference hole drilled at the point (X□, Yo) of the workpiece W.

Therefore, in step S6, the image processing device 27
Then, the center (center of gravity) xG, yG of the reference hole 55 is calculated. Second, in step S7, the deviation amounts ΔX and Δy between the reference hole center (x G, y G) and the center (xo, yo) of the imaging device (camera) 19 are calculated.

Δx−xG−xo, ΔV −Y G−YO”””■ Then, thirdly, in step S8, the deviation amounts ΔX, Δy
■Constant kx for coordinate transformation shown in formula.

By multiplying by kY, the amount of deviation △X, △Y in table coordinates XY is calculated.

ΔX-kx・△X, △y-ky・△y・・・−
(2) Step S9 indicates a process of outputting the data shown in formula (2) to the NC device 15 via the input/output device 51 shown in FIG. In step S10, the NC device 15
Input this data, offset the origin by △X, ΔY, and then cross the optical axis 35 and the workpiece W shown in Fig. 4 (
The machining axis 37 is moved to the machining point) under numerical control, and subsequent control is performed as if no optical axis deviation had occurred.

Since data input to the NC device 15 is automatically performed via the control signal line 25, the processing results are displayed on the image processing device 27, and the operator sees this display and key-in the displayed data. The processing is faster compared to
It's easy.

Next, as shown in FIGS. 9(A) and 9(B), the maximum machining area is LAXLB, and the size of the workpiece W is, for example, 2LAXLB.
When laser processing the curve G at the time of LB, the first
This is carried out based on the flowchart shown in FIG.

First, in FIG. 10, in step Sit, the imaging device 1
9 is moved in the +Y-axis direction, for example, by a distance YS. In step 512, the laser position is corrected to align the optical axis 35 of the laser beam LB in the processing head 9 with the processing axis 37. In step S13, the workpiece W (2LAXLB) is set in the laser processing apparatus 1 as shown in FIG. 9(A).

Next, in step S14, the coordinate position (XI, y) of the work W tilted at an angle θ from the machine origin 0 (0, 0) is moved directly below the machining axis 37 of the laser beam LB to machine the reference hole H. In step S15, the NC device 15 is activated to process a part of the curve G using the pre-reversed Niprogram.

When the machining before reversal is completed, in step 516, the process shown in FIG. 9 (
As shown in B), the workpiece W is removed from the workpiece clamp 13 by performing a return to origin, and the workpiece W is
is inverted (rotated 180 degrees) and positioned, and the workpiece W is clamped to the workpiece clamp 13. Reference hole H at this time
has moved to H' in FIG. 9 (B:).

In step 518, the reference hole H' is moved to the position indicated by the dotted line and directly below the imaging device 19 (xO, yO+ys), and the imaging device 19 images the reference hole H', and the image processing device 27 uses the deviation data. is processed and NC device 1
Transfer to 5. In step S19, the NC device 15 corrects the deviation, and the inverted program is subjected to coordinate rotation processing. (The coordinate position of the reference hole H' is (XI, -yl, θ+180℃
It is. ) In step S20, the remainder of the curve G is processed using the program after inversion. Thus, the machining of the curve G is completed.

In this way, even if the workpiece W is larger than the maximum machining area, it is inverted, the reference hole H is imaged by the imaging device 19, and the amount of deviation is corrected, thereby achieving good machining accuracy even if there are variations in the dimensions of the workpiece W. Laser processing can be performed.

Furthermore, as shown in FIGS. 11(A) and (B), the maximum machining area is LAXLB, and the size of the workpiece W is (LAxL
C) XLB (However, LC<LA) (7) When the reference hole is drilled at the HI position, the workpiece W is reversed based on the procedure explained in Fig. 9 (A) and (B). Laser processing can be performed using Also, when the reference hole is drilled at the position H2 (H2), the imaging device 19
Since it is possible to carry out the process in a fixed state without moving it in the +Y-axis direction, it is possible to perform the process from step S12 without performing step Sll in the flowchart of FIG. 10 described above.

Note that this invention is not limited to the embodiments described above, and can be implemented in other forms by making appropriate changes. In this example, the reference hole H (H,, H
In 2), the workpiece W is set in the laser processing device 1 and the reference holes (HI, H2) are drilled before the laser processing is performed before reversing, but the reference holes (HI, H2) may be pre-drilled before the laser processing is performed. do not have. In this case, when performing laser processing before reversal, it is necessary to image the reference hole H (HI, H2) with the imaging device 19 and correct the amount of deviation. Further, in this embodiment, the plate material processing apparatus is described as a laser processing apparatus, but it is applicable to any workpiece moving type processing machine such as a turret punch press.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, plate processing is performed on a workpiece that is thicker than the maximum processing area, and then the workpiece is reversed to perform plate processing. At this time, a reference hole drilled in the workpiece is imaged by a movable imaging device, data from the imaged reference hole is corrected by an image processing device and transferred to an NC device, and NCr#
Plate material processing is performed by controlling 4.

Therefore, even if a workpiece larger than the maximum machining area is reversed and plate material processing is performed, deviations such as variations in workpiece dimensions and errors from the machine origin are corrected, so plate material processing with good processing accuracy can be performed. be able to.

[Brief explanation of drawings]

FIG. 1 is a perspective view of, for example, a laser processing device as a plate material processing device according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of the mounting position of the imaging device, and FIGS. 3 and 4 are explanatory diagrams of the front spindle. figure,
Fig. 5 is a block diagram of the optical axis deviation amount detection device, Fig. 6 is an explanatory diagram of the frame memory, Fig. 7 is an explanatory diagram of the optical axis deviation amount calculation method, Fig. 8 is a flowchart of the origin correction process, and Fig. 9 is an explanatory diagram of the optical axis deviation amount calculation method.
Figures (A) and (B) are explanatory diagrams when laser processing is performed by inverting a large workpiece larger than the maximum processing area, and Figure 10 is an illustration of inverting the workpiece shown in Figures 9 (A) and (B). Flowchart for performing laser processing, FIG. 11 (A),
(B) is an explanatory diagram in which the workpiece is reversed and τ laser processing is performed instead of FIGS. 9(A) and (B).

Claims (2)

[Claims] (1) When machining a workpiece larger than the maximum machining area, and then turning the workpiece over and machining the workpiece, use an imaging device to image the reference hole drilled in the workpiece and correct the amount of deviation. A plate processing method characterized by performing plate processing. (2) A movable work clamp that clamps a workpiece with a reference hole drilled in advance to serve as a reference before and after reversal and moves it on the processing table in the X-axis and Y-axis directions; a processing head provided on a frame for processing plate materials; a movable imaging device provided on one side of the frame for taking an image of the reference hole of the work; and a movable imaging device provided on one side of the frame for taking an image of the reference hole. An image processing device that corrects the reference position for processing the plate material after reversal, and an N that transfers the data of the reference position corrected by this image processing device and performs NC control based on this data.
A plate processing device comprising: C device.