JPH0318960U - - Google Patents
Info
- Publication number
- JPH0318960U JPH0318960U JP7660889U JP7660889U JPH0318960U JP H0318960 U JPH0318960 U JP H0318960U JP 7660889 U JP7660889 U JP 7660889U JP 7660889 U JP7660889 U JP 7660889U JP H0318960 U JPH0318960 U JP H0318960U
- Authority
- JP
- Japan
- Prior art keywords
- needle
- solder
- spatula
- spread
- supply device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る半田塗布装置の一実施例
を示す構成図、第２図は第１図装置を用いて塗布
動作を行う様子を示す図、第３図はリフロー後の
半田付の状態を示す部分拡大図、第４図は従来の
半田塗布装置による塗布動作を示す図、第５図お
よび第６図は従来の半田塗布装置を用いた場合の
半田付の状態を示す図である。
１……ニードル、２……供給装置、３……へら
、５１……半田。
Figure 1 is a configuration diagram showing an embodiment of the solder applicator according to the present invention, Figure 2 is a diagram showing how the solder coating operation is performed using the apparatus shown in Figure 1, and Figure 3 is a diagram showing the soldering operation after reflow. FIG. 4 is a diagram showing a coating operation using a conventional solder applicator, and FIGS. 5 and 6 are diagrams showing a soldering condition using a conventional solder applicator. . 1... Needle, 2... Supply device, 3... Spatula, 51... Solder.
Claims (1)
田を供給する供給装置と、前記ニードルの移動方
向における後方近傍に設けられたへらとを備え、
前記ニードルにより塗布された半田が前記へらに
よつて塗り伸ばされるように構成したことを特徴
とする半田塗布装置。 A needle for discharging solder, a supply device for supplying solder to the needle, and a spatula provided near the rear in the moving direction of the needle,
A solder coating device characterized in that the solder applied by the needle is spread by the spatula.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7660889U JPH0318960U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7660889U JPH0318960U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0318960U true JPH0318960U (en) | 1991-02-25 |
Family
ID=31618231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7660889U Pending JPH0318960U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0318960U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143760A (en) * | 1985-12-04 | 1986-07-01 | Hitachi Ltd | Reduction projecting and exposing device |
| JPS63215373A (en) * | 1987-03-05 | 1988-09-07 | Toshiba Corp | Creamy solder coating device |
-
1989
- 1989-06-29 JP JP7660889U patent/JPH0318960U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143760A (en) * | 1985-12-04 | 1986-07-01 | Hitachi Ltd | Reduction projecting and exposing device |
| JPS63215373A (en) * | 1987-03-05 | 1988-09-07 | Toshiba Corp | Creamy solder coating device |
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