JPH03196681A - Photovoltaic device - Google Patents
Photovoltaic deviceInfo
- Publication number
- JPH03196681A JPH03196681A JP1337370A JP33737089A JPH03196681A JP H03196681 A JPH03196681 A JP H03196681A JP 1337370 A JP1337370 A JP 1337370A JP 33737089 A JP33737089 A JP 33737089A JP H03196681 A JPH03196681 A JP H03196681A
- Authority
- JP
- Japan
- Prior art keywords
- unit power
- light
- back electrode
- paste
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000010248 power generation Methods 0.000 claims description 12
- 239000000470 constituent Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は、太陽光発電等に利用される光起電力装置に関
する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a photovoltaic device used for solar power generation and the like.
(ロ)従来の技術
透光性絶縁基板上に、複数の単位発電素子を形成し、そ
れら複数の単位発電素子を互いに電気的に直列接続する
ことによ−って、直列接続段数に応じた出力電圧の光起
電力装置が得られる。斯る直列接続形態として、隣接す
る一方の単位発電素子を構成する基板側の受光面1を極
と、他方の単位発電素子の背面電極を、互いに発電有効
領域から延在せしめ直接結合する方法が知られている(
特公昭62−14954号公報参照)。(b) Conventional technology By forming a plurality of unit power generation elements on a light-transmitting insulating substrate and electrically connecting the plurality of unit power generation elements to each other in series, it is possible to A photovoltaic device with an output voltage is obtained. As such a series connection form, there is a method in which the light-receiving surface 1 on the substrate side constituting one adjacent unit power generation element is made to extend from the effective power generation area to the pole and the back electrode of the other unit power generation element and are directly coupled to each other. Are known(
(See Japanese Patent Publication No. 62-14954).
しかし乍ら、この直列接続形態によれば、単位発電素子
の半導体膜を、直列接続が行なわれる隣接間隔部におい
て受光面電極を露出させるべく、フォトリングラフィに
よりパターニングする必要性があり、この7オトリング
ラフイによるパターニングは光起電力装置の大面積化を
阻害するばかりか、多くの工程を経なければならないた
めに低コスト化に対しても好ましくない。However, according to this series connection form, it is necessary to pattern the semiconductor film of the unit power generation element by photolithography in order to expose the light-receiving surface electrode in the adjacent interval part where the series connection is performed. Patterning by otolithography not only hinders the increase in the area of the photovoltaic device, but also requires many steps, which is not preferable for cost reduction.
そこで、本願出願人は大面積化及び低コスト化を実現す
べく、レーザビームを使用する手法を特願昭60−17
3684号(特開昭62−33477号公報)を出願し
た。即ち、受光面を極の直列接続予定箇所に導電ペース
トを塗布し、この導電ペーストに平行に近接して絶縁ペ
ーストを塗布した後、半導体膜をパターニングすること
なく上記導電ペースト、絶縁ペースト及び受光面電極を
含んで基板全面に形成し、引き続き背面電極を半導体膜
全面を被って形成する。最後に、背面電極側から導電ペ
ーストと絶縁ペーストが下層に位置する部位にレーザビ
ームが導電ペーストの部位を低エネルギ密度の照射条件
で照射され、背面電極と導電ペーストとが溶着されると
共に、絶縁ペースト上で背面電極と半導体膜が各単位発
電素子毎に物理的に分割される。Therefore, in order to realize a larger area and lower cost, the applicant of the present application proposed a method using a laser beam in a patent application filed in 1986-17.
No. 3684 (Japanese Unexamined Patent Publication No. 62-33477) was filed. That is, a conductive paste is applied to the light-receiving surface where the poles are planned to be connected in series, and an insulating paste is applied parallel to and close to the conductive paste. The semiconductor film including the electrode is formed over the entire surface of the substrate, and then the back electrode is formed to cover the entire surface of the semiconductor film. Finally, a laser beam is irradiated from the back electrode side to the area where the conductive paste and insulating paste are located in the lower layer under low energy density irradiation conditions, welding the back electrode and the conductive paste, and insulating the paste. On the paste, the back electrode and the semiconductor film are physically divided for each unit power generating element.
このような接続構造において、従来では、導電ペースト
としてAgペーストが使用され、背面電極としてAlが
用いられることが多い。In such a connection structure, conventionally, Ag paste is often used as the conductive paste, and Al is often used as the back electrode.
ところが、AgペーストとAl背面電極を用いた接続構
造では、光起電力装置を長時間高温にさらすと、接続部
においてAl背面電極が酸化されやすく、接続抵抗が増
大し、光起電力特性に悪影響を与えることが判明した。However, in a connection structure using Ag paste and an Al back electrode, if the photovoltaic device is exposed to high temperatures for a long time, the Al back electrode at the connection part is likely to be oxidized, increasing the connection resistance and adversely affecting the photovoltaic characteristics. It turned out to give.
斯るA2背面電極の酸化は、レーザビームによる溶着の
度合が低いとき特に著しい。従って、強固な溶着を得る
べくレーザビームのエネルギ密度を高めると、今度はレ
ーザビームが導電ペースト及び更に下層の受光面電極ま
でも破壊してしまうという問題点がある。Such oxidation of the A2 back electrode is particularly significant when the degree of welding by the laser beam is low. Therefore, if the energy density of the laser beam is increased in order to obtain strong welding, there is a problem that the laser beam will destroy the conductive paste and even the lower layer light-receiving surface electrode.
(ハ)発明が解決しようとする課題
本発明は上述の如く単位発電素子の直列接続形態として
、大面積化及び低コスト化に好適な導電ペーストと、エ
ネルギビームの照射による溶着を用いる際の、長時間高
温にさらすと光起電力特性が低下する点を解決せんとす
るものである。(c) Problems to be Solved by the Invention The present invention, as described above, uses a conductive paste suitable for increasing the area and reducing costs and welding by energy beam irradiation as a series connection form of unit power generating elements. This aims to solve the problem that photovoltaic properties deteriorate when exposed to high temperatures for a long period of time.
(ニ)課題を解決するための手段
本発明は、透光性絶縁基板上に、透光性受光面電極、半
導体膜及び背面電極の積層体からなる単位発電素子を複
数個配置し、一方の単位発電素子の受光面を極と半導体
膜との間に部分的に設けられた導電ペーストと、他方の
単位発電素子から延びる背面電極の延長部分との対向箇
所を、エネルギビームの照射により電気的に結きした光
起電力装置であって、上記課題を解決するために、上記
4電ペーストと背面電極はその構成材料として共通のA
lを含むことを特徴とする。(d) Means for Solving the Problems The present invention arranges a plurality of unit power generating elements each consisting of a laminate of a light-transmitting light-receiving surface electrode, a semiconductor film, and a back electrode on a light-transmitting insulating substrate, and one The light-receiving surface of the unit power generating element is electrically connected to the area where the conductive paste partially provided between the pole and the semiconductor film and the extension of the back electrode extending from the other unit power generating element are opposed by irradiation with an energy beam. In order to solve the above problems, the 4-electrode paste and the back electrode are made of a common A as their constituent material.
It is characterized by containing l.
(ホ)作 用
上述の如くエネルギビームの照射により電気的結合が行
なわれる導電ペーストと背面電極は、その構成材料とし
て共通のAIlを含むことによって、両者の密着性が向
上する。(E) Function As described above, the conductive paste and the back electrode, which are electrically coupled by irradiation with an energy beam, improve their adhesion by including Al as a common constituent material.
(へ)実施例
第1図は本発明による光起電力装置の一実施例の要部を
示しており、(1)はガラス等からなる透光性の絶縁基
板、(2a)、(2b)、(2c)はITO15n O
、に代表される透光性導電酸化物(TCO)の単層、或
いは積層体からなる受光面電極で、上記絶縁基板(1)
の−主面に全面に形成後、各個別の単位発電素子を構成
すべく矩形状にレーザビームの照射により分割される。(f) Embodiment FIG. 1 shows the main parts of an embodiment of a photovoltaic device according to the present invention, in which (1) is a transparent insulating substrate made of glass or the like, (2a), (2b) , (2c) is ITO15n O
A light-receiving surface electrode made of a single layer or a laminate of a translucent conductive oxide (TCO) represented by
After being formed on the entire main surface of , it is divided into rectangular shapes by irradiation with a laser beam to form individual unit power generation elements.
斯る受光面電極(2a)、(2b)、(2C)の分割パ
ターニングは大面積、例えば数IQcn+X数10(1
以上の装置については特に有効であるが10cmXIQ
cm程度或いはそれ以下の装置ではフォトリングラフィ
であっても良い。(3a)、(3b)、(3c)は上記
受光面電極(2a)、(2b)、(2c)の一方の隣接
対向辺に沿ってストリンア状に形成された導電ペースト
で、該導電ペースト(3a)、(3b)、(3C)はそ
の構成導電材料としてAlを含むAgペーストからなる
。(4a)、(4b)、(4C)は上記導電ペースト(
3a)、(3b)、(3C)に近接して平行に受光面電
極(2a)、(2b)、(2C)の隣接対向辺より内側
に設けられた5insペースト等の絶縁ペーストで、こ
れら絶縁ベース) (4a)、(4b)、(4c)及び
導電ペースト(3a)、 (3b)、(3C)はスクリ
ーン印刷法により膜厚(高さ)10〜20pm程度塗布
され、約550℃にて焼成される。The divided patterning of the light-receiving surface electrodes (2a), (2b), and (2C) is performed over a large area, for example, several IQcn+X several tens (1
It is particularly effective for the above devices, but 10cmXIQ
For devices on the order of cm or less, photolithography may be used. (3a), (3b), and (3c) are conductive pastes formed in a stringer shape along one adjacent opposing side of the light-receiving surface electrodes (2a), (2b), and (2c); 3a), (3b), and (3C) are made of Ag paste containing Al as a constituent conductive material. (4a), (4b), and (4C) are the above conductive pastes (
3a), (3b), and (3C), in parallel to the light-receiving surface electrodes (2a), (2b), and (2C) with an insulating paste such as 5ins paste provided on the inside of the adjacent opposing sides of the electrodes. Base) (4a), (4b), (4c) and conductive paste (3a), (3b), (3C) are applied to a film thickness (height) of about 10 to 20 pm by screen printing method, and heated at about 550°C. Fired.
(5a)、(5b)、(5c)は上記受光面電極(2a
)、(2b)、(2c)を覆う半導体膜で、その内部に
pin、pnの半導体接合を備えた単接合或いはタンデ
ム接合構造からなり、好適には大面積化に対応可能なプ
ラズマCVD法や光CVD法により形成された膜厚数1
000人乃至数pmの非晶シリコン系半導体膜から構成
されるが、多結晶シリコン半導体や更にはCdS等のカ
ドミウム系の半導体であっても良い。(5a), (5b), and (5c) are the light-receiving surface electrodes (2a).
), (2b), and (2c), and has a single junction or tandem junction structure with pin and pn semiconductor junctions inside, and is preferably formed by plasma CVD method or the like, which can be applied to a large area. Film thickness number 1 formed by photo-CVD method
Although it is composed of an amorphous silicon-based semiconductor film with a thickness of 1,000 pm to several pm, it may be a polycrystalline silicon semiconductor or even a cadmium-based semiconductor such as CdS.
(6a)、(6b)、(6c)は−F記事導体膜(5a
)、(5b)、(5c)上に積層されたAt、或いはA
I1合金の単層構造成いは他の導電材料の層との多層構
造の背面電極で、光入射側から見て受光面電極(2a)
、(2b)、(2c)、半導体膜(5a)、(5b)、
(5c)及び背面電極(6a)、(6b)、(6c)の
各積層体によって単位発電素子(SCI)、(SC,)
、(SC,)を構成する。そして斯る単位発電素子(S
CI)、(SC1)、(SCI)は、上記導電ペースト
(3a)、(3b)、(3c)、絶縁ペースト(4a)
、(4b)、(4c)及び受光面電極(2a)、(2b
)、(2C)を含んで絶縁基板(1)の−主面側に全面
に形成された半導体膜及び背面電極の積層体に対して、
先行技術に開示された如くレーザビームや電子ビームの
如きエネルギビームが導電ペースト(3a)、(3b)
、(3c)上にスポット的或いは連続的に照射され一方
の単位発電素子(SC,)、(SC,)、(SCs)の
背面電極(6a)、(6b)、(6c)と他方の単位発
を素子(SC,)、(SC1)・・・の受光面電極が電
気的に結合され、そして絶縁ペースト(4a)、(4b
)、(4c)」−に導電ペーストより高エネルギビーム
が照射されて上記全面に被着された半導体膜及び背面t
fiの積層体が各個別の単位発電素子(SC,)、(S
CI)、(SC3)毎に物理的に分離され、その結果第
1図に示す如く直列接続される。(6a), (6b), (6c) -F article conductor film (5a)
), (5b), (5c) stacked on At or A
The back electrode has a single layer structure of I1 alloy or a multilayer structure with layers of other conductive materials, and the light receiving surface electrode (2a) when viewed from the light incident side.
, (2b), (2c), semiconductor film (5a), (5b),
(5c) and the back electrodes (6a), (6b), (6c) unit power generation element (SCI), (SC,)
, (SC,) are constructed. And such a unit power generating element (S
CI), (SC1), (SCI) are the above-mentioned conductive pastes (3a), (3b), (3c) and insulating pastes (4a)
, (4b), (4c) and light-receiving surface electrodes (2a), (2b
), (2C) and a stack of semiconductor films and back electrodes formed entirely on the -main surface side of the insulating substrate (1),
As disclosed in the prior art, an energy beam such as a laser beam or an electron beam is applied to the conductive paste (3a), (3b).
, (3c) on the back electrodes (6a), (6b), (6c) of one unit power generating element (SC,), (SC,), (SCs) and the other unit. The light-receiving surface electrodes of the emitting elements (SC,), (SC1)... are electrically coupled, and the insulating pastes (4a), (4b)
), (4c)''- is irradiated with a high energy beam from the conductive paste and the semiconductor film and back surface t are deposited on the entire surface.
The laminated body of fi is each individual unit power generating element (SC,), (S
CI) and (SC3) are physically separated, and as a result, they are connected in series as shown in FIG.
而して、本発明の構成的特徴は、単位発電素子(SCI
)、(SCI)、(SC,)の直列接続を構成する導電
ペースト(3a)、(3b)、(3c)と背面電極(6
a)、(6b)、(6c)の構成材料として共通のA2
を含むことにある。即ち、従来AgペーストとAl背面
電極の溶着による結合は、その密着性が悪く高温信頼性
試験においてAl背面電極の接触部で酸化による接続抵
抗の増大を招いていた。ところが、導電ペースト(3a
)、(3b)、(3c)としてA2を含む導電材料を用
いることによって、背面電極(6a)、(6b)、(6
c)の密着性が向上する。従って、接続抵抗の減少が図
れる。Therefore, the structural feature of the present invention is that the unit power generating element (SCI)
), (SCI), (SC,) and the conductive pastes (3a), (3b), (3c) and the back electrode (6
A2 common as the constituent material of a), (6b), and (6c)
It is to include. That is, the conventional bonding between the Ag paste and the Al back electrode by welding had poor adhesion, which led to an increase in connection resistance due to oxidation at the contact portion of the Al back electrode in high-temperature reliability tests. However, conductive paste (3a
), (3b), (3c) by using a conductive material containing A2, the back electrodes (6a), (6b), (6
c) Adhesion is improved. Therefore, connection resistance can be reduced.
更に本発明者等は、Al背面電極(6a)、(6b)、
(6c)と、八!を含むAgペーストの導電ペースト(
3a)、(3b)、(3c)を用いて、90℃の高温信
頼性試験を施したところ、Alの含有量が5 W t%
では、約200時間経過後、FFfフィルファクタ)の
低下が見られ、1ooo時間経過では、切崩特性(エー
ジング後)の50%となった。ところがA110wt%
含有のAgペーストでは、1000時間経過でも、初期
特性と同等の値であった。尚、八!を含まないAgペー
ストにあっては、約100時間経過からFFが低下し、
約700時間で50%に低下した。従って、Agペース
トの場合1.A lの含有量が約10wt%以上で特に
特性の低下を抑制することが判明した。Furthermore, the present inventors have developed Al back electrodes (6a), (6b),
(6c) and eight! Conductive paste of Ag paste containing (
3a), (3b), and (3c) were subjected to a high-temperature reliability test at 90°C, and the Al content was 5 Wt%.
In this case, after about 200 hours, the FFf fill factor) decreased, and after 100 hours, it became 50% of the cutting property (after aging). However, A110wt%
The containing Ag paste had values equivalent to the initial characteristics even after 1000 hours. Nao, eight! In the case of Ag paste that does not contain, the FF decreases after about 100 hours,
It decreased to 50% in about 700 hours. Therefore, in the case of Ag paste, 1. It has been found that deterioration of properties is particularly suppressed when the Al content is about 10 wt% or more.
一方1.A lの含有量が上述の如く約10wt%以上
で高温による特性低下を抑制できるものの、当該Al含
有量が増大すると、今度は導電ペースト(3a)、(3
b)、(3C)とTCOの受光面電極(2a)、(2b
)、(2c)との接触抵抗が高くなり、光起電力特性を
損なう。斯る現象はAl含有量が低抵抗なAgを超える
と著しい。従って、Al含有量は50wt 135未満
が好ましく、より好適には30wt%以下、更に好適に
は20wt%以下が良い。On the other hand 1. As mentioned above, when the Al content is about 10 wt% or more, the deterioration of characteristics due to high temperature can be suppressed, but when the Al content increases, the conductive paste (3a), (3
b), (3C) and TCO light-receiving surface electrodes (2a), (2b
), the contact resistance with (2c) increases, impairing the photovoltaic properties. This phenomenon becomes remarkable when the Al content exceeds that of Ag, which has low resistance. Therefore, the Al content is preferably less than 50wt%, more preferably 30wt% or less, even more preferably 20wt% or less.
(トフ 発明の効果
以上の説明から明らかな如く、導電ペーストと背面電極
の構成材料として共通のAlを含むことによって、両者
の密着性が向上するので、長時間の高温放置による光起
電力特性の低下を抑制し得、耐熱性の優れた光起電力装
置を提供することができる。(Effects of the Invention) As is clear from the above explanation, by including Al as a common constituent material of the conductive paste and the back electrode, the adhesion between the two is improved, so that the photovoltaic properties of the conductive paste and the back electrode are improved by leaving them at high temperatures for a long time. It is possible to provide a photovoltaic device that can suppress deterioration and has excellent heat resistance.
第1図は本発明光起電力装置の一実施例の要部を示す断
面斜視図である。FIG. 1 is a cross-sectional perspective view showing essential parts of an embodiment of the photovoltaic device of the present invention.
Claims (1)
膜及び背面電極の積層体からなる単位発電素子を複数個
配置し、一方の単位発電素子の受光面電極と半導体膜と
の間に部分的に設けられた導電ペーストと、他方の単位
発電素子から延びる背面電極の延長部分との対向箇所を
、エネルギビームの照射により電気的に結合した光起電
力装置であって、上記導電ペーストと背面電極はその構
成材料として共通のAlを含むことを特徴とする光起電
力装置。(1) A plurality of unit power generation elements each consisting of a laminate of a light-transmitting light-receiving surface electrode, a semiconductor film, and a back electrode are arranged on a light-transmitting insulating substrate, and the light-receiving surface electrode and semiconductor film of one unit power generation element are A photovoltaic device in which a conductive paste partially provided between the opposing parts and an extension part of a back electrode extending from the other unit power generation element are electrically coupled by irradiation with an energy beam, A photovoltaic device characterized in that the conductive paste and the back electrode contain Al as a common constituent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337370A JPH03196681A (en) | 1989-12-26 | 1989-12-26 | Photovoltaic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337370A JPH03196681A (en) | 1989-12-26 | 1989-12-26 | Photovoltaic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03196681A true JPH03196681A (en) | 1991-08-28 |
Family
ID=18307983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1337370A Pending JPH03196681A (en) | 1989-12-26 | 1989-12-26 | Photovoltaic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03196681A (en) |
-
1989
- 1989-12-26 JP JP1337370A patent/JPH03196681A/en active Pending
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