JPH03197370A - Method for electrically joining ceramic hollow members to each other - Google Patents
Method for electrically joining ceramic hollow members to each otherInfo
- Publication number
- JPH03197370A JPH03197370A JP27941689A JP27941689A JPH03197370A JP H03197370 A JPH03197370 A JP H03197370A JP 27941689 A JP27941689 A JP 27941689A JP 27941689 A JP27941689 A JP 27941689A JP H03197370 A JPH03197370 A JP H03197370A
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- hollow members
- connected portion
- ceramic hollow
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000007767 bonding agent Substances 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 abstract 3
- 230000002093 peripheral effect Effects 0.000 abstract 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
〈産業上の利用分野〉
本発明は、セラミックス製中空部材同士の電気接合方法
に関するものである。
〈従来の技術と発明が解決しようとする問題点〉セラミ
ックス製中空部材の接合方法として、被接合部材間に接
合剤を介在させて突合せ、中空部材の外径側に対を成す
電極を配設し、前記中空部材または接合剤を介して電極
間に電流を通じることにより、中空部材または接合剤に
発生するジュール熱によって、突合せ部を加熱して接合
を行っていたが、この方法ではセラミックスの外径が大
きくなったり厚みが厚くなるとそれに伴い必要な電圧値
が大きくなり、設備の電気的絶縁性を高めねばならずコ
スト、安全性の点で問題があった。
く問題点を解決するための手段〉
上記の問題点を解決するために、本発明においてはセラ
ミックス製中空部材同士の突合せ部の内外に、それぞれ
内側導電部材及び外側導電部材を配設し、中空部材を介
して内側導電部材と外側導電部材との間に流す加熱用電
流の通電位置を前記突合せ部で円周方向に移動させつつ
、前記突合せ部全体を加熱して接合することを特徴とし
ている。
く作用及び実施例〉<Industrial Application Field> The present invention relates to a method for electrically joining ceramic hollow members to each other. <Prior art and problems to be solved by the invention> As a method for joining ceramic hollow members, the members to be joined are butted with a bonding agent interposed between them, and a pair of electrodes is arranged on the outer diameter side of the hollow member. However, by passing an electric current between the electrodes through the hollow member or the bonding agent, the abutting portions were heated and bonded using the Joule heat generated in the hollow member or the bonding agent, but this method As the outer diameter becomes larger or the thickness becomes thicker, the required voltage value increases accordingly, and the electrical insulation of the equipment must be improved, which poses problems in terms of cost and safety. Means for Solving the Problems> In order to solve the above problems, in the present invention, an inner conductive member and an outer conductive member are disposed inside and outside of the abutting portion of ceramic hollow members, respectively, and the hollow The heating current flowing between the inner conductive member and the outer conductive member via the member is moved in the circumferential direction at the abutting portion, and the entire abutting portion is heated and joined. . Effects and Examples>
【実施例1】
第1図(a)及び第1図(b)は、それぞれ本発明の方
法を実施する装置の概略横断面図及び縦断面図であり、
例えば丸パイプ形状のセラミックス製中空部材1a、l
bを上下方向に配置して接合する場合を示している。
まずセラミックス製中空部材1a、lb(φ60xφ4
0X100冨m)としてSi3N4セラミックスの突合
せ面に、CaF2.カオリンからなるペースト状の接合
剤2を塗布、乾燥し、これらを重ね合せて固定治具3a
、3bに固定した。
つぎに、セラミックス製中空部材1a、lbの内外に加
熱用電流を通電させるための例えば棒状の内側導電部材
4及び外側導電部材5a。
5bをそれぞれ突合せ部から1鰭程度の間隙を設けて対
向配置し、外側導電部材5a、5bと内側導電部材4と
の間にそれぞれ電源6a、6bを接続する。
また、突合せ部近傍を加熱するためのガスバーナ7a、
7bを外側導電部材5a、5bに取付ける。これら外側
導電部材5m、5b及び内側導電部材4とガスバーナ7
a、7bとがセラミックス製中空部材1a、lbの軸回
りに回転できる構造になっている。
今、接合雰囲気を大気とし、外側導電部材5m、5bと
内側導電部材4及びガスバーナ7a。
7bをセラミックス製中空部材の軸回りに1109rp
の回転数で回転させなからガスバーナで突合せ部近傍を
全周に亘って約800℃まで予熱すると接合剤の導電性
が高まり、その時点で外側導電部材5a、5bと内側導
電部材4との間に電源6g、6bにより約2000Vの
電圧を印加して0.8Aの加熱用電流を接合剤2に通電
し、通電位置を突合せ面の全周に亘って連続的に移動さ
せつつ、発生するジュール熱により突合せ面の近傍全体
を加熱し、接合剤とセラミックスを反応させた後、室温
まで冷却し接合を完了した。この試料より3X4X40
鰭の試験片を切出し4点曲げ試験を行った結果、300
M P aの曲げ強度であった。なお、内側導電部材
を設けない場合の通電開始電圧は約3700vであった
。
[実施例2]
12図(a)及び第2図(b)は、それぞれ本発明の方
法を実施する装置の概略横断面図及び縦断面図であり、
まず抵抗率が約10−1Ω・国のSiCセラミックスl
a、lb(φ40×φ24 X 30)の突合せ面に、
Ge粉末の接合剤2を塗布し、これらを重ね合せて固定
治具3g、3bに固定した。
つぎに、セラミックス部材の外周に沿った形状と略同形
状の一部から形成される4つの外側導電部材5c、5d
、5e、5f及び円板形状の内側導電部材41を、それ
ぞれセラミックスの突合せ部にカーボンペーストを塗布
して当接させ、電源6の切換端子8g、8b、8c、8
dと外側導電部材5c、5d、5e、5fとをそれぞれ
接続し、内側導電部材41と電源6のアース端子8eと
が接続される。電源6は4つの出力端子8a、8b、8
c、8dに任意の時間間隔で順次電圧を印加できる機能
を有している。
今、接合雰囲気を真空とし、予熱なしに室温よりセラミ
ックス部材に電源6により約36Vの電圧を印加して、
主にSICセラミックスの突合せ部近傍に通電させると
共に、出力端子を切換速度1 / 60 s e cで
切換え、通電領域を5c→セラミックス部材→41,5
d→セラミックス部材→41,5e→セラミックス部材
→41.5f→セラミックス部材→41とすることによ
って通電位置をセラミックスの突合せ面の全周に亘って
間欠的かつ順次に移動させる。
通電開始より徐々に電流を増加し、約1200℃で10
分間保持した後、電流を徐々に減じ、室温まで冷却して
接合を完了した。接合強度は常温曲げ試験で120MP
aであった。なお、内側導電部材を設けない場合の通電
開始電圧は約110vであった。
[実施例3]
第3図は、本発明の方法を実施する装置の概略横断面図
であり、StCセラミックスla。
lb、接合剤2.内側導電部材41.外側導電部材5c
、5d、5e、5f、電源6から構成されている。外側
導電部材5cと電源6の出力端子3a、外側導電部材5
dと電源6の出力端子8b、外側導電部材5e、5fと
電源6のアース端子8eがそれぞれ接続される。任意の
時間間隔で2つの端子8a、8bに交互に電圧が印加さ
れると、通電領域が5c→セラミックス部材→内側導電
部材41−セラミックス部材=5e及び5d−セラミッ
クス部材→内側導電部材41→セラミックス部材→5f
と交互に切換わる。したがって、通電位置をセラミック
スの突合せ面の全周に亘って間欠的に移動させることが
できる。その他の接合条件は実施例2と同様である。
以上の実施例1〜3に示した内側及び外側導電部材の数
は、一実施例であって、実施例に限定されることなく、
適宜の数を配設すればよい。
また、実施例1に示した上記の導電部材は、外側導電部
材又は内側導電部材のいずれか一方が回転し、回転しな
い方の導電部材は接合部の円周全体に亘る形状であって
もよい。また、導電部材とセラミックスとの間に間隙を
設けずに当接させてもよい。
〈発明の効果〉
以上のように、本発明によれば、内側導電部材を設ける
ことにより、外側のみに導電部材を配設したときに比べ
て低い電圧でセラミックスを電気接合することができる
。[Example 1] FIG. 1(a) and FIG. 1(b) are a schematic cross-sectional view and a vertical cross-sectional view, respectively, of an apparatus for carrying out the method of the present invention,
For example, round pipe-shaped ceramic hollow members 1a, l
This shows the case where the parts b are arranged in the vertical direction and joined. First, ceramic hollow members 1a, lb (φ60xφ4
CaF2. A paste-like bonding agent 2 made of kaolin is applied and dried, and the fixing jig 3a is stacked on top of each other.
, 3b. Next, an inner conductive member 4 and an outer conductive member 5a each having a rod shape, for example, are used for passing a heating current into and out of the ceramic hollow members 1a and lb. 5b are arranged facing each other with a gap of about one fin from the abutting portions, and power supplies 6a and 6b are connected between the outer conductive members 5a and 5b and the inner conductive member 4, respectively. Further, a gas burner 7a for heating the vicinity of the abutting portion,
7b is attached to the outer conductive members 5a, 5b. These outer conductive members 5m, 5b, inner conductive member 4 and gas burner 7
a, 7b can rotate around the axes of the ceramic hollow members 1a, lb. Now, the bonding atmosphere is set to the atmosphere, and the outer conductive members 5m and 5b, the inner conductive member 4, and the gas burner 7a are connected. 7b around the axis of the ceramic hollow member by 1109rp
By preheating the entire circumference near the abutting portion to approximately 800° C. with a gas burner while rotating at a rotational speed of A voltage of about 2,000 V is applied by the power sources 6g and 6b, and a heating current of 0.8 A is applied to the bonding agent 2, and the joules generated are The entire area near the abutting surfaces was heated to cause the bonding agent to react with the ceramics, and then cooled to room temperature to complete the bonding. From this sample 3X4X40
As a result of cutting out a specimen of the fin and conducting a 4-point bending test, the result was 300
The bending strength was M Pa. Note that the starting voltage for energization when the inner conductive member was not provided was approximately 3700V. [Example 2] FIG. 12(a) and FIG. 2(b) are a schematic cross-sectional view and a longitudinal cross-sectional view of an apparatus for carrying out the method of the present invention, respectively,
First, the resistivity is about 10-1Ω/Japanese SiC ceramics.
On the butt surface of a, lb (φ40 x φ24 x 30),
A bonding agent 2 of Ge powder was applied, and these were overlapped and fixed to fixing jigs 3g and 3b. Next, four outer conductive members 5c and 5d are formed from parts having substantially the same shape as the shape along the outer periphery of the ceramic member.
, 5e, 5f and the disk-shaped inner conductive member 41 are brought into contact with each other by applying carbon paste to the abutting portions of the ceramics, respectively, to connect the switching terminals 8g, 8b, 8c, 8 of the power source 6.
d and the outer conductive members 5c, 5d, 5e, and 5f, respectively, and the inner conductive member 41 and the ground terminal 8e of the power source 6 are connected. The power supply 6 has four output terminals 8a, 8b, 8
It has a function of sequentially applying voltage to c and 8d at arbitrary time intervals. Now, the bonding atmosphere is set to vacuum, and a voltage of about 36V is applied to the ceramic member from room temperature without preheating from the power supply 6.
Mainly energizes the vicinity of the butt part of the SIC ceramics, and switches the output terminals at a switching speed of 1/60 sec, changing the energization area to 5c → ceramic member → 41,5
By setting d→ceramic member→41,5e→ceramic member→41.5f→ceramic member→41, the energization position is moved intermittently and sequentially over the entire circumference of the abutting surfaces of the ceramics. The current was gradually increased from the start of energization until it reached 10°C at about 1200°C.
After holding for a minute, the current was gradually reduced and the bonding was completed by cooling to room temperature. Joint strength is 120MP in room temperature bending test
It was a. Note that the starting voltage for energization when the inner conductive member was not provided was approximately 110V. [Example 3] FIG. 3 is a schematic cross-sectional view of an apparatus for carrying out the method of the present invention, in which StC ceramics la is used. lb, bonding agent 2. Inner conductive member 41. Outer conductive member 5c
, 5d, 5e, 5f, and a power source 6. Outer conductive member 5c, output terminal 3a of power supply 6, outer conductive member 5
d and the output terminal 8b of the power source 6, and the outer conductive members 5e and 5f are connected to the ground terminal 8e of the power source 6, respectively. When a voltage is applied alternately to the two terminals 8a and 8b at an arbitrary time interval, the current-carrying area is 5c→ceramic member→inner conductive member 41−ceramic member=5e and 5d−ceramic member→inner conductive member 41→ceramic Part → 5f
and alternately. Therefore, the current supply position can be moved intermittently over the entire circumference of the abutting surfaces of the ceramics. Other bonding conditions are the same as in Example 2. The numbers of inner and outer conductive members shown in Examples 1 to 3 above are examples, and are not limited to the examples.
An appropriate number may be provided. Further, in the above-mentioned conductive member shown in Example 1, either the outer conductive member or the inner conductive member may rotate, and the non-rotating conductive member may have a shape extending over the entire circumference of the joint. . Alternatively, the conductive member and the ceramic may be brought into contact with each other without providing a gap between them. <Effects of the Invention> As described above, according to the present invention, by providing the inner conductive member, ceramics can be electrically bonded at a lower voltage than when the conductive member is provided only on the outside.
第1図(a)及び第1図(b)は、それぞれ本発明の方
法を実施する装置の概略横断面図及び縦断面図である。
第2図及び第3図は、それぞれ本発明の方法を実施する
装置の他の例を示す概略図であり、導電部材を固定して
配設し、スイッチの切換えにより通電領域を円周方向に
移動して突合せ部近傍を加熱して接合する。第4図(a
)及び第4図(b)はそれぞれ従来の装置の概略横断面
図及び縦断面図である。
la、lb・・・・・・セラミックス製中空部材。
2・・・・・・接合剤
4・・・・・・内側導電部材。
5a、5b・・・・・・外側導電部材
第2図(a)
代 理 人 弁理士
中 井
宏
手続補正書
(自 発)
平成2年10月26日
平成1年特許願第279416号
2、発明の名称
セラミックス製中空部材同士の電気接合方法3、補正す
る者
事件との関係FIG. 1(a) and FIG. 1(b) are a schematic cross-sectional view and a longitudinal cross-sectional view, respectively, of an apparatus for carrying out the method of the present invention. FIGS. 2 and 3 are schematic diagrams showing other examples of devices for carrying out the method of the present invention, respectively, in which a conductive member is fixedly disposed and a current-carrying area is changed in the circumferential direction by switching a switch. It moves and heats the area near the butt part to join. Figure 4 (a
) and FIG. 4(b) are a schematic cross-sectional view and a longitudinal cross-sectional view, respectively, of a conventional device. la, lb... Ceramic hollow member. 2... Bonding agent 4... Inner conductive member. 5a, 5b...Outer conductive member Figure 2 (a) Agent: Patent Attorney Naka Ihiro Procedural Amendment (self-motivated) October 26, 1990, 1999 Patent Application No. 279416 2, Name of the invention: Electrical joining method between ceramic hollow members 3, relationship with the amended person case
Claims (1)
せ、前記突合せ部の内外にそれぞれ内側導電部材及び外
側導電部材を配設し、前記中空部材を介して前記内側導
電部材と外側導電部材との間に流す加熱用電流の通電位
置を前記突合せ部で円周方向に移動させつつ、前記突合
せ部全体を加熱して接合するセラミックス製中空部材同
士の電気接合方法。A bonding agent is interposed between ceramic hollow members, and an inner conductive member and an outer conductive member are disposed inside and outside of the abutted portion, respectively, and between the inner conductive member and the outer conductive member via the hollow member. A method for electrically joining ceramic hollow members together by heating the entire abutting portion while moving the energization position of a heating current applied to the abutting portion in the circumferential direction at the abutting portion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27941689A JPH03197370A (en) | 1989-10-26 | 1989-10-26 | Method for electrically joining ceramic hollow members to each other |
| JP29003190A JPH03205381A (en) | 1989-10-26 | 1990-10-26 | Mutual electric joining of ceramic hollow part material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27941689A JPH03197370A (en) | 1989-10-26 | 1989-10-26 | Method for electrically joining ceramic hollow members to each other |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29003190A Division JPH03205381A (en) | 1989-10-26 | 1990-10-26 | Mutual electric joining of ceramic hollow part material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03197370A true JPH03197370A (en) | 1991-08-28 |
Family
ID=17610786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27941689A Pending JPH03197370A (en) | 1989-10-26 | 1989-10-26 | Method for electrically joining ceramic hollow members to each other |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03197370A (en) |
-
1989
- 1989-10-26 JP JP27941689A patent/JPH03197370A/en active Pending
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