JPH031973U - - Google Patents

Info

Publication number
JPH031973U
JPH031973U JP6132389U JP6132389U JPH031973U JP H031973 U JPH031973 U JP H031973U JP 6132389 U JP6132389 U JP 6132389U JP 6132389 U JP6132389 U JP 6132389U JP H031973 U JPH031973 U JP H031973U
Authority
JP
Japan
Prior art keywords
electricity
determining
film thickness
subtracting
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6132389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6132389U priority Critical patent/JPH031973U/ja
Publication of JPH031973U publication Critical patent/JPH031973U/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の一実施例を示し、第1図はブロ
ツク図、第2図は全体の構成図、第3図はメツキ
装置部分の構成図、第4図はメツキ膜厚監視装置
の斜視図、第5図はフローチヤート、第6図はモ
ニタの正面図である。 1……メツキ槽、5……印刷用ロール、28…
…メツキ膜厚監視装置、34……計算手段、35
……減算手段、36……判別手段。
The drawings show one embodiment of the present invention; FIG. 1 is a block diagram, FIG. 2 is an overall configuration diagram, FIG. 3 is a configuration diagram of a plating device portion, and FIG. 4 is a perspective view of a plating film thickness monitoring device. , FIG. 5 is a flowchart, and FIG. 6 is a front view of the monitor. 1... plating tank, 5... printing roll, 28...
...Metsuki film thickness monitoring device, 34...Calculation means, 35
...Subtraction means, 36...Discrimination means.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被メツキ物5の寸法等の入力データから、被メ
ツキ物5を所望のメツキ膜厚に電気メツキするた
めにメツキ槽1に流すべき総電気量を計算する計
算手段34と、メツキ槽1に流した微小時間毎の
電気量を求めて順次前記総電気量から減算する減
算手段35と、前記減算手段35により減算した
値が0になつたか否かを判別する判別手段36と
を備えることを特徴とするメツキ膜厚監視装置。
Calculating means 34 calculates the total amount of electricity that should be flowed into the plating tank 1 in order to electroplate the object to be plated 5 to a desired plating film thickness from input data such as the dimensions of the object to be plated 5; The present invention is characterized by comprising a subtracting means 35 for determining the amount of electricity for each minute time and sequentially subtracting it from the total amount of electricity, and a determining means 36 for determining whether the value subtracted by the subtracting means 35 has become zero. A plating film thickness monitoring device.
JP6132389U 1989-05-26 1989-05-26 Pending JPH031973U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6132389U JPH031973U (en) 1989-05-26 1989-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6132389U JPH031973U (en) 1989-05-26 1989-05-26

Publications (1)

Publication Number Publication Date
JPH031973U true JPH031973U (en) 1991-01-10

Family

ID=31589473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6132389U Pending JPH031973U (en) 1989-05-26 1989-05-26

Country Status (1)

Country Link
JP (1) JPH031973U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107800A (en) * 1979-02-13 1980-08-19 Sansha Electric Mfg Co Ltd Plating treatment control unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107800A (en) * 1979-02-13 1980-08-19 Sansha Electric Mfg Co Ltd Plating treatment control unit

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