JPH03202399A - Manufacture of ic card - Google Patents

Abstract

PURPOSE:To shorten the processing time necessary in emboss formation by bonding a material becoming emosses to the surface of an emboss bonding layer whose emboss forming region is notched and forming recessed parts by emboss-processing to fill the recessed parts and the notch parts with a filling material from the back surface of the emboss bonding layer. CONSTITUTION:Notches are formed to the emboss forming region of the high strength reinforcing layer 1c constituting the main body of an IC card and an extremely thin material becoming embosses is bonded to the surface thereof and subsequently subjected to emboss-processing to form embosses 2a. Next, a heated and softened filling material 2c is bonded to the recessed parts 2b formed by the emboss-processing and the notch parts 1c of the reinforcing layer 1c under pressure to fill the same.

Description

[Detailed Description of the Invention] [Summary] Regarding the improvement of the structure of the embossing provided on the surface of a multilayered IC card, it has been found that the embossing can be formed by mold processing and the processing time required for forming the embossing can be shortened. The purpose of the present invention is to provide a method for manufacturing an IC card, in which an RC chip is built into a main body, and an emboss is provided on the surface of an embossed layer of the main body, the emboss forming area being A material to be the emboss is pasted on the cutout surface of the embossed layer, a recess is formed on the material by embossing, and the recess and the cutout of the embossed layer are placed on the back side of the embossed layer. The container is configured to be filled with an embedding material.

[Industrial application field]

The present invention relates to an IC card, and particularly to an improvement in the structure of an embossing provided on the surface of a multilayered IC card.

As IC cards are required to have multiple functions, multi-layered structures are being promoted, and in order to accommodate this, it is necessary to reduce the thickness of the embossing material provided on the surface.

On the other hand, it has become necessary to increase the thickness of the reinforcing layer provided to strengthen the main body and protect internal IC chips and the like.

Under the above circumstances, there is a demand for an IC card that can provide a strong emboss even if a thin embossing material is used as the emboss.

[Conventional technology]

A conventional IC card will be explained in detail with reference to FIGS. 3 to 5.

As shown in FIG. 3(a), conventional IC cards have an embossment 2a on the surface and a pole 3. A magnetic tape 4 is provided, and a keyboard 5 and a display section 6 are provided on the back side as shown in FIG. 3 (C1).

As shown in the A-A sectional view of Figure 3 (bl), its structure has a built-in battery 7, and a magnetic tape 4 on the surface.
A display section 6 is provided on the back.

As shown in the BB sectional view of FIG. 3(d), an IC chip 8 is built inside, and its terminals are connected to the electrodes 3 provided on the surface. Figure 3 Tel C-C
As shown in the cross-sectional view, an embossing 2a is provided on the front surface and a keyboard 5 is provided on the back surface.

One of the methods of forming this embossing 2a is shown in FIG.
As shown in FIG. 1, an embossment 1 of vinyl chloride 12 or the like is applied to the surface of the main body 11 of the IC card, which is formed by laminating a back layer 11b, a circuit forming layer 11a, a reinforcing layer 11c, and a surface layer lid.
2a is pasted, and as shown in Fig. 4(b), the part to be used as the embossing 12a is left by router processing and the other parts are scraped off.Another method is as shown in Fig. 5(a). As shown in FIG. 5(b), a resist film 23 is formed on the surface of the UV curing resin 22, and as shown in FIG. Then U
After curing the V-curing resin 22, the resist film 23 and other parts of the UV-curing resin 22 are removed as shown in FIG. 5(C), and embossments 22a are formed as shown in FIG. 5(d). In this method, this UV curing resin 22 is pasted on the surface of the surface layer 21d of the main body 21 of the IC card.

[Problem to be solved by the invention]

In the conventional IC cards described above, the embossing is formed by mechanical processing using vinyl chloride, or by mechanical processing using vinyl chloride.
Or, since the embossing is formed using UV curing resin,
There were problems in that processing time was required to form the embossing, and when UV-curable resin was used, it was necessary to further attach it to the main body.

In view of the above-mentioned circumstances, the present invention aims to provide a method for manufacturing an IC card in which the embossing is formed by mold processing and the processing time required for forming the embossing can be shortened.

[Means to solve the problem]

The method for manufacturing an IC card of the present invention is a method for manufacturing an IC card in which an IC chip is built into a main body and an emboss is provided on the surface of an embossed layer of the main body, and the area where the emboss is formed is cut out. This embossed material is pasted on the surface of the embossed pasting layer, a recess is formed in this material by embossing, and the recess and the notch of this embossed pasting layer are filled with the embedding material from the back side of the embossed pasting layer. Configure it to do so.

[Effect]

That is, in the present invention, a portion corresponding to the embossed tc region of the strong embossed adhering layer constituting the main body of the IC card is cut out, and a material with an extremely thin film thickness that will become the embossed is affixed to the surface of the embossed layer. The embossing is formed by applying embossing to the material, and the recesses and cutouts of the embossing layer formed by this process are filled with the filling material, so the embossing is made of an extremely thin material. This makes it possible to prevent the embossing from deforming during use.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

First, as shown in FIG. 1(a), a notch is provided in the emboss formation area of the reinforcing layer 1c made of strong vinyl chloride with a thickness of 0.5 nm, which constitutes the main body of the IC card, and the surface of the reinforcing layer 1c is embossed. Apply vinyl chloride 2 with an extremely thin film thickness such as o and ow, and then
As shown in box), this material is embossed to form an embossment 2a.

Next, as shown in FIG. 1(C), an embedding material 2 made of vinyl chloride softened by heating is placed in the recess 2b formed by this embossing process and the notch of the reinforcing layer 1c.
Although the embossing material 2a is made of an extremely thin material, the recess 2b formed by processing and the notch of the reinforcing layer 1c are filled with the embedding material 2c, so it cannot be used. It becomes possible to prevent the embossing 2a from deforming at times.

The reinforcing layer 1c provided with the embossments 2a thus formed is attached to the circuit forming layer 1a and the back layer 1b constituting the main body 1, as shown in FIG. 2, to complete the manufacture of the laminated IC card.

The structure of the IC card manufactured in this way is as shown in Figure 3, and an IC card is manufactured by combining a thin embossing layer 2a with a strong reinforcing layer 1c and reinforcing it with an embedded material 2c. It becomes possible to do so.

In this example, the notch is provided only in the reinforcing layer 1c, but a notch is provided in the laminate of the reinforcing layer 1c and the circuit forming layer 1a to form an embossed adhesive layer, and the same as in this example is applied. It is also possible to fill this notch with the embedding material 2c.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, embossing is formed by embossing using a material with a thin film thickness,
Since the recesses formed by this embossing are filled with the embedding material, it has the advantage that it is possible to manufacture IC cards with embossing that can withstand the pressure strength during use, resulting in significant economic and reliability improvements. It is possible to provide an IC card that can be expected to have the following effects.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing the process order of an embodiment of an emboss forming method according to the present invention, FIG. 2 is a side sectional view showing the structure of an emboss on an IC card according to an embodiment of the present invention, and FIG. A diagram showing the structure of an IC card. Figure 4 is a side cross-sectional view showing one method of conventional IC card emboss formation method in order of process. Figure 5 is a diagram showing another method of conventional IC card emboss formation method in order of process. A side sectional view shown in FIG. In the figure, 1 is a main body, 1a is a circuit forming layer 1b is a back layer, and 1c is a reinforcing layer. 2 is vinyl chloride, 2a is embossed, 2b is recessed part, 2c is embedded material, 3 is electrode, 4m tape, 5 is keyboard, 6 is display part, 7 is battery, 8 is IC chip, (at vinyl chloride) (2) Formation of embossing (2a) Filling of embedding material (2C) Side sectional view showing the process order of an example of embossing formation according to the present invention Fig. el Plan view of the back side (dl B -B sectional view el CC sectional view A diagram showing the structure of an IC card (Part 2) A side sectional view showing the embossed structure of an IC card according to an embodiment of the present invention ) A-A sectional view A diagram showing the structure of an IC card Figure (Part 1) al Pasting of vinyl chloride (12) lb) Formation of embossing (12a) Figure 731-

Claims (1)

[Claims] A method for manufacturing an IC card, in which an IC chip (8) is built into a main body (1), and an embossment (2a) is provided on the surface of an embossed layer of the main body (1), comprising: A material to be the emboss (2a) is affixed to the surface of the emboss application layer in which the emboss (2a) formation area is cut out, a recess (2b) is formed in the material (2) by embossing, and the recess is formed in the recess. (2b) and a material (2c) embedded in the notch part of the embossed adhesive layer from the back side of the embossed adhesive layer.
A method for manufacturing an IC card, characterized by filling the IC card with: