JPH0320682A - Inspection device for semiconductor integrated circuit - Google Patents
Inspection device for semiconductor integrated circuitInfo
- Publication number
- JPH0320682A JPH0320682A JP1155415A JP15541589A JPH0320682A JP H0320682 A JPH0320682 A JP H0320682A JP 1155415 A JP1155415 A JP 1155415A JP 15541589 A JP15541589 A JP 15541589A JP H0320682 A JPH0320682 A JP H0320682A
- Authority
- JP
- Japan
- Prior art keywords
- oscillation
- switch
- capacitor
- inspection
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体集積回路検査に関し、測定時間短縮を
目的とするものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to semiconductor integrated circuit testing and aims to shorten measurement time.
従来の技術
近年半導体業界では激しい販売競争が表面化しているが
、これによる各メーカーのコスト競争も激化して来てい
る。製品コストの一部である検査時間の短縮も重要な課
題の一つとなって来ている。以下に従来の検査例につい
て説明する。Conventional Technology In recent years, intense sales competition has surfaced in the semiconductor industry, and this has also intensified cost competition among manufacturers. Reducing inspection time, which is part of product cost, is also becoming an important issue. A conventional inspection example will be explained below.
第2図は現在発振防止対策として用いられている検査例
で半導体集積回路1を検査する場合に電源電圧2とアー
ス4間,出力ビン3とアース4間,その他ビン間に発振
防止のためバイパス容量5を入れ、不要なAC的な戒分
をアース等へバイパスし発振対策を行っている。通常の
検査特性は第3図(a)で示す通りであるが、バイパス
容量の影響で第3図(b)の特性線の様に波形がなまり
、測定安定点Aでは、正常値特性範囲より測定値が外れ
るため、測定安定点Bまで測定時間を延長しなければな
らない、この様な対策を行う項目が多いほど測定時間は
増し検査コストを引き上げる原因となっている。Figure 2 shows an example of an inspection currently used as a measure to prevent oscillation. When testing a semiconductor integrated circuit 1, bypasses are used between power supply voltage 2 and ground 4, between output bin 3 and ground 4, and between other bins to prevent oscillation. A capacitor of 5 is inserted to bypass unnecessary AC power to ground, etc. to prevent oscillation. The normal test characteristics are as shown in Figure 3 (a), but due to the influence of the bypass capacitance, the waveform becomes dull as shown in the characteristic line in Figure 3 (b), and at the stable measurement point A, it is lower than the normal value characteristic range. Since the measured value deviates, the measurement time must be extended to reach the stable measurement point B. The more items such countermeasures are taken, the longer the measurement time becomes, causing an increase in inspection costs.
発明が解決しようとする課題
従来発振防止用のバイパス容量による影響で測定安定点
のずれた検査項目の測定時間を延長することにより対応
していた。このため検査時間は必要以上長くなり検査コ
ストも高価な物となって来る。本発明は上記従来の問題
点を解決する物でバイパス容量の影響による測定時間の
延長をなくし、検査コストの削減を目的とする。Problems to be Solved by the Invention Conventionally, this problem has been solved by extending the measurement time of inspection items whose measurement stability points have shifted due to the influence of bypass capacitors for preventing oscillation. Therefore, the inspection time becomes longer than necessary and the inspection cost becomes expensive. The present invention solves the above-mentioned conventional problems, and aims to eliminate the extension of measurement time due to the influence of bypass capacitance and reduce inspection costs.
課題を解決するための手段
この目的を達成するために本発明は、外付のバイパス容
量にリレー又はトランジスタスイッチ等の開閉手段を使
用し測定時間の延長を防止する機能を備えている。Means for Solving the Problems In order to achieve this object, the present invention has a function of preventing an extension of the measurement time by using switching means such as a relay or a transistor switch for the external bypass capacitor.
作用
この機能により発振防止用バイパス容量の必要項目以外
への影響はなくなるため他項目の出力立ち上りの妨げは
なくなり測定時間を延長する必要がなくなる。Effect: This function eliminates the effect of the oscillation prevention bypass capacitor on items other than the necessary items, so there is no longer any interference with the output rise of other items, and there is no need to extend the measurement time.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第1図は本発明の一実施例における半導体装置特性検査
装置を示すものである。第1図において、lは被澗定物
である半導体集積回路、2は電源電圧入力、3は出力ビ
ン、4はアース、5はバイパス容量16はスイッチ、7
は電源である。1〜5は従来例の構成と同じである。FIG. 1 shows a semiconductor device characteristic testing apparatus according to an embodiment of the present invention. In FIG. 1, l is a semiconductor integrated circuit that is a fixed object, 2 is a power supply voltage input, 3 is an output bin, 4 is ground, 5 is a bypass capacitor 16 is a switch, and 7
is the power source. 1 to 5 are the same as the configuration of the conventional example.
以上のように構成された本実施例の半導体集積回路検査
装置について、以下その動作を説明する。The operation of the semiconductor integrated circuit testing apparatus of this embodiment configured as described above will be described below.
まず、発振防止用バイパス容量5の途中にスイッチ6を
追加し通常時は、バイパス容量をオーブン状態とし、発
振項目測定時にスイッチをONする様に検査プログラム
中に電源印加条件を設定する。発振項目に検査が達した
時に電源7が入力されスイッチが、オン(ON)状態ど
なりバイパス容量が接続される。t源設定項目が終わる
とスイッチはオフ(OFF)となりバイパス容量は、オ
ーブン状態となる。この動作により発振項目以外への検
査項目へのバイパス容量の悪影響を防止できる。よって
第3図(b)に示される、異常特性による測定時間の延
長が不用となる検査コストを引き下げることができる。First, a switch 6 is added in the middle of the oscillation prevention bypass capacitor 5, and power supply conditions are set in the test program so that the bypass capacitor is in an oven state during normal times and the switch is turned on when measuring oscillation items. When the test reaches the oscillation item, the power supply 7 is input, the switch is turned on, and the bypass capacitor is connected. When the source setting items are completed, the switch is turned off and the bypass capacitor is in the oven state. This operation can prevent the adverse effects of bypass capacitance on test items other than oscillation items. Therefore, the inspection cost can be reduced since the extension of measurement time due to abnormal characteristics as shown in FIG. 3(b) becomes unnecessary.
発明の効果
本発明は、半導体集積回路の検査装置で発振防止用バイ
パス容量にスイッチを設けることにより必要項目以外へ
のバイパス容量の影響を防止し測定時間の延長を押える
ことができる優れた半導体集積回路検査を実現できるも
のである。Effects of the Invention The present invention provides an excellent semiconductor integrated circuit that can prevent the influence of the bypass capacitor on items other than necessary by providing a switch in the oscillation prevention bypass capacitor in a semiconductor integrated circuit testing device, thereby suppressing the extension of the measurement time. This enables circuit inspection.
第1図は本発明の一実施例における半導体集積回路検査
装置の回路図、第2図は従来の集積回路検査装置の回路
図、第3図はバイパス容量の充放電特性が、検査特性線
に与える影響を表わした特性図である。
1・・・・・・被測定物、2・・・・・・電源電圧、3
・・・・・・出力ビン、4・・・・・・アース、5・・
・・・・バイパス容量、6・・・・・・スイッチ、7・
・・・・・電源。FIG. 1 is a circuit diagram of a semiconductor integrated circuit testing device according to an embodiment of the present invention, FIG. 2 is a circuit diagram of a conventional integrated circuit testing device, and FIG. It is a characteristic diagram showing the influence given. 1...Object to be measured, 2...Power supply voltage, 3
...Output bin, 4...Ground, 5...
...Bypass capacity, 6...Switch, 7.
·····power supply.
Claims (1)
子とアース間に各々発振防止用のバイパス容量が開閉手
段を介して接続され、該当する前記端子が検査時には前
記開閉手段を閉となし、非検査時には開となすことを特
徴とする半導体集積回路検査装置。Bypass capacitors for preventing oscillation are connected between the external lead terminals of the semiconductor integrated circuit and between the external lead terminal and the ground through switching means, and the switching means is closed when the corresponding terminal is inspected, and when not inspected. A semiconductor integrated circuit testing device characterized by being open.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155415A JPH0320682A (en) | 1989-06-16 | 1989-06-16 | Inspection device for semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155415A JPH0320682A (en) | 1989-06-16 | 1989-06-16 | Inspection device for semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320682A true JPH0320682A (en) | 1991-01-29 |
Family
ID=15605498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1155415A Pending JPH0320682A (en) | 1989-06-16 | 1989-06-16 | Inspection device for semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320682A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5959463A (en) * | 1997-03-10 | 1999-09-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor test apparatus for measuring power supply current of semiconductor device |
| US8500923B2 (en) | 2003-02-28 | 2013-08-06 | Nippon Steel & Sumikin Stainless Steel Corporation | High aluminum ferritic stainless steel sheet for weight sensor substrate, method for producing the same and weight sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627086B2 (en) * | 1982-04-23 | 1987-02-16 | Tamotsu Nukano | |
| JPS6383678A (en) * | 1986-09-29 | 1988-04-14 | Matsushita Electronics Corp | Testing method for integrated circuit element |
-
1989
- 1989-06-16 JP JP1155415A patent/JPH0320682A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627086B2 (en) * | 1982-04-23 | 1987-02-16 | Tamotsu Nukano | |
| JPS6383678A (en) * | 1986-09-29 | 1988-04-14 | Matsushita Electronics Corp | Testing method for integrated circuit element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5959463A (en) * | 1997-03-10 | 1999-09-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor test apparatus for measuring power supply current of semiconductor device |
| US8500923B2 (en) | 2003-02-28 | 2013-08-06 | Nippon Steel & Sumikin Stainless Steel Corporation | High aluminum ferritic stainless steel sheet for weight sensor substrate, method for producing the same and weight sensor |
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