JPH0320896U - - Google Patents
Info
- Publication number
- JPH0320896U JPH0320896U JP8114689U JP8114689U JPH0320896U JP H0320896 U JPH0320896 U JP H0320896U JP 8114689 U JP8114689 U JP 8114689U JP 8114689 U JP8114689 U JP 8114689U JP H0320896 U JPH0320896 U JP H0320896U
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- lead frames
- laminate
- light emitting
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Description
第1図は本発明に係るEL発光素子の一実施例
としての分散型ELの構造を示す断面図、第2図
はこの分散型ELにおけるリードフレームの形状
ならびに配置関係を示す平面図、第3図はこの分
散型ELの他の実施例の構造を示す要部断面図、
第4図は第1図に示した分散型ELにおいてその
発光層および絶縁層の変形状態を示す要部断面図
、第5図は第1図に示した分散型ELにおいてそ
の上下方向に配置した防湿フイルムを溶着する前
工程を示す要部断面図、第6図は第3図に示した
分散型ELにおいてその上下方向に配置した防湿
フイルムを溶着する前工程を示す要部断面図、第
7図は第3図に示した分散型ELにおいてその防
湿フイルムを配置する前工程を示す要部斜視図、
第8図は第7図においてその「 」字屈曲形状と
するリードフレームを透明電極に接続するリード
フレームとした場合の要部斜視図、第9図は第1
図および第3図に示した分散型ELに使用するリ
ードフレームの断面図、第10図は従来の分散型
ELの基本構造を示す断面図、第11図はこの分
散型ELにおけるリードフレームの形状ならびに
配置関係を示す平面図、第12図はこの分散型E
Lにおけるリードフレームと防湿フイルムとの間
に生ずるスキマを説明するための断面図である。
1……透明電極、2……背面電極、3……発光
層、4……絶縁層、5……積層体、6−1,6−
2……防湿フイルム、9−1,9−2……リード
フレーム、9−1a,9−1b,9−2a,9−
2b……貫通孔。
FIG. 1 is a cross-sectional view showing the structure of a distributed EL as an embodiment of the EL light emitting element according to the present invention, FIG. 2 is a plan view showing the shape and arrangement of the lead frame in this distributed EL, and FIG. The figure is a sectional view of main parts showing the structure of another embodiment of this distributed EL,
Figure 4 is a cross-sectional view of the main parts of the dispersion type EL shown in Figure 1, showing the deformed state of the light emitting layer and insulating layer, and Figure 5 is a cross-sectional view of the main parts of the distributed type EL shown in Figure 1, showing the deformed state of the light emitting layer and the insulating layer. FIG. 6 is a sectional view of a main part showing a pre-process of welding a moisture-proof film; FIG. The figure is a perspective view of the main part showing the pre-process of arranging the moisture-proof film in the distributed EL shown in FIG.
Fig. 8 is a perspective view of the main part when the lead frame with the bent shape in Fig. 7 is used as a lead frame connected to a transparent electrode, and Fig. 9 is a perspective view of the main part
10 is a sectional view showing the basic structure of the conventional distributed EL, and FIG. 11 is the shape of the lead frame in this distributed EL. and a plan view showing the arrangement relationship, FIG.
FIG. 3 is a cross-sectional view for explaining a gap that occurs between the lead frame and the moisture-proof film at L. FIG. DESCRIPTION OF SYMBOLS 1... Transparent electrode, 2... Back electrode, 3... Light emitting layer, 4... Insulating layer, 5... Laminate, 6-1, 6-
2... Moisture-proof film, 9-1, 9-2... Lead frame, 9-1a, 9-1b, 9-2a, 9-
2b...through hole.
Claims (1)
を挟持してなる積層体と、この積層体を挟んで上
下方向に配置された第1および第2の防湿フイル
ムと、前記透明電極および背面電極に接続された
第1および第2のリードフレームとを備え、前記
第1の防湿フイルムと第2の防湿フイルムとを溶
着することにより前記積層体をシールする一方、
その溶着部を通して前記第1および第2のリード
フレームを外部へ引き出してなるEL発光素子に
おいて、前記第1および第2のリードフレームの
少なくとも一方の前記溶着部に位置する面に貫通
孔を開設したことを特徴とするEL発光素子。 a laminate including a light-emitting layer and an insulating layer sandwiched between a transparent electrode and a back electrode; first and second moisture-proof films disposed vertically with the laminate sandwiched therebetween; comprising first and second lead frames connected to a back electrode, and sealing the laminate by welding the first moisture-proof film and the second moisture-proof film;
In an EL light emitting device in which the first and second lead frames are drawn out through the welded portion, a through hole is provided in a surface of at least one of the first and second lead frames located at the welded portion. An EL light emitting device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8114689U JPH0320896U (en) | 1989-07-12 | 1989-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8114689U JPH0320896U (en) | 1989-07-12 | 1989-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320896U true JPH0320896U (en) | 1991-02-28 |
Family
ID=31626824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8114689U Pending JPH0320896U (en) | 1989-07-12 | 1989-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320896U (en) |
-
1989
- 1989-07-12 JP JP8114689U patent/JPH0320896U/ja active Pending