JPH0321093B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] In an immersion liquid cooling device for cooling means for microelectronic circuit elements (LSI, MSI), etc., the elements in the container are cooled by vaporizing a medium in a sealed cooling container and liquefying the vaporized medium. This paper presents a method for configuring a cooling device that emits heat to the outside to increase the density of devices and to increase the speed of devices by applying high power.

[Industrial application field]

The present invention relates to an immersion liquid cooling device for improving the immersion cooling structure for microelectronic circuits and the like.

In recent years, integrated circuit elements LSI, MSI, etc. installed in electronic computers, for example, are required to be smaller and faster, and the operating power per unit area of the element has increased, and reliability measures have become a problem due to the rise in operating temperature. be done.

Conventionally, as means for cooling circuit elements LSI, MSI, etc., there are air cooling methods such as attaching heat dissipation fins to specific circuit elements, or forced air cooling using a fan. However, there are limits to the heat dissipation method using air cooling, for example, when the operating temperature of the equipment is 85℃.
(maximum operating temperature limit), in the forced air cooling method, the allowable power consumption per unit area of the element heat dissipation surface is at most 1 watt/cm ² .

However, high-speed computer devices that require even higher operating conditions require a cooling method that can tolerate power consumption of 20 watts/cm ² , and a cooling method that directly immerses the device in a coolant is required. .

[Conventional technology]

The above-mentioned immersion liquid cooling device is non-corrosive at temperatures below 80℃,
Non-dissociable low-boiling refrigerants, such as freon (C ₂ Cl ₃ F ₃ ) with a boiling point of 49 °C, various fluorocarbons, such as monocompositions such as C ₅ F ₁₂ with a boiling point of 30 °C, C ₆ F ₁₄ with a boiling point of 56 °C,
Alternatively, a refrigerant with a complex composition is used, which is mixed to adjust the boiling point temperature as appropriate.

FIG. 2 is a schematic cross-sectional view showing the general configuration of a conventional device.

The figure shows a circuit board 2 mounted with a circuit element such as an LSI to be cooled immersed in a container 3 filled with a cooling medium 4, and the generated loss heat is absorbed by the latent heat of boiling vaporization of the coolant. This is an immersion liquid cooling device that is provided with a heat exchange pipe 8 that reliquefies air bubbles (indicated by 5 in the figure) to dissipate heat to the outside of the container.

[Problem that the invention seeks to solve]

The immersion liquid cooling device is equipped with a heat exchange pipe that forms a heat exchange section for recondensing and liquefying the vaporized refrigerant in the upper space 7 of the device immersion container. There is no need to directly adhere to the heat exchange pipe 8 and form a heat insulating layer.
Furthermore, since the porous plate 9 does not impede the fluidity of the reliquefaction medium, the capacity of the apparatus for cooling the elements is improved.

〔Example〕

DETAILED DESCRIPTION OF THE INVENTION Hereinafter, an embodiment of the immersion liquid cooling device for integrated circuit devices and the like using a boiling cooling medium according to the present invention will be described in detail with reference to the schematic cross-sectional view of FIG.

The schematic embodiment diagram is a longitudinal cross-sectional view of the liquid cooling device. Among the reference numerals given in the drawings, the same numbers are given to the same constituent parts as in the prior art, so that the gist of the present invention is made clear.

The container 1 filled with the boiling cooling medium 4 is made of stainless steel, aluminum, or the like. After the container 1 is filled with the cooling medium 4, it is hermetically sealed (joined) at 11 parts. The heat exchange pipe 8 made of a copper tube is provided in the container space 7 filled with the boiling vaporizing medium 5 on the free surface 12 of the boiling cooling medium 4, thereby liquefying the medium and discharging the latent heat of liquefaction to the outside of the container.

Below the medium free surface 12 of the heat exchange pipe 8, there is provided a porous plate 9, which is an important part of the present invention and is made of foamed metal and has good fluidity for the liquefied medium. Further, a porous plate 9 that blocks air bubbles in the pipe 8 is provided with a bubble (vaporized medium) guide portion 6 having a funnel structure for guiding a large amount of air bubbles to the inner periphery 10 of the container. Container 3 contains the LSI to be cooled or
A circuit element 1 such as a VLSI comes into contact with (immerses in) a cooling medium 4 together with a substrate.

The relationship between the low boiling point refrigerant used in such an immersion liquid cooling system and the operating limit temperature of the immersion device is as follows.

As the boiling cooling medium 4, for example, a boiling point of 50 to 60°C
If C ₆ F ₁₄ (boiling point 56° C.) is used, the operating temperature of the immersion element 2 is set at a temperature approximately 5 to 10° C. above the boiling point and below the maximum limit temperature.

According to the apparatus configuration in which the porous plates of the present invention are arranged as described in detail above, as will be further apparent when comparing this with FIG. The resulting decrease in cooling capacity is improved, and a stable immersion liquid cooling device for high-speed driving elements is realized.

〔Effect of the invention〕

As described above, in the immersion liquid cooling device of the present invention, by installing a porous shielding plate against air bubbles,
Intended heat consumption per unit area of element, 20W/
cm ² of cooling capacity can be obtained, and if this is applied to cooling integrated circuit elements for electronic computers that require high speed, the effect will be remarkable.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view of the immersion liquid cooling device of the present invention, and FIG. 2 is a schematic sectional view showing the configuration of the conventional device. In the figure, 1 is a circuit element, 3 is a cooling container, 4 is a cooling medium, 5 is a boiling bubble (vaporizing medium), 8 is a heat exchange pipe, and 9 is a porous plate.

Claims (1)

[Claims] 1. In a liquid cooling device comprising a container 3 for immersing a circuit element 1 in a boiling cooling medium 4, and a heat exchange pipe 8 for re-liquefying the vaporized medium of the cooling medium in the container, boiling bubbles of the cooling medium are removed. 5. An immersion liquid cooling device characterized in that a porous plate 9 is disposed for guiding the heat exchanger 5 to the outer periphery of the heat exchange pipe.