JPH03211392A - heat transfer device - Google Patents
heat transfer deviceInfo
- Publication number
- JPH03211392A JPH03211392A JP2006592A JP659290A JPH03211392A JP H03211392 A JPH03211392 A JP H03211392A JP 2006592 A JP2006592 A JP 2006592A JP 659290 A JP659290 A JP 659290A JP H03211392 A JPH03211392 A JP H03211392A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- heat transfer
- heater
- radiator
- transfer medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Jet Pumps And Other Pumps (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は暖冷房空調機および排熱回収装置に用いられる
熱搬送装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat transfer device used in a heating/cooling air conditioner and an exhaust heat recovery device.
従来の技術
従来、この種の熱搬送装置は第2図に示すような構成で
あった0図において、加熱器1と、放熱器2と往管3と
復管4によってループ状に接続して密閉回路を構成し、
内部に揮発性の熱媒体5を封入していた。さらに、放熱
器2は上部ヘッダ6と下部ヘッダ7とを複数の垂直流路
8で接続するとともに、往管3と上部ヘッダ6の接続部
と、復管4と下部へラダ7との接続部が放熱器の両側に
対向する位置に配管接続される構成であった。2. Description of the Related Art Conventionally, this type of heat transfer device has a configuration as shown in FIG. constitutes a sealed circuit,
A volatile heat medium 5 was sealed inside. Furthermore, the radiator 2 connects the upper header 6 and the lower header 7 with a plurality of vertical channels 8, and also connects the outgoing pipe 3 and the upper header 6 and the incoming pipe 4 and the lower rudder 7. The structure was such that the pipes were connected to positions facing both sides of the radiator.
発明が解決しようとする課題
しかし、このような従来の構成では、高温を得るために
高沸点の熱媒体5を用いた場合、熱媒体5の温度が沸点
以下になった時、密閉回路内は負圧になり、外気及び腐
食性ガス等が配管シール部より浸入し、装置の腐食が発
生するという課題があった。さらに、加熱量または放熱
量が急激に変動した場合、装置内での熱媒体5の分布が
象、激に変化し、加熱器1内の熱媒体5が不足し、加熱
器lの温度が異常に上昇するという課題もあった。Problems to be Solved by the Invention However, in such a conventional configuration, when the heat medium 5 with a high boiling point is used to obtain a high temperature, when the temperature of the heat medium 5 falls below the boiling point, the inside of the closed circuit is There was a problem in that the pressure became negative and outside air and corrosive gases entered through the piping seals, causing corrosion of the equipment. Furthermore, if the amount of heating or heat dissipation changes rapidly, the distribution of the heat medium 5 within the device will change dramatically, resulting in a shortage of heat medium 5 in the heater 1, and the temperature of the heater 1 will become abnormal. There was also the issue of rising prices.
本発明はこのようなyA題を解消するもので、密閉回路
内を常に正圧に保ち、腐食の原因となる外気の浸入を防
止するとともに、熱媒体の装置内での分布を安定させ、
加熱器内の温度の異常上昇を防止することを目的とする
ものである。The present invention solves this yA problem by constantly maintaining a positive pressure inside the closed circuit, preventing the intrusion of outside air that causes corrosion, and stabilizing the distribution of the heat medium within the device.
The purpose is to prevent an abnormal rise in temperature within the heater.
課題を解決するための手段
この課題を解決するために本発明は、加熱器と放熱器と
往管と復管とによって密閉回路を構成し、内部に常温よ
り高い沸点を有する熱媒体と非凝縮性ガスとを封入した
ものであり、さらに放熱器は上部ヘッダと下部へラダと
を接続する複数の垂直流路とを設け、往管と上部へラダ
との接続部と復管と下部へラダとの接続部を放熱器の片
側で同一方向に設けたものである。Means for Solving the Problem In order to solve this problem, the present invention configures a closed circuit with a heater, a radiator, an outgoing pipe, and a returning pipe, and contains a heat medium having a boiling point higher than normal temperature and a non-condensing circuit. Furthermore, the radiator is provided with a plurality of vertical flow paths connecting the upper header and the rudder to the lower part, and the connecting part between the outgoing pipe and the rudder to the upper part, the return pipe and the rudder to the lower part. The connection part with the radiator is provided in the same direction on one side of the radiator.
作用
この構成により、非加熱時に加熱器内の熱媒体が沸点以
下になっても空間部は非凝縮性ガスで満たされ、密閉回
路の内部は外部の圧力より高く、すなわち、常に正圧に
保持されるので、内部に外気及び腐食性ガスが浸入する
ことはない。さらに、加熱時には熱媒体が澤発し、密閉
回路内部の圧力が上昇することにより、圧力に応して非
凝縮性ガスの体積は縮小され、空間部は熱媒体のガスで
大部分が占められることとなる。従って、加熱量または
放熱量に急激な変化が生じた場合でも非凝縮性ガスの体
積変化が熱媒体の分布の急激な変化を防止し、加熱器の
異常な温度上昇を防止する。Effect: With this configuration, even if the heat medium in the heater falls below its boiling point when not heated, the space is filled with non-condensable gas, and the pressure inside the sealed circuit is higher than the outside pressure, that is, the pressure is always maintained at positive pressure. This prevents outside air and corrosive gases from entering the inside. Furthermore, during heating, a large amount of heat medium is generated and the pressure inside the closed circuit increases, so the volume of the non-condensable gas is reduced according to the pressure, and the space is mostly occupied by the heat medium gas. becomes. Therefore, even if a sudden change occurs in the amount of heating or the amount of heat dissipation, the volume change of the non-condensable gas prevents a sudden change in the distribution of the heating medium and prevents an abnormal temperature rise in the heater.
方、放熱器の上部ヘッダへの往管の接続部と下部ヘッダ
への復管の接続部を同一方向に設けているため、非凝縮
性ガスは放熱器の接続部と反対側の垂直通路に蓄積され
非凝縮性ガスが密閉回路全体に分布して熱搬送を阻害す
ることも無(なり、安定した熱搬送が行えることとなる
。On the other hand, since the outgoing pipe connection to the upper header of the radiator and the return pipe connection to the lower header are installed in the same direction, non-condensable gas is routed to the vertical passage on the opposite side of the radiator connection. Accumulated non-condensable gas will not be distributed throughout the closed circuit and impede heat transfer, and stable heat transfer will be possible.
実施例
第1図は本発明の一実施例による熱搬送装置の構成図で
あり、第1図において、加熱器1と放熱器2とは往管3
と復管4によって接続されループ状の密閉回路を構成し
、内部には常温より沸点が高い熱媒よして、R11また
はR123のようなフロンまたは水のような揮発性の熱
媒体5と非凝縮性ガスとして窒素9が封入されている。Embodiment FIG. 1 is a configuration diagram of a heat transfer device according to an embodiment of the present invention. In FIG. 1, a heater 1 and a radiator 2 are connected to an outgoing pipe 3.
It is connected by a return pipe 4 to form a loop-shaped sealed circuit, and inside is a heating medium with a boiling point higher than normal temperature, such as fluorocarbons such as R11 or R123, or a volatile heating medium 5 such as water, and a non-condensable heating medium 5. Nitrogen 9 is sealed as a reactive gas.
一方、放熱器2は上部ヘッダ6と下部ヘッダ7とを接続
する複数の垂直流路8とから構成され、往管3と上部へ
ラダ6との接続部と、下部ヘッダ7と復管4との接続部
とが放熱器の片側同一方向に設けられている。On the other hand, the radiator 2 is composed of a plurality of vertical passages 8 that connect the upper header 6 and the lower header 7, the connecting part between the outgoing pipe 3 and the ladder 6 to the upper part, and the connecting part between the lower header 7 and the returning pipe 4. The connecting portions are provided in the same direction on one side of the radiator.
上記構成において、非加熱時の加熱器1内の熱媒体5は
液体状態として存在し、密閉回路の空間部は窒素9が気
体の状態として存在し、外部の圧力よりも密閉回路内部
の方が高い圧力になるように保たれている。一方、加熱
時には加熱器1内の熱媒体5は蒸発し、回路内部の圧力
の上昇に伴い、窒素9の体積は縮小され、やがて放熱器
2の往管3と復管4の接続部と反対側に蓄積されること
となる。従って、加熱器1で蒸発した冷媒は窒素9に妨
害されずに往管3を通って放熱器2で凝縮し、液化した
熱媒体5は復管4を通って重力作用によって加熱器1へ
戻り、再び加熱され、熱媒体5が循環することにより熱
搬送が行われる。一方、加熱量または放熱量に2.激な
変化が生した場合、圧力変動に応し熱媒体5の装置内で
の分布が変化するが、この時、窒素90体積膨張・収縮
が起こるので内部圧力はゆるやかに変化し、熱媒体5の
急激な分布の変化を防止することができる。In the above configuration, the heat medium 5 in the heater 1 when not heating exists in a liquid state, and the nitrogen 9 exists in a gaseous state in the space of the closed circuit, and the pressure inside the closed circuit is higher than the outside pressure. It is maintained at high pressure. On the other hand, during heating, the heat medium 5 in the heater 1 evaporates, and as the pressure inside the circuit increases, the volume of the nitrogen 9 is reduced, and eventually it is opposite to the connection part between the outgoing pipe 3 and the returning pipe 4 of the radiator 2. It will be accumulated on the side. Therefore, the refrigerant evaporated in the heater 1 passes through the outgoing pipe 3 without being hindered by the nitrogen 9 and is condensed in the radiator 2, and the liquefied heat medium 5 passes through the return pipe 4 and returns to the heater 1 by the action of gravity. , is heated again, and heat transfer is performed by circulating the heat medium 5. On the other hand, 2. When a drastic change occurs, the distribution of the heating medium 5 within the device changes in response to the pressure fluctuation, but at this time, the internal pressure changes slowly as nitrogen 90 volumetric expansion and contraction occur. It is possible to prevent sudden changes in the distribution of
なお、復管4にポンプ等の熱搬送手段を設けた場合にお
いても同様の効果を得ることができる。Note that the same effect can be obtained even when the return pipe 4 is provided with a heat transfer means such as a pump.
発明の効果
以上の実施例の説明からも明らかなように本発明によれ
ば以下の効果が得られる。Effects of the Invention As is clear from the description of the embodiments above, the present invention provides the following effects.
(1)密閉回路内に常温より沸点の高い熱媒体と非凝縮
性ガスを封入しているため、密閉回路内の圧力は常に外
部の圧力より高い状態に保たれ、外気の浸入を防ぎ腐食
を防止することができる。(1) Since a heat medium with a boiling point higher than room temperature and a non-condensable gas are sealed in the sealed circuit, the pressure inside the sealed circuit is always kept higher than the outside pressure, preventing the intrusion of outside air and preventing corrosion. It can be prevented.
(2〕 密閉回路内の圧力変動に伴い非凝縮性ガスの
体積が膨張または収縮し、圧力変動に対する緩衝効果を
持つことにより、熱媒体の分布を安定に保つことができ
、加熱器の温度の異常上昇を防止することができる。(2) The volume of the non-condensable gas expands or contracts as pressure fluctuates in the closed circuit, and by having a buffering effect against pressure fluctuations, the distribution of the heat medium can be kept stable, and the temperature of the heater can be maintained. Abnormal increases can be prevented.
(3)放熱器への往管と復管の接続部を同一方向に設け
ているので、非凝縮性ガスは接続部の反対側に蓄積され
、熱媒体の循環を妨害せずに安定した熱搬送を行うこと
ができる。(3) Since the outgoing and return pipe connections to the radiator are installed in the same direction, non-condensable gas is accumulated on the opposite side of the connection, providing stable heat without interfering with the circulation of the heat medium. Transport can be carried out.
第1図は本発明の一実施例による熱搬送装置の回路構成
図、第2図は従来の熱搬送装置の回路構成図である。
1・・・・・・加熱器、2・・・・・・放熱器、3・・
・・・・往管、4・・・・・・復管、5・・・・・・熱
媒体、6・・・・・・上部ヘッダ、7・・・・・・下部
ヘッダ、8・・・・・・垂直流路、9・・・・・・非凝
縮性ガス。FIG. 1 is a circuit diagram of a heat transfer device according to an embodiment of the present invention, and FIG. 2 is a circuit diagram of a conventional heat transfer device. 1... Heater, 2... Heat radiator, 3...
... Outgoing pipe, 4... Return pipe, 5... Heat medium, 6... Upper header, 7... Lower header, 8... ...Vertical flow path, 9...Non-condensable gas.
Claims (2)
を接続する往管および復管と、前記加熱器と前記放熱器
と前記往管と前記復管とを備えたループ状の密閉回路内
に常温より高い沸点を有する熱媒体と、非凝縮性ガスを
封入した熱搬送装置。(1) A loop shape comprising a heater, a radiator, an outgoing pipe and a return pipe that connect the heater and the radiator, the heater, the radiator, the outgoing pipe, and the return pipe. A heat transfer device in which a heat medium with a boiling point higher than room temperature and a non-condensable gas are sealed in a closed circuit.
前記下部ヘッダとを接続する複数の垂直流路とを備えた
放熱器であって、前記上部ヘッダと前記往管との接続部
と、前記下部ヘッダと前記復管との接続部が放熱器の片
側同一方向に位置する請求項1記載の熱搬送装置。(2) A radiator comprising an upper header, a lower header, and a plurality of vertical channels connecting the upper header and the lower header, the connecting portion between the upper header and the outgoing pipe; The heat transfer device according to claim 1, wherein a connecting portion between the lower header and the return pipe is located in the same direction on one side of the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006592A JPH03211392A (en) | 1990-01-16 | 1990-01-16 | heat transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006592A JPH03211392A (en) | 1990-01-16 | 1990-01-16 | heat transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03211392A true JPH03211392A (en) | 1991-09-17 |
Family
ID=11642606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006592A Pending JPH03211392A (en) | 1990-01-16 | 1990-01-16 | heat transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03211392A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7721793B2 (en) | 2003-01-21 | 2010-05-25 | Mitsubishi Denki Kabushiki Kaisha | Vapor-lift pump heat transport apparatus |
| EP3933298A1 (en) * | 2020-06-26 | 2022-01-05 | Canon Kabushiki Kaisha | Cooling device, semiconductor manufacturing apparatus, and semiconductor manufacturing method |
-
1990
- 1990-01-16 JP JP2006592A patent/JPH03211392A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7721793B2 (en) | 2003-01-21 | 2010-05-25 | Mitsubishi Denki Kabushiki Kaisha | Vapor-lift pump heat transport apparatus |
| US7810551B2 (en) | 2003-01-21 | 2010-10-12 | Mitsubishi Denki Kabushiki Kaisha | Vapor-lift pump heat transport apparatus |
| EP3933298A1 (en) * | 2020-06-26 | 2022-01-05 | Canon Kabushiki Kaisha | Cooling device, semiconductor manufacturing apparatus, and semiconductor manufacturing method |
| JP2022020088A (en) * | 2020-06-26 | 2022-02-01 | キヤノン株式会社 | Cooling device, semiconductor manufacturing apparatus and semiconductor manufacturing method |
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