JPH03211753A - 半導体製造装置 - Google Patents

半導体製造装置

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Publication number
JPH03211753A
JPH03211753A JP2007572A JP757290A JPH03211753A JP H03211753 A JPH03211753 A JP H03211753A JP 2007572 A JP2007572 A JP 2007572A JP 757290 A JP757290 A JP 757290A JP H03211753 A JPH03211753 A JP H03211753A
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wafer
electrostatic chuck
electrodes
negative
arm
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JP2867526B2 (ja
Inventor
Takahiro Kawaguchi
貴弘 河口
Yasushi Ishimaru
石丸 靖
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Fujitsu Ltd
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Fujitsu Ltd
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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔概 要〕 半導体製造装置に関し、 ウェーハの残留電荷を効果的に活用したり除電したりし
て、静電チャックからのウェーハの離脱が容易になるこ
とを目的とし、 静電チャックと、電源装置とを有し、前記静電チャック
は、ウェーハを吸着するものであって、吸着面に絶縁膜
と、絶縁膜の下に交互に配設された電極と、電極から導
出された端子とを有するものであり、前記電源装置は、
電極に直流電圧を印加するものであって、2つの高圧電
源と、端子に接続される出力端子と、接地端子と、極性
切替え手段とを有するものであり、前記極性切替え手段
は、一方が接地端子、他方が出力端子に極性切替え可能
に接続されるように、高圧電源の夫々に設けられるもの
であり、前記極性切替え手段は、静電チャックに吸着さ
れているウェーハが離脱される際、ウェーハが有する残
留電荷と同極性の電圧を出力端子を介して電極に印加す
るものであるように構成する、また、静電チャックと、
搬送アームと、継電器とを有し、前記静電チャックは、
ウェーハを吸着するものであって、装置本体に内設され
ているものであり、前記搬送アームは、ウェーハを静電
チャックに着脱するものであって、装置本体に気密可能
に貫通支持されたアーム駆動部と、装置本体に内設され
、かつアーム駆動部に旋回および昇降可能に枢支された
アーム本体と、アーム本体の先端に静電チャックに対面
するように設けられたウェーハトレイとを有するもので
あり、前記ウェーハトレイは、アーム駆動部と電気的に
接続されているものであり、前記継電器は、装置本体と
電気的に絶縁されたアーム駆動部を接地するものであっ
て、常時閉成されており、前記継電器は、搬送アームが
静電チャックに吸着されているウェーハを受け取る際、
ウェーハトレイがつ工−ハに当接する直前に開成され、
かつ当接した直後に閉成されるものであるように構成す
る。
〔産業上の利用分野〕
本発明は、半導体製造装置に係わり、特につ工−ハの離
脱が容易な静電チャックに関する。
近年、エレクトロニクスの発展は目ざましいものがある
が、その発展は、半導体デバイスの技術革新に負うとこ
ろが大きい。
中でも、シリコン半導体を用いた集積回路の大規模・高
集積化は、非常に急速に推移しており、■チップ内に集
積される素子数は、メモリ素子の容量で見て、数年単位
で4倍に拡大している。
それに伴い、シリコンウェーハからデバイスに仕上げる
までの一連の工程の中で、いわゆるウェーハプロセスと
呼ばれるパターニングが終了するまでの工程で、ウェー
ハの取り扱いを如何に効率よく、しかも、安定に行うか
が、生産性向上の上から重要である。
ウェーハプロセスには、一般に、酸化、レジスト処理、
露光、現像、エツチング、不純物導入といった幾つかの
工程が繰り返されるが、その工程の各所でウェーハの保
持と搬送が行われる。
このウェーハを保持する治具には各種あるが、その1つ
に、静電荷のクーロン力を利用した静電チャックがある
静電チャックは、真空を用いて吸着する真空チャックを
行うことができない真空装置の中などにおいてウェーハ
処理を行うときに用いられることが多く、例えば、エツ
チング工程のRIE (反応性イオンエツチング)処理
装置などに装備されて用いられる。
〔従来の技術〕
第3図は従来の静電チャックが装備された装置の一例を
示す斜視図であり、第4図は第3図の静電チャックの一
例を示す斜視図、第5図は第4図のX−X断面図である
図中、■は静電チャック、3は搬送アーム、3aはアー
ム駆動部、3cはウェーハトレイ、5は装置本体、6は
ウェーハである。
第3図において、装置本体5は例えばドライエツチング
の一種であるRIE処理装置などの半導体製造装置であ
り、装置本体5の上方は大気の雰囲気で、下方は処理室
5aである。
装置本体5には、下向きに静電チャック1か取り付けら
れており、そこにウェーハ6が吸着されてRIE処理さ
れる。
一方、装置本体5の処理室5aには搬送アーム3が内設
されている。この搬送アーム3は、アーム駆動部3aと
、そのアーム駆動部3aに枢支されて旋回したり昇降し
たりするアーム本体3bと、そのアーム本体3bの先端
に設けられたウェーハトレイ3cとから構成されている
そして、ウェーハトレイ3cがぐるっと回って静電チャ
ックlの真下に(ると上昇して静電チャックlに当接し
、静電チャックlにウェーハ6を渡して吸着させたり、
静電チャック1に吸着されているウェーハ6を受け取っ
たりする。
第4図と第5図において、静電チャック1は、工作機械
の被加工物を吸着するものには方形の形状もあるが、シ
リコンウェーハなどを吸着する形り、中には例えばシリ
コンゴムなどが充填されている。そして、ウェーハ6を
吸着する凸状の表面には、膜厚が100〜300μmの
絶縁膜1aが被覆されている。
この絶縁膜1aは、例えばプラスチックやゴムのような
耐熱性はないが軟らかい材料とかセラミックのような耐
熱性がある硬い材料とがで構成されている。その絶縁膜
1aを剥いでみると、その下には電極1b、 lcが設
けられている。
この電極1b、 lcのパターン形状は、円を2つに割
った形状であったり、九十九折り形状であったり、吸着
させる目的などによって種々の形態が採られており、こ
こでは、同心円状の櫛歯状パターンの電極1b、 lc
、が交互に配置された形状になっている。
それぞれの端子1d、 leに上敷kVの高い直流電圧
か印加されると、絶縁膜1aに静電荷が誘起され、ウェ
ーハ6との間にクーロン力が作用して吸着が行われる。
ところが、例えばRIE処理のように、静電チャックl
に吸着されて処理されるウェー/1Gが、例えば電子の
ような荷電粒子7によって叩かれると、ウェーハ6自体
がセルフバイアスによって電荷を帯びて残留電荷7aと
して残ってしまう。
その結果、静電チャックlの電極ib、1cに印加して
いる直流電圧を断っても、ウェーハ6が静電チャック1
から容易に離脱しな(なることが間々起こる。
この対策として、図示してないが、例えばリフトピンな
どを用いてウェーハ6を機械的に離脱させようとすると
、ウェーハ6が割れたり、ウェーハ6が静電チャックl
から離脱した瞬間に剥離放電が起こったりして、ウェー
ハ6が損傷してしまうことが間々起こる。
〔発明か解決しようとする課題〕
以上述べたように、半導体製造装置に内設された静電チ
ャックに吸着されたウェーハは、そのつ工−ハの処理が
RIE処理などのときにはウェーハ自体に残留電荷が残
ってしまい、静電チャックから離脱し難い問題があった
そうかといって、ウェーハを機械的に離脱させようとす
ると、剥離放電が起こったりしてウェーハが損傷してし
まう問題があった。
本発明は、このウェーハの残留電荷を効果的に活用した
り除電したりして、ウェーハの離脱が容易な静電チャッ
クを有する半導体製造装置を提供することを目的として
いる。
〔課題を解決するための手段〕
上で述べた課題は、 静電チャックと、電源装置とを有し、 前記静電チャックは、ウェーハを吸着するものであって
、吸着面に絶縁膜と、絶縁膜の下に交互に配設された電
極と、電極から導出された端子とを有するものであり、 前記電源装置は、電極に直流電圧を印加するものであっ
て、2つの高圧電源と、端子に接続される出力端子と、
接地端子と、極性切替え手段とを有するものであり、 前記極性切替え手段は、一方が接地端子、他方が出力端
子に極性切替え可能に接続されるように、高圧電源の夫
々に設けられるものであり、前記極性切替え手段は、静
電チャックに吸着されているウェーハが離脱される際、
ウエーノ\が有する残留電荷と同極性の電圧を出力端子
を介して電極に印加するものであるように構成された半
導体製造装置、また、 静電チャックと、搬送アームと、継電器とを有し、 前記静電チャックは、ウェーハを吸着するものであって
、装置本体に内設されているものであり、前記搬送アー
ムは、ウェーハを静電チャックに着脱するものであって
、装置本体に気密可能に貫通支持されたアーム駆動部と
、装置本体に内設され、かつアーム駆動部に旋回および
昇降可能に枢支されたアーム本体と、アーム本体の先端
に静電チャックに対面するように設けられたウェーハト
レイとを有するものであり、 前記ウェーハトレイは、アーム駆動部と電気的に接続さ
れているものであり、 前記継電器は、装置本体と電気的に絶縁されたアーム駆
動部を接地するものであって、常時閉成されており、 前記継電器は、搬送アームが静電チャックに吸着されて
いるウェーハを受け取る際、ウェーハトレイがウェーハ
に当接する直前に開成され、かつ当接した直後に閉成さ
れるものであるように構成された半導体製造装置によっ
て解決される。
〔作 用〕
静電チャックに吸着されたウェーハを、例えばエツチン
グの一種であるRIE処理のように荷電粒子によって叩
(と、ウェーハ自体が電荷を帯びて静電チャックから離
脱し難くなるのに対して、まず、第一の本発明において
は、ウェーハに溜まったこのような残留電荷を積極的に
利用して、静電チャックから容易にウェーハを離脱させ
るようにしている。
すなわち、ウェーハの残留電荷の極性と同極性の電圧を
静電チャックの電極に印加し、同極性同士の電荷による
クーロン斥力によってウェーハを静電チャックから離脱
させるようにしている。
そのために、2つの高圧電源を具えた直流の電源装置の
それぞれの高圧電源に極性切替え手段を設け、ウェーハ
を静電チャックに吸着する際には、2つの電極に正負の
電圧を印加し、ウェーハを静電チャックから離脱させる
際には、2つの電極にウェーハの残留電荷と同極性の電
圧を印加するようにしている。
こうして、クーロン斥力を利用すれば、荷電されたウェ
ーハを容易に静電チャックから離脱させることができる
次いで、第二の本発明においては、ウェーハに溜まった
残留電荷を、静電チャックにウェーハを着脱させる搬送
アームのウェーハトレイに放電することなく漏洩させる
ようにしている。
すなわち、搬送アームを装置本体から電気的に絶縁し、
しかもアーム駆動部とアーム本体、ウェーハトレイから
なる搬送アーム全体を導通するようにしている。そして
、装置本体から外に露出しているアーム駆動部を継電器
を介して常時接地できるようにしている。
一方、ウェーハトレイは、106から10”Ωcm程度
の体積比抵抗を有する材料を用いて、ウェーハの残留電
荷との間に放電が起こるような急激な電位差が生じない
ようにしている。こ\ではその材料として5iC(シリ
コンカーバイド)を用いるようにしている。
ウェーハの離脱動作に際しては、搬送アームが静電チャ
ックからウェーハを離脱させるために旋回・上昇して、
ウェーハトレイがウェーハに当接する直前に、継電器を
開成して搬送アーム全体を接地から浮かせるようにして
いる。そして、つニーハトレイがウェーハに当接した直
後に継電器を閉成して、ウェーハの残留電荷を比較的体
積比抵抗の低いSiC製のウェーハトレイから徐々に漏
洩させるようにしている。
こうすると、放電によるウェーハの損傷を防ぐことがで
きる。
このように、本発明においては、静電チャックに吸着さ
れながら処理されて残留電荷を有するつ工−ハに対して
、その残留電荷のクーロン斥力を利用するとか、あるい
はウェーハと当接するつニーハトレイの体積比抵抗を比
較的高くするとともに、搬送アームを接地と断続して残
留電荷を徐々に漏洩させるとかして、静電チャックの離
脱に関わるウェーハの損傷を防いでいる。
〔実施例〕
第1図は本発明の一実施例を説明する構成図、第2図は
本発明の他の実施例を説明する斜視図である。
図中、lは静電チャック、2は電源装置、3は搬送アー
ム、4は継電器、5は装置本体、6はウェーハである。
実施例:1 第1図において、静電チャックlの主要部は、ウェーハ
6の吸着面である絶縁膜1aと、その下に埋め込まれた
電極1b、 Icとから構成されており、絶縁膜1aの
直径は、吸着するウェーハ6の直径より1周り小さくな
っている。
絶縁膜1aは、例えば膜厚が100〜300μmの絶縁
性の高い材料からなり、例えばシリコンゴムのような軟
らかい材料とかアルミナセラミックのような硬い材料な
ど用いられ、目的に応じて使い分けられている。
電極1b、 lcには、種々のパターン形状があるが、
こ\では、同心円状の櫛歯状パターンの電極1b、lc
が用いられており、それぞれの電極1b、 lcから端
子1d、 leが出ていて、直流の高電圧が印加できる
ようになっている。
一方、電源装置2は、例えば2kVの直流電圧を出力す
る2つの高圧電源2a、2bと、端子1d、 leにそ
れぞれ接続されている2つの出力端子2c、2dと、2
つずつのベクセル接点をもったスイッチからなる極性切
替え手段2f、2gと、接地端子2eとから構成されて
いる。
そして、極性切替え手段2[,2gが、それぞれの高圧
電源2a、2bの正極/負極を、出力端子2C12dと
接地端子2eとの間で切り替え、静電チャックlにウェ
ーハ6を吸着する際には、例えば電極1bが正で電極1
cが負になるように電圧が印加される。
ウェーハ6がRIE処理される場合を例にすると、ウェ
ーハ6は荷電粒子7である電子のジャワを浴びて負に荷
電され、負の残留電荷7aがウェーハ6の表面に溜まる
。そこで、極性切替え手段2【、2gを切り換えて、図
示したように2つの電極tb、lcに負の電圧を印加す
る。
この極性切替え手段2「、2gのスイッチの切替えは、
図示してない制御系によって自動的に制御されるように
なっている。
こうして、静電チャック1の絶縁膜1aに誘起された負
の電荷Ifとウェーハ6の残留電荷7aとでクーロン斥
力が働いて反発し合うので、ウェーハ6が容易に離脱す
る。
実施例:2 第2図において、搬送アーム3は、アーム駆動部3aと
、アーム駆動部3aに枢支されて旋回したり上下動した
りするアーム本体3bと、アーム本体3bの先端に支持
されて、静電チャック1の真下でウェーハ6を静電チャ
ックlに着脱させるウェーハトレイ3cとから構成され
ている。
そして、搬送アーム3は、例えばAl製で全体が導通さ
れており、ウェーハトレイ3cは、比較的体積比抵抗の
低いSiC製である。
装置本体5は、例えばRIEを行う処理室5aの上壁で
ある。そして、アーム駆動部3aは、例えばふっ素糸樹
脂で作ったガスケット5bを介在させて気密を保つとと
もに、装置本体5と電気的に絶縁されるように貫通支持
されている。そして、アーム駆動部3aの上部は、大気
中に突出しており、常時閉成している継電器4を介して
接地できるようになっている。
アーム本体3bやウェーハトレイ30などは装置本体5
の中に配設されている。
実施例1と同様に負の残留電荷7aを有するウェーハ6
に対して、搬送アーム3を駆動してウェーハトレイ3c
を接近させ、ウェーハトレイ3cがウェーハ6に当接す
る1秒前に継電器4を開成して搬送アーム3全体を接地
から浮かす。そして、ウェーハトレイ3cがウェーハ6
に当接した0、2秒後に高電圧を切断するとともに、継
電器4を閉成して搬送アーム3全体を接地する。
その結果、約1秒後にはウェーハ6の残留電荷6aが除
電され、ウェーハ6に損傷を与える放電は全く見られな
い。
こ\では、RIE処理室を例としたり、静電チャックに
同心円状の櫛歯状パターンの電極を用いたりしたが、種
々の変形か可能である。
また、継電器を開閉や除電のタイミングなどは、例えば
ウェーハに溜まる残留電荷の量とかウェーハトレイや搬
送アームの対接地インピーダンスなどとかによって、種
々の変形が可能である。
〔発明の効果〕
以上述べたように、静電チャックに吸着されたウェーハ
が例えばRIE処理のような荷電粒子によって叩かれて
電荷を帯びて残留電荷が溜まり、静電チャックから離脱
し難くなったウェーハに対して、本発明においては、ま
ず、静電チャックにこの電荷と同極性の電圧を印加して
、クーロン斥力によって離脱し易(している。
さらに、ウェーハを静電チャックに着脱させる搬送アー
ム全体を装置本体から絶縁して継電器を介して接地でき
るようにするとともに、ウェーハトレイを比較的体積比
抵抗の低いSiC製にし、継電器の接地タイミングを制
御して、ウェー”に溜まった残留電荷を放電が起こらな
いように徐々に除電してい(。
こうして、例えば機械的に離脱してウェー71が破損し
たり、ウェーハトレイとの間で放電してウェーハが損傷
したりする従来の障害を防ぐことができる。
従って、本発明は、半導体製造工程における歩留り向上
に寄与するところが大である。
【図面の簡単な説明】
第1図は本発明の一実施例を説明する構成図、第2図は
本発明の他の実施例を説明する斜視図、第3図は従来の
静電チャックが装備された装置の一例を示す斜視図、 第4図は第3図の静電チャックの一例を示す斜視図、 第5図は第4図のX−X断面図、 である。 図において、 lは静電チャック、  1aは絶縁膜、lb、 lcは
電極、    ld、 leは端子、2は電源装置、 
   2a、2bは高圧電源、2C12dは出力端子、
  2eは接地端子、2f  2gは極性切替え手段、 3は搬送アーム、   3aはアーム駆動部、3Mアー
ム本体、    3cはウニ/’I’レイ、4は継電器
、      5は装置本体、6はウェーハ である。 木金明の一實内i脅・1Σ説明オう、脣(石12第 図 \ 、コー#良送アーム 従来r嘘″t+1ッ2ボ諷・蝉1樅た漱1の一分11示
す剥7見バΣ亮 図

Claims (1)

  1. 【特許請求の範囲】 1)静電チャック(1)と、電源装置(2)とを有し、 前記静電チャック(1)は、ウェーハ(6)を吸着する
    ものであって、吸着面に絶縁膜(1a)と、該絶縁膜(
    1a)の下に交互に配設された電極(1b、1c)と、
    該電極(1b、1c)から導出された端子(1d、1e
    )とを有するものであり、 前記電源装置(2)は、前記電極(1b、1c)に直流
    電圧を印加するものであって、2つの高圧電源(2a、
    2b)と、前記端子(1d、1e)に接続される出力端
    子(2c、2d)と、接地端子(2e)と、極性切替え
    手段(2f、2g)とを有するものであり、前記極性切
    替え手段(2f、2g)は、一方が前記接地端子(2e
    )、他方が前記出力端子(2c、2d)に極性切替え可
    能に接続されるように、前記高圧電源(2a、2b)の
    夫々に設けられるものであり、前記極性切替え手段(2
    f、2g)は、前記静電チャック(1)に吸着されてい
    る前記ウェーハ(6)が離脱される際、該ウェーハ(6
    )が有する残留電荷と同極性の電圧を出力端子(2c、
    2d)を介して前記電極(1b、1c)に印加するもの
    であることを特徴とする半導体製造装置。 2)静電チャック(1)と、搬送アーム(3)と、継電
    器(4)とを有し、 前記静電チャック(1)は、ウェーハ(6)を吸着する
    ものであって、装置本体(5)に内設されているもので
    あり、 前記搬送アーム(3)は、ウェーハ(6)を前記静電チ
    ャック(1)に着脱するものであって、前記装置本体(
    5)に気密可能に貫通支持されたアーム駆動部(3a)
    と、該装置本体(5)に内設され、かつ該アーム駆動部
    (3a)に旋回および昇降可能に枢支されたアーム本体
    (3b)と、該アーム本体(3b)の先端に前記静電チ
    ャック(1)に対面するように設けられたウェーハトレ
    イ(3c)とを有するものであり、前記ウェーハトレイ
    (3c)は、前記アーム駆動部(3a)と電気的に接続
    されているものであり、前記継電器(4)は、前記装置
    本体(5)と電気的に絶縁された前記アーム駆動部(3
    a)を接地するものであって、常時閉成されており、 前記継電器(4)は、前記搬送アーム(3)が前記静電
    チャック(1)に吸着されている前記ウェーハ(6)を
    受け取る際、前記ウェーハトレイ(3c)が該ウェーハ
    (6)に当接する直前に開成され、かつ当接した直後に
    閉成されるものである ことを特徴とする半導体製造装置。
JP2007572A 1990-01-16 1990-01-16 半導体製造装置 Expired - Fee Related JP2867526B2 (ja)

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