JPH03211760A - Repairing and connection of input/output pin - Google Patents

Abstract

PURPOSE:To enable the repair of broken input/output pin so as to establish pin grid array by fixing an i/o pin for repair to the electrically insulating member moored to a sound i/o pin, and connecting the i/o pin to an existing pad. CONSTITUTION:A through hole is provided, by the same knack as that performed in a printed board, is provided in an electrically insulating supporting plate 3 in advance, and a metallic land part 4b is plated, and an i/o pin 4 for repair is st herein, and is joined and fixed by solder. The electrically insulating supporting plate 3 is run through with an i/o pin 7a adjacent to the repair pin 4, and in the condition that the repair pin 4 is pressed against inner layer wiring 10 to such degree that the supporting plate 3 is deformed elastically, the supporting plate 3 is fixed to the i/o pin 7a by soldering itself to the soldering part 8a of the i/o pin 7a with solder 8b. Accordingly, making use of the elastic deformation of the electrically insulating support 3, to which the repair pin 4 is soldered in advance, the repair pin 4 is directly pressed against the metallized part of the wiring layer in the original pad position and is connected to it.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the repair of input/output pins of semiconductor packages, specifically, semiconductor packages suitable for package mounting for modules in which LSI chips are integrated at high density. Regarding the subjunctive method.

[Conventional technology]

With the trend toward miniaturization in semiconductor device manufacturing technology and an increase in the number of elements on a single device, signal connections between these devices and connections for external signals such as power supply are also miniaturized. For this reason, there is a need to provide a semiconductor package having a connection structure using input/output pins that can shorten signal connections, improve reliability, and facilitate the replacement of defective elements.

For example, in the high-density semiconductor device disclosed in Japanese Patent Publication No. 58-73139, the input/output pins of the external leads attached to the substrate of the semiconductor device and the bosses 1~ fixed to the through holes of the printed circuit board are bidirectional. They are inserted into the upper and lower sockets of the connector to establish electrical connections between the external leads of the semiconductor device and the printed circuit board.

A pin grid array structure with a large number of input/output pins as external leads of a semiconductor device enables easy and reliable mounting on a printed circuit board, but even one of these many input/output pins may fall off or fall off.

When bending occurs, installation becomes impossible.

[Problem to be solved by the invention]

As seen in the above-mentioned conventional technology, miniaturization of the mounting distance is required by making signal connections between chips and input/output pin connections for external signal connections. However, along with higher integration at the chip level, there is a trend toward higher density at the module level, where many chips are mounted on a single substrate, and as a matter of course,
The number of input/output pins is enormous, and it is difficult to say that there is no possibility of damage to the input/output pins, such as bending of the output pins or falling off the board pads, which occurs during the manufacturing process. In this regard, repair means for human output pins are also required for external REITs that are input/output pins of semiconductor devices in the prior art.

The purpose of the present invention is to be able to efficiently connect a large number of human output pins, to repair damaged input/output pins in case of damage such as bending or falling off, and to establish a pin grid array. The purpose of this invention is to provide a repair connection method for input/output pins.

[Means to solve the problem]

In order to achieve the above object, a semiconductor device according to the present invention includes a wiring board on which one or a plurality of semiconductor chips are mounted, and a large number of input/output pins as external leads on this board. In a semiconductor device consisting of a connector and a printed circuit board that are connected to pins to connect signals between wiring boards or to an external power supply, repairs are made to an electrically insulating member that is moored to an existing and healthy human output pin of the wiring board. The input/output pins are fixed and connected to existing pads on the wiring board.

[Effect]

There are metal pads on the surface of a wiring board on which many semiconductor chips are mounted, and input/output pins are brazed to these pads. Possible forms of damage to input/output pins that require repair include bent pins that shift the alignment of the pin grid, and pins that fall off. At this time, the metal pads also become unusable, making it difficult to repair the pins by soldering at the original pad positions.

Therefore, by utilizing the elastic deformation of the electrically insulating support to which the repair pin is previously brazed, the repair pin is directly pressed and connected to the metallized portion of the wiring layer at the original pad position. The support plate for the repair pin.

It can be fixed to a healthy pin near the repair pin position. Alternatively, the support plate of the repair pin can be fixed by being pressed by a connector plate into which the input/output pin is inserted and connected.

Since matching with the insertion hole of the pin array, that is, perfect alignment with no misalignment is required, a repair pad connected to the original pad position can be used. That is, by using a wired pin type outlet consisting of a wire and a pin part and brazing one end of the wire to the repair pad, the flexibility of the wire allows the connection to be made by inserting the pin to maintain pin alignment.

[Example] Embodiments of the present invention will be specifically described below with reference to the drawings.

1 to 3 are configuration diagrams showing a repair connection method for input/output pins according to an embodiment of the present invention. FIG. 1 is an overall configuration of the connection structure, FIG. 2 is a perspective view showing details of the vicinity of the repair pin, and FIG. 3 is a sectional view taken along line 1-1 in FIG.

One or more semiconductor chips are electrically connected and mounted on the upper surface of the ceramic wiring board 2.

A sealing cap 1 for sealing a semiconductor chip is provided on the upper part of the wiring board 2, and a single module is configured.

On the other hand, in order to connect the semiconductor chip to an external circuit, a metal pad 8 that electrically connects the surface layer of the wiring board 2 and the inner layer circuit wiring 10 is provided on the back surface of the wiring board 2, and the metal pad 8 has input/output pins. 7 is soldered to 8a.

On the other hand, a large number of through holes are provided in the printed circuit board 6 having inner layer wiring, and the connector pins 5a are inserted and soldered together, and the connector 5 is arranged.

By inserting and contacting the input/output pin 7 into the opening of the connector 5, external signal transmission within the module or between modules is achieved.

Next, a method of connecting the repair pin 4 will be explained using FIGS. 2 and 3. The input/output pin at the location of the repair pin 4 is repaired as follows. Through holes are provided in advance in the electrically insulating support plate 3 in the same manner as in the printed circuit board 6.

The metal runt portion 4b is plated, and a repair input/output pin 4 is inserted therethrough and fixed by soldering.

The electrically insulating support plate 3 is inserted into the input/output pin 7a adjacent to the repair pin 4, and the repair pin 4 is inserted into the inner layer wiring 1.
0, and while the support plate 3 is pressed to the extent that it is elastically deformed, the input/output pin 7a is brazed to the part 8a with solder 8b, and the support plate 3 is connected to the input/output pin 7a.
Fixed to. The solder solder 8b may be a brazing material having a lower melting point than the original soldering material 8a.

FIG. 4 shows still another embodiment, and is a sectional view showing how the repair pin is attached. The repair pin 4 is attached and fixed to the electrically insulating support plate 3 in the same manner as in the previous embodiment. The support plate 3 is provided with a positioning hole through which the input/output pin 7a near the repair pin 4 is inserted. The input/output pin 7a is inserted into the support plate 3, the repair pin 4 is positioned on the inner layer wiring 10, and all the input/output pins including the repair pin are inserted into the connector 5. At this time,
The support plate 3 is fixed by the contact pressure between the input/output pin 7a and the contact 9 of the connector 5, and the connection is achieved when the repair pin 4 is pressed against the metal pad or the internal wiring section.

FIG. 5 shows still another embodiment, and is a sectional view showing how the repair pin is attached. A repair pad 11 electrically connected to the original metal pad 8 is provided on the back surface of the wiring board 2 in advance. On the other hand, a wire 4c is attached to the head portion of the repair pin 4, and the other end of the wire 4c is bonded to the repair pad 11 in the same manner as the repair wiring is routed. After that, connector 5
The repair pin 4 is inserted into the contact 9 using the extensibility of the wire 4c, and the other input/output pin is inserted into the connector 5.

FIG. 6 and FIG. 7 are perspective views showing other embodiments.

In the embodiment shown in FIG. 6, the support member of the repair pin 4 has a cross shape, and a healthy input/output pin 7 adjacent to the repair pin 4
Using a, the support member is moored and fixed to the four input/output pins.

In the embodiment shown in FIG. 7, the repair pin 4 is fixed to the support member 3 by being moored to two adjacent input/output pins.

[Effects of the Invention] According to the present invention, damaged input/output pins can be efficiently repaired when the input/output pins are damaged due to bending, falling off, etc., and a pin grid array is established. As a result, the pin attachment improves workability, provides an input/output pin connection structure that minimizes signal connections, and provides a high-performance, highly reliable semiconductor package.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a connection structure according to an embodiment of the present invention, FIG. 2 is a perspective view showing details near the repair pin, and FIG.
1- in the figure is a sectional view taken in the direction of arrows, and FIG. FIG. 5 is a cross-sectional view showing an embodiment of another repair connection method, FIG. 5 is a cross-sectional view according to yet another embodiment of the present invention, and FIGS. 6 and 7 are each a further embodiment of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Sealing cap, 2... Wiring board, 3... Repair pin fixing member, 4... Repair pin, 5... Connector,
6... Printed circuit board, 7... Input/output pin, 8...
Metal pad, 9... Connector contact, 10...
Inner layer wiring, 11 chestnut diagram diagram 0 construction plan diagram

Claims (1)

[Claims] 1. A wiring board on which one or more semiconductor chips are electrically connected and mounted, and a large number of input/output pins as external leads on the wiring board, and the input/output of the wiring board In a semiconductor device consisting of a connector and a printed circuit board that are connected to pins to connect signals between the wiring boards or to an external power supply, the electrically insulating member moored to the existing input/output pins of the wiring board is repaired. 1. A repair connection method for input/output pins, characterized in that the repair input/output pins are fixed, and the repair input/output pins are connected to existing pads of the wiring board.