JPH03214652A - Semiconductor chip carrier - Google Patents

Abstract

PURPOSE:To remove the limitation placed on the shape of a heat-dissipating body and to simply attach the heat-dissipating body by a method wherein a metal layer formed so as to protrude to be more than parts of other metal layers is provided on the surface of an insulating layer on a metal sheet. CONSTITUTION:In a metal layer 6 which has been formed on a first U-shaped part 3 for heat-dissipating use and on the surface of an insulating layer 1, a protruding part 7 of the metal layer 6 formed so as to protrude to be more than other metal layers is provided on the surface of the insulating layer 1 formed on a metal sheet 2. A heat-dissipating body 9 is attached, via a heat- conductive adhesive layer 8, to the protruding part 7 of the metal layer 6 formed so as to be united to the first U-shaped part 3. Thereby, regarding the heat- dissipating body 9 for heatdissipating use to the outside, the limitation on a shape when it is attached to the metal sheet 2 is removed, and the body in an arbitrary shape can be attached to the protruding part 7 of the metal layer 6 by using the heat-conductive adhesive layer 8.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor chip carrier used for mounting a semiconductor chip, and particularly to a semiconductor chip carrier with excellent heat dissipation.

[Prior Art] In recent years, printed wiring boards such as epoxy resin laminates based on glass cloth have been used as insulating layers constituting semiconductor chip carriers. However, such a printer 1/wiring board has poor heat conductivity and cannot dissipate heat well.

Previously, the present inventors disclosed in Japanese Patent Application Laid-Open No. 62-52992,
A semiconductor chip carrier is provided which is composed of a resin laminated printed wiring board in which a metal plate is embedded in an insulating layer and a part of the metal plate is exposed to the outside to improve heat dissipation. The sixth example shows how this product is equipped with a semiconductor chip.
As shown in the figure.

In this device, an insulating layer 1 covers a metal plate 2 from its periphery to the center, and recesses without an insulating layer are formed on both sides of the metal plate 2 around the center of the metal plate 2, and these recesses The metal plate 2 is exposed on the bottom surface of the device, and the first recess 3 is provided for heat radiation, and the second recess 4 is provided for mounting the semiconductor chip 5. In the semiconductor chimp carrier, the metal plate 2 is exposed to the outside in the recessed part, so it has good heat dissipation, and the insulating layer 1 covers the part from the periphery to the center of the metal temporary 2, which makes it possible to improve the printed wiring board. A semiconductor chip which prevents the movement of a metal plate 2 inserted inside the area of a terminal pin l3 arranged in an insulating layer 1, and further seals the gap between the insulating layer 1 and the metal plate 2 to improve moisture resistance. It was effective when I turned it into a career.

However, as the amount of heat generated by semiconductor chips increases due to higher speed, higher integration, and higher functionality of semiconductor chips, there are increasing expectations for the creation of semiconductor chip carriers with even better heat dissipation. When attaching the body 9 to the semiconductor chip carrier, since the metal plate 2 is recessed from the surface of the insulating layer 1, the mounting portion of the heat dissipation body 9 is limited to a heat dissipation body 9 smaller than the heat dissipation recess 3. The shape of the heat dissipating body 9 is restricted, and the degree of freedom in the shape of the heat dissipating body 9, which aims to increase the amount of heat dissipated, is small.

[Problem to be solved by the invention]

In order to further improve heat dissipation performance, it is an object of the present invention to provide a semiconductor chip carrier having a structure that eliminates restrictions placed on the shape of a heat sink and allows the heat sink to be easily attached.

[Means for Solving the Problems] In order to solve the above problems, the present invention has a recess formed by a metal plate embedded in an insulating layer and a perforated insulating layer. Provided is a semiconductor chip carrier characterized in that the surface of the insulating layer on the metal plate has a metal layer formed over the surface of the insulating layer so as to protrude from other metal layer parts. It is.

〔Example〕

The present invention will be explained below based on the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is an XY sectional view of FIG. 1. The semiconductor chip carrier shown in FIG. 2 includes a metal plate 2 embedded in an insulating layer 1, and a first recess 3 for heat dissipation formed between one surface of this metal plate 2 and the insulating layer 1.
and a second recess 4 for mounting a semiconductor chip 5 formed by the other surface of the metal plate 2 and the insulating layer 1, and the first recess 3 for heat dissipation and the surface of the insulating layer 1. In the metal layer 6 formed on the metal plate 2, a protrusion 7 of the metal layer 6 formed to protrude from other metal layers exists on the surface of the insulating layer 1 formed on the metal plate 2. A thermally conductive adhesive layer 8 is provided on the protrusion 7 of the metal layer 6 that is integrally formed with the first recess 3.
A heat radiator 9 is attached via.

Note that the shapes of the first recess 3 and the second recess 4 are generally quadrangular prisms, but are not particularly limited, and any shape such as a cylinder can be used. In addition, this protrusion 7
The shape may be a quadrangular prism subdivided as shown in FIG. 3, a single quadrangular prism as shown in FIG. It may have any shape, and is not particularly limited.

With the semiconductor chip carrier having the above structure, there is no restriction on the shape of the heat dissipation body 9 for external heat dissipation for attachment to the metal plate 2, and any shape can be attached to the protrusion 7 of the metal layer 6. It can be attached by means of a thermally conductive adhesive layer 8.

The semiconductor chip 5 mounted in the second recess 4 is connected via a metal wire 12 to a conductor circuit 11 formed on the surface of the insulating layer 1 on the side where the semiconductor chip 5 is mounted. This conductor circuit
1 is connected to a through-hole plating layer of a through-hole 14 formed in the insulating layer 1 into which a terminal pin 13 serving as an external terminal is inserted.

The heat generated from the semiconductor chip 5 mounted in the recess 4 for mounting the semiconductor chip 5 is absorbed by the metal plate 2, and is further integrated with the metal plate 2 on the opposite side of the metal plate 2, which has excellent thermal conductivity. A fin 10 is attached to the upper surface of the metal layer 6 formed on the metal layer 6 and attached to this metal layer with a thermally conductive adhesive layer 8.
The heat is transferred to the heat dissipation body 9 having a metal fi. There is no need to worry about 2. This effect makes it possible to respond to higher integration, higher functionality, and higher speed of the semiconductor chip 5.

In the semiconductor chip carrier having the above configuration, the form of the semiconductor chip carrier is such that the heat sink 9 is connected to the insulating layer 1.
In order to improve heat dissipation, it is preferable that the terminal pins 13 be disposed in through holes 14 formed in the insulating layer 1 so as to protrude on the side opposite to the side to which the terminal pins 13 are attached. The reason for this is that when this semiconductor chip carrier is mounted on a motherboard, the heat sink is exposed to the outside air, and a large heat sink can be attached without being restricted by the area where the terminal pins are placed. .

The shape of the heat sink 9 may be a prism with side fins, a cylinder with top fins, or a combination thereof, which is generally used as a heat sink.

Next, regarding the materials used, the insulating layer 1 constituting the semiconductor chip carrier shown in FIG. 2 is made of an insulating material obtained by curing the resin of a prepreg obtained by impregnating a base material with a resin and drying it. Here, the resin used as the insulating material is preferably one that has excellent heat resistance and moisture resistance, and has high resin purity, particularly low ionic impurities. Specifically, epoxy resin, polyimide resin, fluorine resin, phenol resin, unsaturated polyester resin, PPO resin, etc. are suitable. Note that as the base material of the insulating material, an inorganic material such as glass fiber is preferable to paper because it has superior heat resistance and moisture resistance.

As the metal plate 2 embedded in the insulating layer 1, a copper plate, a copper alloy plate, a copper-invar-copper alloy plate, an iron-nickel alloy plate, other steel plates, iron plates, aluminum plates, etc. can be used, and as the heat sink 9, Ceramics such as aluminum nitride, silicon carbide, and alumina, copper plates, copper alloy plates, copper-invar-copper alloy plates, iron-nickel alloy plates, other steel plates, iron plates, aluminum plates, etc. can be used.

The metal layer 6 integrally formed on the first recess 3 and the surface of the insulating layer 1 is a gold plating layer, a solder plating layer, etc., and these can be formed by electroless plating. The protrusions 7 of the metal layer 6 can also be formed by these platings.

The thermally conductive adhesive layer 8 that adheres the protrusion 7 of the metal layer 6 and the heat sink 9 may be formed of epoxy resin, polyimide resin, an adhesive containing gold or silver in modified resin of these resins, or solder. I can do it.

〔Effect of the invention〕

As described above, the semiconductor chip carrier according to the present invention has a recess formed by a metal plate embedded in an insulating layer and a perforated insulating layer, and a recess formed between the recess and the surface of the insulating layer. A semiconductor chip carrier having a metal layer on the surface of an insulating layer on a metal plate, which is formed so as to protrude from other metal layers, can eliminate restrictions on the shape of the heat sink, and also allows the heat sink to be A semiconductor chip carrier with an easy-to-install structure that can further improve heat dissipation and cope with the increased heat generated by semiconductor chips due to higher integration, higher functionality, and faster speeds. This is the result.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2 is an X-Y sectional view thereof, Fig. 3 is a top view of Fig. 2 when there is no external heat sink, and Fig. 4 The figure is a partial view similar to FIG. 3 of another embodiment, and FIG.
The figure shows a partial view similar to FIG. 3 of another embodiment, and FIG. 6 shows a sectional view of a conventional example. 1... Insulating layer 3... First recess 5... Semiconductor chip 7... Protrusion 9... Heat sink 11... Conductor circuit 13... Terminal pin 2... Metal plate 4... Second recess 6... Metal layer 8... Adhesive layer 10... Fin 12... Metal wire 14... Through hole

Claims (1)

[Claims] (1) It has a recess formed by a metal plate embedded in an insulating layer and a perforated insulating layer, and in a metal layer formed across this recess and the surface of the insulating layer, the other metal layer is A semiconductor chip carrier characterized by having a metal layer formed to protrude from a portion on a surface of an insulating layer on a metal plate.