JPH03215638A - Silver-oxides series contact material - Google Patents
Silver-oxides series contact materialInfo
- Publication number
- JPH03215638A JPH03215638A JP2012211A JP1221190A JPH03215638A JP H03215638 A JPH03215638 A JP H03215638A JP 2012211 A JP2012211 A JP 2012211A JP 1221190 A JP1221190 A JP 1221190A JP H03215638 A JPH03215638 A JP H03215638A
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- weight
- oxides
- silver
- contact material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 20
- OTCVAHKKMMUFAY-UHFFFAOYSA-N oxosilver Chemical class [Ag]=O OTCVAHKKMMUFAY-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052738 indium Inorganic materials 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims 4
- 229910001923 silver oxide Inorganic materials 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 10
- 229910052718 tin Inorganic materials 0.000 abstract description 7
- 239000002344 surface layer Substances 0.000 abstract description 5
- 230000002159 abnormal effect Effects 0.000 abstract description 4
- 229910052793 cadmium Inorganic materials 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- AYKOTYRPPUMHMT-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag] AYKOTYRPPUMHMT-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004480 active ingredient Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000003260 vortexing Methods 0.000 description 1
Landscapes
- Contacts (AREA)
Abstract
Description
【発明の詳細な説明】
《産業上の利用分野》
本発明はＡｇを主成分とし、その中に金属酸化物を分散
した銀一酸化物系の接点材料に関するものである．
《従来の技術》
従来、電気接点材料としては、いろいろなものが用いら
れているが、とりわけＡｇ−ＣｄＯ接点が広く使用され
ている。DETAILED DESCRIPTION OF THE INVENTION <<Industrial Application Field>> The present invention relates to a silver monoxide-based contact material containing Ag as a main component and having a metal oxide dispersed therein. <<Prior Art>> Conventionally, various materials have been used as electrical contact materials, but Ag-CdO contacts have been particularly widely used.
ＡｇにＣｄＯとＳｂ，Ｓｎ，Ｉｎ，Ｃ：ｕ等の酸化物を
分散させた接点は、酎溶着性、耐アーク性、耐消耗性、
接触安定性などの諸接点特性が優れているため各種スイ
ッチ、コンタクター、ブレーカーなど小から大電流領域
まで広く用いられている．
近時各産業分野における合理化、自動化は目覚ましい発
達を遂げているが，これに伴ない装置に大型化、複雑化
する傾向にある一方、これら装置の制御系はむしろ高い
精密度を要求されるため、急速に電子化制御に移行して
いる．
電気回路の断続において、電子化された正確な制御は制
御角が一定となり、接点のＯＮの時期とＯＦＦの時期が
ずれることなく常に一定の状態にコントロールされるこ
ととなり、この結果接点開閉時には疑似的な直流現象が
起こることにより、方の極から他方の極へ接点材質が層
状に維持し始め、接触安定性が著しく損なわれ、時間の
経過とともにその堆積物が欠落し急激な接点消耗へと発
展することとなる．
そこで、本願人は、思考基盤は、電気接点の表面の清浄
作用やアークに対する諸現象、たとえば消弧作用などが
添加する酸化物の物性特にその蒸気圧の温度特性に最も
関係が深いとする考え方に基づいて研究をすすめていた
が、Ａｇ中にＣｄ，Ｓｂ，Ｓｎ，Ｉｎ，Ｃｕ等の酸化物
を分散させた電気接点材料について種々な回路条件で試
験を行ったところ前述のようなある条件下で接点を開閉
するとどちらが一方の極に接点材料が堆積し始め、その
堆積物にアークが集中して異常消耗に発展することがわ
かった．
《発明が解決しようとする課題》
そこで．上記の異常消耗につき、その原因を追求した．
ここで，通常電気接点を開閉すると、接点間には激しい
アークが発生し、接点表面はかなりの高温にさらされる
．
このとき接点表面が、接点特性に有効な成分が逸散して
消耗するのであり、この際失われた効果的な成分が接点
内部から表層部へ間断なく補われるのが理想的な接点材
料といえる．
ところで、前掲（１）Ａｇ−Ｃｄ−Ｓｂ−Ｃｕ一Ｉｎ−
Ｓｎ系っレ）ては、この効果的成分が順調に供給されな
いため前述のような現象が起こったものと考えられる。Contacts made of Ag with CdO and oxides such as Sb, Sn, In, and C:u dispersed have excellent weldability, arc resistance, wear resistance,
Due to its excellent contact characteristics such as contact stability, it is widely used in various switches, contactors, breakers, etc. from small to large current ranges. Rationalization and automation in various industrial fields have made remarkable progress in recent years, but as a result, equipment has tended to become larger and more complex, and the control systems for these equipment are required to have higher precision. , rapidly transitioning to electronic control. When electrical circuits are switched on and off, accurate electronic control keeps the control angle constant, and the ON and OFF timings of the contacts are always controlled in a constant state without any lag. As a result, when the contacts open and close, there is a Due to the direct current phenomenon that occurs, the contact material begins to maintain a layered structure from one pole to the other, significantly impairing the contact stability, and over time, the deposits are lost and the contact wears out rapidly. It will develop. Therefore, the applicant believes that the cleaning effect on the surface of electrical contacts and various phenomena against arcs, such as arc-extinguishing effects, are most closely related to the physical properties of the added oxide, especially its vapor pressure and temperature characteristics. However, when conducting tests under various circuit conditions on electrical contact materials in which oxides such as Cd, Sb, Sn, In, and Cu were dispersed in Ag, certain conditions as mentioned above were found. It was found that when the contacts were opened and closed at the bottom, contact material began to accumulate on one pole, and arcs were concentrated on the deposits, leading to abnormal wear. 《Problems to be solved by the invention》 So. We investigated the cause of the abnormal wear and tear mentioned above. When electrical contacts are normally opened and closed, a strong arc is generated between the contacts and the contact surfaces are exposed to considerably high temperatures. At this time, the contact surface wears out as the effective components for the contact properties dissipate, and the ideal contact material is such that the effective components lost at this time are continuously replenished from the inside of the contact to the surface layer. Yes. By the way, the above (1) Ag-Cd-Sb-Cu-In-
For Sn-based materials, it is thought that the above-mentioned phenomenon occurs because this effective component is not supplied smoothly.
これらについて詳細な検討を進めた結果接点内部から表
層への順調な有効成分の供給力はアークによる表層成分
の揮発によって促がされる点に着目し、各種酸化物につ
いて実験を繰り返した結果、ＡｇにＣｄ，ＳｂとＣｕ
， Ｉｎの各酸化物およびＳｒＩとＴｅの各酸化物とを
複合添加することによって有効成分の表層への供給が順
調になり層状堆積防止に極めて大きい効果があることを
見い出したものであり、本願請求項（１）の接点材料に
あっては、このようにすることで、種々な回路条件に適
合し、しかも層状の堆積物や欠落などによ・る異常な消
耗のない電気接点材料を提供しようとするものであり、
請求項（２）では、さらに適量のＦｅ，Ｎｉ，Ｇｏ酸化
物を一種以上添加することで、さらにその特性の向上を
意図したものである．
《課題を解決するための手段》
本発明は上記の目的を達成するために、請求項（１）で
は、銀を主成分とし、これに金属成分が１〜１０重量％
となるｃｄ＃化物と、金属成分が０．１〜６．２重量％
となるＳｂ酸化物と、金属成分が０．０５〜５重量％と
なるＣｕ，Ｉｎの酸化物と、金属成分が０．０５〜５重
量％となるＳｎの酸化物と更に金属成分が０．０１〜２
重量％Ｔｅ酸化物とが分散されていることを特徴とする
銀一酸化物系の接点材料を提供しようとしており、ざら
に請求項（２）では、上記請求項（１）に、０．０１〜
０．５重量％となるＦｅ，Ｎｉ ，Ｃｏ醇化物の一種以
上をも分散させるようにしたことを特徴とする銀一酸化
物系の接点材料を提供しようとしている．
《実施例》
先ず、請求項（１）につき後記具体例を示して、さらに
これを詳記すると，先ずこのような電気接点材料を製造
するには既知のように、焼結法によっても内部酸化法に
よってもよいが、溶製内部酸化法ではＳｂとＴｅおよび
Ｓｎを添加したＡｇ合金を酸化雰囲気中で高温に保持し
てその表面より酸素を侵入させ、Ｓｂ，Ｃｕ，Ｔｅ，Ｓ
ｎその他の元素を選択的に酸化するものであり，長時間
該酸化を続けることによりＡｇマトリックス中に当該酸
化物を分散せしめて電気接点材料を製するものである．
ここで、ＡｇへのＣｄ添加量を１〜１０重量％に限定し
た理由は、 １重量％未渦の添加であると、アーク発生
時の接点表面清浄作用が期待できず、ｌＯ重量％を越え
た添加になると耐消耗性が劣化する傾向にあるからであ
る．
また、ＳｂとＴｅとＣｕ−ＩｎおよびＳｎの添加量の上
限を夫々６．２重量％と２重量％および５重量％に限定
しなければならない理由は、Ａｇ − Ｓｂ合金のα固
溶体におけるＳｂの最大固溶限が、３００℃で８．２重
量％であり、この添加量を超過するＳｂを添加した場合
には著しく加工性を阻害することとなり、量産的加工が
不能となるからでありＡｇに対し、Ｃｕ−Ｉｎの添加は
３０％程度の量でも充分可能だが、上記の通り既にＡｇ
に最大１０重量％のＣｄと６．２重量％のＳｂを含んだ
合金系に更にＣｕ−Ｉｎ−Ｓｎを添加する場合であると
、Ａｇへの固溶度が急に減少すると共に各添加元素が５
重量％を越えた添加であると展延性が著しく低下し、所
望形状までの加工が極めて困難となるからである。After conducting detailed studies on these issues, we focused on the fact that the smooth supply of active ingredients from the inside of the contact to the surface layer is facilitated by the volatilization of the surface layer components due to the arc, and as a result of repeated experiments with various oxides, we found that Ag Cd, Sb and Cu
It has been discovered that by adding oxides of In, SrI, and Te in combination, the supply of active ingredients to the surface layer becomes smooth and has an extremely large effect on preventing layered deposition. By doing so, the contact material of claim (1) provides an electrical contact material that is compatible with various circuit conditions and that does not suffer from abnormal wear due to layered deposits or missing parts. It is intended to
In claim (2), it is intended to further improve the properties by adding an appropriate amount of one or more of Fe, Ni, and Go oxides. <<Means for Solving the Problems>> In order to achieve the above object, the present invention in claim (1) includes silver as a main component, and a metal component of 1 to 10% by weight.
cd# compound and metal component is 0.1 to 6.2% by weight
An oxide of Cu and In with a metal component of 0.05 to 5% by weight, an oxide of Sn with a metal component of 0.05 to 5% by weight, and an oxide of Sn with a metal component of 0.05 to 5% by weight. 01-2
The present invention attempts to provide a silver monoxide-based contact material characterized in that Te oxide is dispersed in a proportion of 0.01% by weight. ~
An object of the present invention is to provide a silver monoxide-based contact material characterized by dispersing 0.5% by weight of one or more of Fe, Ni, and Co moltenides. 《Example》 First, a specific example will be shown below regarding claim (1), and will be described in detail. First, in order to manufacture such an electrical contact material, internal oxidation is carried out by a sintering method as well. However, in the internal oxidation method, an Ag alloy to which Sb, Te, and Sn are added is held at high temperature in an oxidizing atmosphere to allow oxygen to enter from the surface.
This method selectively oxidizes n and other elements, and by continuing the oxidation for a long time, the oxide is dispersed in the Ag matrix to produce an electrical contact material.
Here, the reason why the amount of Cd added to Ag was limited to 1 to 10% by weight is that if 1% by weight is added without vortex, no cleaning effect on the contact surface can be expected when an arc occurs, and if the amount exceeds 10% by weight. This is because the abrasion resistance tends to deteriorate when added. Furthermore, the reason why the upper limits of the amounts of Sb, Te, Cu-In, and Sn must be limited to 6.2% by weight, 2% by weight, and 5% by weight, respectively is that the amount of Sb in the α solid solution of the Ag-Sb alloy is The maximum solid solubility limit is 8.2% by weight at 300°C, and if Sb is added in excess of this amount, processability will be significantly inhibited, making mass production processing impossible. On the other hand, it is possible to add Cu-In in an amount of about 30%, but as mentioned above, it is already possible to add Cu-In in an amount of about 30%.
When Cu-In-Sn is further added to an alloy system containing up to 10% by weight of Cd and 6.2% by weight of Sb, the solid solubility in Ag suddenly decreases and each additional element is 5
This is because if it is added in excess of % by weight, the malleability will drop significantly and processing into the desired shape will become extremely difficult.
またＴｅの上限を上記の如く２重量％に限定した理由は
、ＴｅのＡｇに対する溶解度が低いことに加え、これ以
上の添加では塑性加工が極めて困難なためである。Further, the reason why the upper limit of Te is limited to 2% by weight as described above is that, in addition to the low solubility of Te in Ag, adding more than this makes plastic working extremely difficult.
一方、Ｓｂ，Ｔｅ，Ｃｕ，Ｉｎ，Ｓｎの添加量が夫々０
．１重量％、０．０１重量％、０．０５重量％未渦の場
合は後述する添加効果が得られない．
次に請求項（２）においてＦｅ族元素の添加量を０．０
１〜０．５重量％に限定した理由は、Ａｇに対するＦｅ
族元素の固溶度が０．５重量％を超えると急激に減少す
るためＡｇマトリック中に偏在、偏析して加工性を阻害
し０．０ｌ重量％未渦の添加では内部酸化組織の調整に
対する効果が低いためである．ここで具体例を示せば、
９８．５重量％以上の純度を有するＣｄ，Ｓｂ，Ｔｅ，
Ｃｕ，Ｉｎ，ＳｎおよびＦｅ，Ｎｉ，ｃｏを原料とし下
記（表）に示す組成合金を次の工程で製作した。On the other hand, the amounts of Sb, Te, Cu, In, and Sn added were 0, respectively.
．． If 1% by weight, 0.01% by weight, or 0.05% by weight is not swirled, the effect of addition described later cannot be obtained. Next, in claim (2), the amount of Fe group element added is 0.0.
The reason why it was limited to 1 to 0.5% by weight is that Fe
When the solid solubility of group elements exceeds 0.5% by weight, it rapidly decreases, so they are unevenly distributed and segregated in the Ag matrix, impeding workability, and adding 0.0l% by weight without vortexing is difficult to adjust the internal oxidation structure. This is because the effect is low. Here is a specific example:
Cd, Sb, Te, with a purity of 98.5% by weight or more,
Using Cu, In, Sn, and Fe, Ni, and Co as raw materials, an alloy with the composition shown in the table below was manufactured in the following steps.
高周波誘導溶解炉で、溶解、鋳造したインゴットを熱間
鍛造表面切削後、その一面にＡｇ板を熱圧着して、ろう
付用のＡｇ層を形成する．次に当該素材を冷間圧延して
厚さ２■■の板にした後直径６ｉの円盤状に打抜き、こ
れを７２０℃の酸化雰囲気中でＣｄ，Ｓｂその他の添加
金属を内部酸化して夫々本発明合金（（Ａ）〜（Ｈ））
を得た．比較のためＡｇ−１０重量％Ｃｄ他の従来例合
金をつくり実験に供した．
接点試験は、接触抵抗とアーク消耗量および層状堆積の
傾向について、夫々ＡＳＴＭ接点試験機（ＡＣ：２００
Ｖ ，５０Ａ） ト７ − ク消耗試験機（ＡＣ２００
Ｖ．１０Ａ）オよび市販スイッチによる実機テス｝ （
ＡＣ２００Ｖ，３５Ａ）を行って評価した結果が別表で
ある．
《発明の効果》
請求項（１）（２）によるときは、別表に示される如く
、Ａｇ−１０Ｃｄ等従来例の層状堆積物に対し、本発明
になる（Ａ）〜（Ｈ）合金は何れも０．１ｍｍ″以下の
極〈微小であり、ＳｂとＴｅの複合添加が極めて効果的
であることを示している．
しかし、これはＡｇに対するＳｂとＴｅの複合添加が条
件であり、Ｔｅ酸化物のみの添加では層状堆積物防止に
対する効果が著しく低いことを念のため述べておく。An ingot is melted and cast in a high-frequency induction melting furnace, the surface is cut by hot forging, and an Ag plate is thermocompression bonded to one surface to form an Ag layer for brazing. Next, the material was cold-rolled into a plate with a thickness of 2■■, punched into a disk shape with a diameter of 6i, and Cd, Sb, and other additive metals were internally oxidized in an oxidizing atmosphere at 720°C. Invention alloy ((A) to (H))
I got it. For comparison, other conventional alloys of Ag-10% by weight Cd were prepared and used in experiments. Contact testing was performed using an ASTM contact testing machine (AC: 200
V,50A)
V. 10A) Actual machine test using O and commercially available switches} (
The evaluation results are shown in the attached table. <<Effect of the invention>> In accordance with claims (1) and (2), as shown in the attached table, any of the alloys (A) to (H) according to the present invention can be used for layered deposits of conventional examples such as Ag-10Cd. It is extremely small (less than 0.1 mm), indicating that the combined addition of Sb and Te is extremely effective. However, this requires the combined addition of Sb and Te to Ag, and Te oxidation It should be noted that the effect on preventing layered deposits is extremely low if only additives are added.
また、アーク消耗量についても、本発明合金は何れも低
く、アークに対する耐消耗性即ち消弧特性にも効果的に
作用している．In addition, all of the alloys of the present invention have a low amount of arc wear, and have an effective effect on arc wear resistance, that is, arc extinguishing properties.
Claims (2)
％となるＣｄ酸化物と、金属成分が０．１〜６．２重量
％となるＳｂ酸化物と、金属成分が０．０５〜５重量％
となるＣｕ、Ｉｎの酸化物と、金属成分が０．０５〜５
重量％となるＳｎの酸化物と更に金属成分が０．０１〜
２重量％Ｔｅ酸化物とが分散されていることを特徴とす
る銀−酸化物系の接点材料。(1) A Cd oxide whose main component is silver, a Cd oxide with a metal component of 1 to 10% by weight, an Sb oxide with a metal component of 0.1 to 6.2% by weight, and a metal component of 0.1 to 10% by weight. 05-5% by weight
Cu, In oxides and metal components of 0.05 to 5
% by weight of Sn oxide and further metal components from 0.01 to
A silver-oxide contact material characterized in that 2% by weight of Te oxide is dispersed therein.
％となるＣｄ酸化物と、金属成分が０．１〜６．２重量
％となるＳｂ酸化物と、金属成分が０．０５〜５重量％
となるＣｕ、Ｉｎの酸化物と、金属成分が０．０５〜５
重量％となるＳｎの酸化物と、金属成分が０．０１〜２
重量％Ｔｅ酸化物と、さらに金属成分として０．０１〜
０．５重量％となるＦｅ、Ｎｉ、Ｃｏ酸化物の一種以上
とが分散されていることを特徴とする銀−酸化物系の接
点材料。(2) A Cd oxide whose main component is silver, a metal component of 1 to 10% by weight, an Sb oxide whose metal component is 0.1 to 6.2% by weight, and a metal component of 0.1 to 6.2% by weight. 05-5% by weight
Cu, In oxides and metal components of 0.05 to 5
Sn oxide and metal component are 0.01 to 2% by weight
wt% Te oxide and further 0.01~ as metal component
A silver-oxide contact material characterized in that 0.5% by weight of one or more of Fe, Ni, and Co oxides is dispersed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012211A JPH03215638A (en) | 1990-01-22 | 1990-01-22 | Silver-oxides series contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012211A JPH03215638A (en) | 1990-01-22 | 1990-01-22 | Silver-oxides series contact material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03215638A true JPH03215638A (en) | 1991-09-20 |
Family
ID=11799052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012211A Pending JPH03215638A (en) | 1990-01-22 | 1990-01-22 | Silver-oxides series contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03215638A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020241854A1 (en) * | 2019-05-31 | 2020-12-03 | オムロン株式会社 | Material for contact and containing ag alloy as main component, contact using said material for contact, and electrical device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58110639A (en) * | 1981-12-23 | 1983-07-01 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
-
1990
- 1990-01-22 JP JP2012211A patent/JPH03215638A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58110639A (en) * | 1981-12-23 | 1983-07-01 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020241854A1 (en) * | 2019-05-31 | 2020-12-03 | オムロン株式会社 | Material for contact and containing ag alloy as main component, contact using said material for contact, and electrical device |
| JPWO2020241854A1 (en) * | 2019-05-31 | 2020-12-03 | ||
| TWI755745B (en) * | 2019-05-31 | 2022-02-21 | 日商歐姆龍股份有限公司 | Contact material mainly composed of Ag alloy, contact and electronic equipment using the contact material |
| EP3978638A4 (en) * | 2019-05-31 | 2023-09-06 | OMRON Corporation | CONTACT MATERIAL AND CONTAINING AG ALLOY AS MAIN COMPONENT, CONTACT USING SAID CONTACT MATERIAL, AND ELECTRICAL DEVICE |
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