JPH03215661A - Ion plating device - Google Patents

Abstract

PURPOSE:To uniformly melt an evaporating material and to stably evaporate this material by melting and evaporating the evaporating material in a crucible by a hollow cathode discharge to form the plasma thereof and melting and evaporating the material by making combination use of induction heating. CONSTITUTION:An AC magnetic field is impressed from a working coil 3 mounted in the crucible 2a consisting of graphite, etc., in a vacuum chamber 8. The evaporating material 1, such as Si, housed therein is melted by induction heating in this way. Further, an arc discharge is effected between a hollow cathode 4 to supply gaseous Ar, etc., and the crucible 2a to melt, heat and evaporate the above-mentioned evaporating material 1 and the vapor thereof is made into the plasma by an electron beam 6. A thin film of Si3N4, etc., is formed by causing reaction with a reactive gas, such as a-Si or N2, etc., on a base body 5 which is impressed with a bias 7 and is heated to a prescribed temp. by a heater 10. The hollow cathode discharge and the induction heating are used in combination for heating and melting the evaporating material 1 in the above-mentioned method, by which the evaporating material 1 is uniformly heated and melted. The damaging, bumping, etc., of the crucible 2a are thus prevented and the evaporation and film formation are stably executed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ion plating apparatus used for forming a film of a metal, a semiconductor, or a compound containing them on a substrate.

[Summary of the invention]

In an ion plating device that uses a hollow cathode to melt, evaporate, and turn the evaporated material in the crucible into plasma using an arc-like discharge to form a film of the evaporated material or a compound containing the evaporated material on the substrate, the area around the crucible is A working coil was installed to perform induction heating to uniformly melt the evaporated substance and enable stable evaporation.

[Conventional technology]

In a conventional hollow cathode ion plating apparatus, as shown in FIG. 2, an electron beam 6 generated from a tubular hollow cathode 4 into which argon gas or the like can be introduced
The light heads straight toward the receptacle 2b and is irradiated onto the surface of the evaporated substance 1. That is, the evaporative substance 1 is melted, evaporated, and turned into plasma by the energy of the discharge. Then, the ionized evaporated substance (not shown) is deposited to form a film on the substrate 5 in the vacuum chamber 8 to which the high ass voltage 7 is applied. Note that nitrogen gas, hydrocarbon gas,
By introducing oxygen gas or the like through the reaction gas nozzle 9, a film of a compound of the evaporated substance or a mixture thereof was formed.

[Problem to be solved by the invention]

However, in the conventional hollow cathode type ion plating apparatus, the irradiation area of the electron beam 6 is small, and only a part of the surface of the stem material 1 is intensively melted. However, the entire aluminum inside the crucible does not melt, but only the irradiated portion evaporates significantly, creating a hollow hole that damages the crucible and causes bumping. Therefore, it was extremely difficult to form a film.

[Means to solve the problem]

In view of the above points, the present invention makes it possible to uniformly melt the evaporated substance in the crucible and evaporate it stably by using induction heating using a working coil installed around the crucible. Become.

[Effect] When an alternating magnetic field is applied from the working coil, the crucible (
In the example, graphite is used), and depending on the substance, eddy currents are generated in the evaporated substance itself, the temperature rises due to Joule heat, and it melts. Therefore, unlike local melting caused by electric discharge alone, it is possible to uniformly melt the evaporated substance and evaporate it stably. Furthermore, the amount of evaporation can be controlled by adjusting the induction output.

〔Example〕

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing the structure of an ion plating apparatus according to an embodiment of the present invention.

A working coil 3 for induction heating is installed at the bottom of a graphite receptacle 2a containing an explosive substance 1. The working coil 3 is made from a processed copper tube, and a refrigerant is flowed inside to prevent overheating.

After the evaporated substance 1 is melted by induction heating, argon gas is flowed through the hollow cathode 4 at the top of the crucible 2a, and a negative voltage is applied to the hollow cathode 4 to generate an arc-like discharge, and the heat causes flea generation. Substance 1 melts and evaporates. Further, the evaporated substance 1 is turned into plasma by the electron beam 6, and is deposited on the substrate 5 to which a bias 7 is applied to form a film.

Further, in the example, nitrogen gas was introduced from the reaction gas nozzle 9 and turned into plasma by the electron beam 6 to form a nitrogen compound film on the substrate.

The results of Examples according to the present invention are summarized in Table 1. Examples of evaporated substances in which it is difficult to form a film using the conventional hollow cathode discharge method include examples using aluminum and silicon, and examples in which films of nitrogen compounds thereof are formed.

When aluminum is used as the evaporation material, in conventional equipment, only the part irradiated with the electron beam selectively emit radiation as described above, and the bottom of the crucible begins to be damaged within a few minutes from the start of the discharge, making it difficult to stop the discharge. I had to cancel it. However, when induction heating according to the present invention was used in combination, the entire aluminum was melted and stable cathode discharge was possible.

In the example, an aluminum polycrystalline film and an aluminum nitride polycrystalline film were successfully coated by introducing nitrogen gas as a reactive gas. In addition, the precipitate has an XRD pattern, AES. IR
Identification was performed by

When using silicon as the evaporating substance, although it melts in the crucible using conventional equipment, bumping occurs due to uneven heating. & Droplets were scattered onto the substrate, making it impossible to form a film-like coating. However, when induction heating was used in combination, no bumping occurred, and we succeeded in coating amorphous silicon films and amorphous silicon nitride films. In addition, the precipitate is AES.
Identification was performed by SIMS.

〔Effect of the invention〕

As described above, according to the present invention, by inductively heating the evaporated material in combination with hollow cathode discharge, it is possible to produce coatings on aluminum and silicon, which were extremely difficult to form with conventional hollow cathode discharge type ion plating equipment. It has become possible to use evaporated substances, and it has also become possible to form films of these nitrogen compounds.

Furthermore, by using induction heating in combination, it becomes possible to separately control the two effects of melting, evaporation, and plasma formation of the evaporated substance in the conventional hollow cathode discharge method, making it easier to control the film formation rate, etc. There are various effects.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the structure of an ion plating apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of a conventional hollow cathode discharge type ion plating apparatus. 1... Artificial substance 2a 3 ・ ・ 4 ・ 5 ・ ・ 6 ・ ・ 7 ・ ・ 8 ・ ・ 9 ・ 10 ・ 2b... Crucible working coil... Hollow cathode... Substrate...Electron beam...Hiasu...Vacuum chamber...Reaction gas nozzle...Heater

Claims (1)

[Scope of Claims] An ion plating device that melts, evaporates, and turns evaporated material in a crucible into plasma using hollow cathode discharge to form a film on a substrate, wherein the crucible is heated in combination with induction heating to evaporate the evaporated material. melting,
An ion plating device characterized by evaporation.