JPH03216567A - Apparatus for detecting ic connector loading position - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] When mounting an IC on a printed wiring board using an IC connection device, if there is a defective pin in the IC connection device, the IC connection having the defective pin is Regarding the method for detecting the mounting position of an IC connecting device, which detects the possible mounting position of the IC connecting device even if the device is used,
In order to reduce the extra work caused by searching for the mounting position due to a defective pin of the IC connecting device, and to efficiently perform the work of mounting the IC connecting device, we have introduced a system that automatically detects the mounting position of the IC connecting device. For the purpose of providing a detection method, an IC connecting device for mounting an IC on a printed wiring board, which includes defective pin information related to a defective pin included in the pins of the IC connecting device, and an IC having the defective pin. Defective device information storage that stores the device number information of connecting devices in correspondence with each other, and a printed wiring board that is divided into units that can mount one IC connecting device and multiple pins included in each divided position. A mounting position information storage section that stores pin information related to valid pins used for wiring in association with each classification position, and defective pin information of IC connecting devices registered in the defective device information storage section. Based on this, the list of valid pins of each division position registered in the mounting position information storage unit is searched for the division position where the IC connection device is mounted, and the defective pin is not included in the list of valid pins. This configuration includes a mountable position detection section that detects a suitable division position.

[Industrial application field]

The present invention provides a solution for mounting an IC such as an LSI on a printed wiring board used in a large computer, etc. using an IC connecting device (such as an IC socket), and when there is a defective pin in the IC connecting device. , I with the defective pin
I can automatically detect the possible mounting position of the IC connecting device without any wiring problems even when using the C connecting device.
This relates to a method for detecting the mounting position of a C-connection device.

Conventionally, there was no method for automatically detecting the mounting position of an IC connecting device having such a defective pin, so the mounting position had to be detected manually. As a result, there are problems in that it takes time to detect the mounting position, and that the mounting position must be corrected after mounting due to insufficient consideration.Therefore, there has been a need for a device that automatically detects the mounting position of the IC connecting device.

[Prior art] Conventionally, the mounting position of an IC connecting device having a defective pin has been determined by searching each wiring route based on the defective pin data, mounting position data, and wiring data between the pins of the IC connecting device. The appropriate mounting location was manually searched. Therefore, it takes time to detect the mounting position, and there are problems such as correcting the mounting position after loading.

[Problem to be solved by the invention]

By the way, when mounting an IC connecting device on a conventional printed wiring board, if some of the pins of the IC connecting device are defective, it is difficult to find a mounting position where the IC connecting device can be mounted. In order to detect this, each wiring route was searched based on defective pin data of the IC connection device, valid pin data related to the mounting position, etc., and the appropriate mounting position was manually searched.

Therefore, in the present invention, the defective pin data of the IC connection device,
Using the effective pin data related to the mounting position of the C connection device,
By automatically detecting the mounting position of each IC connection device, the time required to detect the mounting position is shortened, and the extra work caused by correcting the mounting position is reduced, making the IC connection device mounting work more efficient. The purpose of this invention is to provide a method for detecting the mounting position of an IC connecting device, which can automatically detect the mounting position of the IC connecting device.

(Means for Solving the Problems) In order to solve the above-mentioned technical problems, the present invention, as shown in FIG. 1, provides an IC connection device for mounting an IC on a printed wiring board. A defective device information storage unit 1 stores defective pin information related to defective pins included in the defective pins included in the defective pins and device number information of the IC connecting device having the defective pins in association with each other, and a printed wiring board is separated. The mounting position is divided into units on which one IC connection device can be mounted, and pin information related to valid pins used for wiring among the multiple pins included in each division position is stored in association with each division position. Based on the information storage section 2 and the defective pin information of the IC connection device registered in the defective device information storage section 1, the information storage section 2 determines the location where the IC connection device is to be mounted. It has a mountable position detection unit 3 that searches a list of valid pins in each registered division position and detects a division position where the defective pin is not included in the list of valid pins.

[Operation] The method for detecting the mounting position of an IC connecting device according to the present invention operates as follows. As shown in Figure 1, first, there is an IC connecting device for mounting an IC on a printed wiring board,
The defective IC connecting device is retrieved from the defective device information storage unit 1 that stores defective pin information related to the defective pin included in the pins of the C connecting device and device number information of the IC connecting device including the defective pin in correspondence with each other. Read pin information. Next, the printed wiring board is divided into units on which one IC connection device can be mounted, a division position is provided for each division unit, and wiring is performed within the plurality of pins included in the division of the division position. Valid pin information at each division position is read out from the mounting position information storage unit 2, which stores pin information related to valid pins used for each division position and the division position in association with each other.

Next, even if the IC connection device has a defective pin, a divided position on the printed wiring board is detected such that the location related to the defective pin does not affect the wiring of the printed wiring board.

Therefore, based on the defective pin information of the IC connection device read out above, the mountable position detection unit 3 searches the list of valid pins of each classification position read out from the mountable position information storage unit 2, and selects the list of valid pins. A divided position of the IC connecting device that does not include the defective pin is detected.

(Example) Next, an example of the present invention will be described in detail based on FIGS. 2 to 7. FIG. 2 shows a block diagram according to the embodiment, and the data input file includes defective pin information related to defective pins included in the pins of the IC connecting device and the defective pin. A defective lot data file 21 (FIG. 3 (A)) as a defective device information storage unit 1 that stores device number information (hereinafter referred to as "lot") of IC-connected devices including Divide the board into units that can mount one IC connection device, provide a division position (hereinafter also referred to as "location j") for each division unit, and place an IC at that division position.
The mounting position data file 22a (Fig. 3 (B)) in which the divisional positions in which the connecting devices are to be mounted are registered, and the valid pins used for wiring among the plurality of pins included in the division of each divisional position. The inter-pin wiring data file 22b (Fig. 3 (
C)). The relevant pin-to-pin wiring data file 22
A pin data list (FIG. 7(D)), which will be described later and can be created from the data file 22a and the mounting position data file 22a, corresponds to the information in the mounting position information storage section 2.

The processing unit 25 is composed of a CPU (central processing unit) and a memory, and is processed according to a control program, and based on the defective pin information of the IC connecting device registered in the defective pin data file 21, the processing unit 25 stores the above-mentioned mounting position data file 22a. and a mountable position detection unit 23 that searches a list of valid pins at each division position registered in the inter-pin wiring data file 22b and detects a division position where the defective pin is not included in the list of valid pins; It has a mounting position determination unit 24 that determines the appropriate mounting position of each IC connection device from the list of detected mountable classification positions in descending order of the number of mountable positions.

As a data output file, there is provided a proper mounting position data file 26 (FIG. 4(F)) that stores data on the proper IC connecting device mounting position determined by the mounting position determining section 24.

Next, the operation of the embodiment will be described with a focus on the processing flows shown in FIGS. 5 and 6.

First, in step S51, the loading position data file 22a is
The loading position data (FIG. 7(B)) is read out from the defective spot data file 21 in step S52, and the defective bit data (FIG. 7(A)) is read out from the defective bit data file 21 in step S52.
3, the inter-pin wiring data (FIG. 7(C)) is read from the inter-pin wiring data file 22b.

Next, step S is performed based on each read data.
In step S54, the mounting position detecting section 23 performs a process of detecting a position where the IC connecting device can be mounted, and in step S55, the mounting position determining section 24 performs a process of determining an appropriate IC connecting device mounting position, and the process is performed as shown in FIG. Flow (Step S
54 corresponds to steps S61 to S68, step S55
corresponds to steps S69 and S70).

First, in step S61, loading position data (Fig. 7(B)
) Read one piece of data from the mounting location. next,
In order to create a pin data list (Fig. 7 (D)) of valid pins at the relevant mounting location, in step S63, connections between pins at each location of the inter-pin wiring data (Fig. 7 (C)) are determined. Valid pins related to wiring at each mounting location are detected based on FROM terminal and To terminal data indicating the relationship. In step S64, a pin data list (
Figure 7 (D)) is created. The relevant steps S61 to S6
The process of step 4 is repeated until the loading position data is completed (step S62).

Next, in step S65, the defective lot data (FIG. 7(A)
)) Read the defective pin data of the lot. Next, in step S67, a list of valid pins in each division position related to the pin data list created above (FIG. 7(D)) is searched to find an IC whose list of valid pins does not include the defective pin. Detect the segmented position of the connecting device. Step S
In step 68, a list of possible mounting locations for each lot (FIG. 7(E)) is created based on the detected results. The processing of steps S65 to S68 is repeated until the defective bit data is completed (step S66).

Next, in step S69, the number of locations that can be loaded for each lot is counted based on the list of locations that can be loaded for each lot (FIG. 7(E)) created above.
The count results are entered in FIG. 7(E) for convenience). In step S70, mounting locations are detected preferentially from lots with a small number of mounting locations for the lot, and a proper mounting position data list (see FIG. 7 (F)) that associates the lot with the proper mounting location of the lot
).

The proper mounting location of the IC connection device having the defective pin, which is determined through the above processing, is written as a proper mounting position data list into the proper mounting position data file 26, which is an output file.

(Effects of the Invention) As explained above, in the present invention, a list of valid pins in each section position on a printed wiring board is searched based on the information of a defective pin of an IC connecting device, and the defective pin is added to the list of valid pins. It has a detection section that detects a division position that does not include the IC connection device, so that the IC connection device mounting position can be automatically detected.

Therefore, the time required to search for the mounting position or correct the IC connecting device mounting position, which was conventionally done manually, can be saved, and the efficiency of the IC connecting device mounting process can be improved, which is useful.

[Brief explanation of drawings]

FIG. 1 is a block diagram of the principle of the present invention, FIG. 2 is a block diagram according to an embodiment, FIG. 3 is an explanatory diagram of an input file according to the embodiment, and FIG. 4 is an explanatory diagram of an output file according to the embodiment. FIG. 5 is a processing flow (part 1) according to the embodiment, FIG. 6 is a processing flow (part 2) according to the embodiment, and FIG. 7 is an explanatory diagram of the embodiment. 1 (21) ... Defective appliance information storage section (defective device data file) 2 (22a, 22b) ... Mounting position information storage section (mounting position data file, inter-pin wiring data file) 3, 23. ... Mountable position detection section 24 ... Mounting position determination section 25 ... Processing section

Claims (1)

[Claims] An IC connecting device for mounting an IC on a printed wiring board, comprising defective pin information regarding a defective pin included in the pins of the IC connecting device, and an IC having the defective pin.
A defective device information storage section (1) that stores the device number information of the connecting devices in correspondence with each other; and a section for dividing the printed wiring board into units that can mount one IC connecting device, and storing the information in each section. Mounting position information storage unit (2) that stores pin information related to valid pins used for wiring among multiple pins in association with each classification position.
And, based on the defective pin information of the IC connecting device registered in the defective device information storage section (1), the classification position where the IC connecting device is mounted is registered in the mounting position information storage section (2). and a mountable position detection unit (3) that searches a list of valid pins in each divided position and detects a divided position where the defective pin is not included in the list of valid pins. Detection method for instrument mounting position.