JPH0321819U - - Google Patents
Info
- Publication number
- JPH0321819U JPH0321819U JP8278789U JP8278789U JPH0321819U JP H0321819 U JPH0321819 U JP H0321819U JP 8278789 U JP8278789 U JP 8278789U JP 8278789 U JP8278789 U JP 8278789U JP H0321819 U JPH0321819 U JP H0321819U
- Authority
- JP
- Japan
- Prior art keywords
- coupling adjustment
- inductance
- resistor
- adjustment substrate
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Description
第１図は本考案に係る結合調整用基板の実施例
の構成を示す斜視図、第２図はその結合調整用基
板を使用した複合部品を示す斜視図である。第３
図は他の結合調整用基板の実施例を示す斜視図で
、第４図はその結合調整用基板を使用して実現し
た複合部品の電気回路図である。第５図は従来の
相互インダクタンス部品を示すもので、第５図ａ
は平面図、第５図ｂは一部断面正面図、第５図ｃ
は底面図である。第６図は第５図の相互インダク
タンス部品を使用して実現した電気回路図である
。
１……複合部品（ＬＣ複合部品）、２……結合
調整用基板、３……結合調整用スペーサ部、４…
…コンデンサ部、５……抵抗部、６……スペーサ
板、６ａ……チツプコイル用矩形孔、７……基材
シート、８ａ，８ｂ，９ａ，９ｂ……インダクタ
ンス用電極（コイル用電極）、１０ａ，１０ｂ…
…基材シート、１１ａ，１１ｂ……コンデンサ電
極、１３，１４……インダクタンス素子（チツプ
コイル）、１６ａ，１６ｂ，１６ａ′，１６ｂ′
……金属電極、１８……ダミーシート、３０……
結合調整用基板、３５……抵抗体、３６……基材
シート、Ａ，Ｂ……外部端子（入出力端子）、Ｃ
……外部端子（中継端子）、Ｄ……外部端子（共
通端子）。
FIG. 1 is a perspective view showing the structure of an embodiment of the bond adjustment board according to the present invention, and FIG. 2 is a perspective view showing a composite component using the bond adjustment board. Third
The figure is a perspective view showing an embodiment of another bond adjustment board, and FIG. 4 is an electric circuit diagram of a composite component realized using the bond adjustment board. Figure 5 shows a conventional mutual inductance component, and Figure 5a
is a plan view, Figure 5b is a partially sectional front view, and Figure 5c is a partially sectional front view.
is a bottom view. FIG. 6 is an electrical circuit diagram realized using the mutual inductance component of FIG. 5. 1... Composite part (LC composite part), 2... Board for coupling adjustment, 3... Spacer part for coupling adjustment, 4...
... Capacitor section, 5 ... Resistance section, 6 ... Spacer plate, 6a ... Rectangular hole for chip coil, 7 ... Base material sheet, 8a, 8b, 9a, 9b ... Inductance electrode (coil electrode), 10a ,10b...
...Base material sheet, 11a, 11b... Capacitor electrode, 13, 14... Inductance element (chip coil), 16a, 16b, 16a', 16b'
...Metal electrode, 18...Dummy sheet, 30...
Bond adjustment board, 35...Resistor, 36...Base material sheet, A, B...External terminal (input/output terminal), C
...External terminal (relay terminal), D...External terminal (common terminal).
Claims (1)
用基板に搭載されていて、該インダクタンス素子
が前記結合調整用基板に設けられているスペーサ
によつて位置決めされ、前記インダクタンス素子
の金属電極と前記結合調整基板に形成されている
インダクタンス用電極とが接合していることを特
徴とする複合部品。 (2) 結合調整用基板が、基材層とコンデンサ電
極とが交互に積層されているコンデンサ部と、抵
抗体が基材層の表面に形成されている抵抗部との
少なくともいずれか一方を備えた一体積層構造を
なし、かつ、インダクタンス素子と前記結合調整
用基板に備えられている前記抵抗部・コンデンサ
部とが外部端子を介して電気的に接続しているこ
とを特徴とする請求項(1)記載の複合部品。[Claims for Utility Model Registration] (1) Two or more inductance elements are mounted on a coupling adjustment substrate, the inductance elements are positioned by a spacer provided on the coupling adjustment substrate, and the A composite component characterized in that a metal electrode of an inductance element and an inductance electrode formed on the coupling adjustment substrate are bonded to each other. (2) The coupling adjustment substrate includes at least one of a capacitor section in which base layers and capacitor electrodes are alternately laminated, and a resistor section in which a resistor is formed on the surface of the base layer. Claim 1, wherein the inductance element has a laminated structure, and the inductance element and the resistor/capacitor part provided on the coupling adjustment board are electrically connected via an external terminal. 1) Composite parts listed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082787U JPH0747849Y2 (en) | 1989-07-13 | 1989-07-13 | Composite parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082787U JPH0747849Y2 (en) | 1989-07-13 | 1989-07-13 | Composite parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0321819U true JPH0321819U (en) | 1991-03-05 |
| JPH0747849Y2 JPH0747849Y2 (en) | 1995-11-01 |
Family
ID=31629906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989082787U Expired - Lifetime JPH0747849Y2 (en) | 1989-07-13 | 1989-07-13 | Composite parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747849Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147218U (en) * | 1982-03-26 | 1983-10-03 | 株式会社村田製作所 | composite parts |
-
1989
- 1989-07-13 JP JP1989082787U patent/JPH0747849Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147218U (en) * | 1982-03-26 | 1983-10-03 | 株式会社村田製作所 | composite parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747849Y2 (en) | 1995-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |