JPH0321895U - - Google Patents

Info

Publication number
JPH0321895U
JPH0321895U JP8138489U JP8138489U JPH0321895U JP H0321895 U JPH0321895 U JP H0321895U JP 8138489 U JP8138489 U JP 8138489U JP 8138489 U JP8138489 U JP 8138489U JP H0321895 U JPH0321895 U JP H0321895U
Authority
JP
Japan
Prior art keywords
circuit board
mounting plate
dissipation structure
electronic
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8138489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8138489U priority Critical patent/JPH0321895U/ja
Publication of JPH0321895U publication Critical patent/JPH0321895U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例としてのハロゲンラ
ンプ駆動制御部における放熱構造を示す正面図、
第2図は上記ハロゲンランプの駆動制御回路を示
す回路図である。 1……回路基板、4……パワートランジスタ、
5……ハロゲンランプ、12……取付け板、13
……枠体、14……ヒートシンク。
FIG. 1 is a front view showing a heat dissipation structure in a halogen lamp drive control section as an embodiment of the present invention;
FIG. 2 is a circuit diagram showing a drive control circuit for the halogen lamp. 1... Circuit board, 4... Power transistor,
5...Halogen lamp, 12...Mounting plate, 13
...Frame body, 14...Heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板上に搭載した電子部品の放熱構造にお
いて、前記回路基板を伝熱材料から成る取付け板
に設置し、前記電子部品搭載位置に対応して前記
回路基板と前記取付け板との間に前記電子部品が
発する熱を前記取付け板に効率良く伝導させる伝
熱部材を設けたことを特徴とする電子部品の放熱
構造。
In a heat dissipation structure for electronic components mounted on a circuit board, the circuit board is installed on a mounting plate made of a heat transfer material, and the electronic parts are placed between the circuit board and the mounting plate in correspondence with the electronic component mounting position. A heat dissipation structure for an electronic component, characterized in that a heat transfer member is provided to efficiently conduct heat generated by the component to the mounting plate.
JP8138489U 1989-07-11 1989-07-11 Pending JPH0321895U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8138489U JPH0321895U (en) 1989-07-11 1989-07-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8138489U JPH0321895U (en) 1989-07-11 1989-07-11

Publications (1)

Publication Number Publication Date
JPH0321895U true JPH0321895U (en) 1991-03-05

Family

ID=31627283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8138489U Pending JPH0321895U (en) 1989-07-11 1989-07-11

Country Status (1)

Country Link
JP (1) JPH0321895U (en)

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