JPH03225646A - Production of stamper - Google Patents
Production of stamperInfo
- Publication number
- JPH03225646A JPH03225646A JP2128190A JP2128190A JPH03225646A JP H03225646 A JPH03225646 A JP H03225646A JP 2128190 A JP2128190 A JP 2128190A JP 2128190 A JP2128190 A JP 2128190A JP H03225646 A JPH03225646 A JP H03225646A
- Authority
- JP
- Japan
- Prior art keywords
- stamper
- resin
- mold
- reinforcing material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000012779 reinforcing material Substances 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 25
- 239000011347 resin Substances 0.000 abstract description 25
- 239000000758 substrate Substances 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 3
- 239000010935 stainless steel Substances 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000007788 roughening Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は紫外線照射により硬化可能な液状成形樹脂を用
いて情報記録担体複製用金型より複製ディスクを得る製
造方法、いわゆるフォトポリマー(2P)法において情
報記録担体複製用金型を固定する方法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a manufacturing method for obtaining a duplicated disk from a mold for duplicating an information recording carrier using a liquid molding resin that can be cured by ultraviolet irradiation, so-called photopolymer (2P). The present invention relates to a method for fixing a mold for duplicating an information recording carrier in accordance with the law.
(従来の技術)
情報記録担体に使用する基板は必要な案内溝、ビット等
の情報パターンが予め形成されている。(Prior Art) A substrate used for an information recording carrier has information patterns such as necessary guide grooves and bits formed in advance.
この情報パターンの形成法にはいくつかの方法があるが
、高品質な基板が得られるということから2P法が盛ん
に検討されている。Although there are several methods for forming this information pattern, the 2P method is being actively studied because it can provide a high quality substrate.
この2P法は金型スタンバと透明基板の間に紫外線硬化
樹脂を充填し、次に紫外線照射を行うことにより紫外線
硬化樹脂を硬化させる。その後金型スタンパから離型し
、情報記録担体用の基板を得る方法である。以下第2図
を用いて従来の2P法について更に説明する。In this 2P method, an ultraviolet curable resin is filled between a mold standber and a transparent substrate, and then ultraviolet rays are irradiated to cure the ultraviolet curable resin. Thereafter, the mold is released from the mold stamper to obtain a substrate for an information recording carrier. The conventional 2P method will be further explained below with reference to FIG.
第2図において金型スタンバ1は表面にピット、案内溝
等が凹凸の形状で電鋳法等により形成されたNi製の薄
板であり、厚さは200〜30011mである。In FIG. 2, the die stand bar 1 is a thin Ni plate formed by electroforming or the like with pits, guide grooves, etc. in an uneven shape on its surface, and has a thickness of 200 to 30011 m.
2は金型スタンバ1の上に円周状に塗布した紫外線硬化
樹脂で円盤状の透明基板3上にスタンパ1に記録された
形状を転写する。9は1のスタンパを固定する為の真空
吸引口であり、10は真空発生器である。2 transfers the shape recorded on the stamper 1 onto a disc-shaped transparent substrate 3 using an ultraviolet curable resin coated on the mold stamper 1 in a circumferential manner. 9 is a vacuum suction port for fixing the stamper 1, and 10 is a vacuum generator.
1の金型スタンバの中周部にデイスペンサ等を用いて紫
外線硬化樹脂2を一定量塗布する。次に気泡の発生を抑
える為、基板を傾け、−点で樹脂に接触させる。その後
基板の位置合わせを行いつつ徐徐に基板と樹脂との接触
面積を大きくさせる。円周状に接触終了後加圧し、樹脂
を基板全面に展開する。この状態で透明基板3側から紫
外線を照射し、樹脂を硬化する。最後に金型スタンパl
から透明基板3及び硬化した紫外線硬化樹脂2を離型し
、複製ディスクを得る。A predetermined amount of ultraviolet curable resin 2 is applied to the middle circumferential portion of mold standber 1 using a dispenser or the like. Next, in order to suppress the generation of bubbles, the substrate is tilted and brought into contact with the resin at the negative point. Thereafter, while aligning the substrate, the contact area between the substrate and the resin is gradually increased. After contact is completed in a circumferential manner, pressure is applied to spread the resin over the entire surface of the substrate. In this state, ultraviolet rays are irradiated from the transparent substrate 3 side to cure the resin. Finally, mold stamper
The transparent substrate 3 and the cured ultraviolet curing resin 2 are released from the mold to obtain a duplicate disk.
(発明が解決しようとする課題)
しかしながら従来の真空吸引により金型スタンパを固定
する方法では、金型スタンパ全面が均一に真空吸引され
ず、スタンパ表面の平坦性が確保されなかった。この為
このスタンパ面に塗布された紫外線硬化樹脂の膜厚は均
一ではなく、機械特性の悪い複製ディスクとなったりし
た。(Problems to be Solved by the Invention) However, in the conventional method of fixing the mold stamper by vacuum suction, the entire surface of the mold stamper was not vacuum-sucked uniformly, and the flatness of the stamper surface was not ensured. For this reason, the film thickness of the ultraviolet curing resin applied to the stamper surface was not uniform, resulting in a duplicate disk with poor mechanical properties.
スタンパの固定法にはその他にマグネット吸着、機械的
に固定する方法等があるが、おおかかすな装置となった
り、固定が全面にわたって均一ではなく、平坦性が充分
に確保されないという課題があった。スタンパの裏面全
面にUV硬化樹脂を塗布し、ガラスをはりあわせて補強
材とする方法もあるが、補強材として用いたガラスが割
れやすい、加工しにくいなどの課題があった。There are other ways to fix the stamper, such as magnetic adsorption and mechanical fixation, but these have the problems of being a bulky device, not being fixed uniformly over the entire surface, and not ensuring sufficient flatness. . There is also a method of applying UV-curable resin to the entire back surface of the stamper and gluing glass to it as a reinforcing material, but this method has problems such as the glass used as a reinforcing material being easily broken and difficult to process.
本発明の目的は2P法による高品質基板を製造する際に
、平坦性のよい金型スタンパを再現性よく提供し、機械
特性の優れた複製ディスク基板を安定に提供することに
ある。An object of the present invention is to provide a mold stamper with good flatness with good reproducibility and to stably provide a replicated disk substrate with excellent mechanical properties when manufacturing a high quality substrate using the 2P method.
(課題を解決するための手段)
本発明は金型スタンパの粗面化した裏面と補強材の鏡面
仕上げした面を嫌気性接着剤を用いて貼合わせることを
特徴とする。(Means for Solving the Problems) The present invention is characterized in that the roughened back surface of the mold stamper and the mirror-finished surface of the reinforcing material are bonded together using an anaerobic adhesive.
(作用)
本発明においては、金型スタンパ面と接触する面を機械
的加工処理を施し平坦性のよい面とした金属板を、例え
ば嫌気性等の接着樹脂を用いて金型スタンパと貼合わせ
る。この一体化したスタンパを用いることにより表面の
平坦性の良好なものが得られ、複製ディスク基板の機械
特性も良好となった。(Function) In the present invention, a metal plate whose surface in contact with the mold stamper surface has been mechanically processed to have good flatness is bonded to the mold stamper using, for example, an anaerobic adhesive resin. . By using this integrated stamper, a surface with good flatness was obtained, and the mechanical properties of the replicated disk substrate were also improved.
また金型スタンパの裏面を粗面にすることにより、樹脂
との密着力を向上させるとともに樹脂の流れ速度を遅く
し、気泡の発生を抑えた。In addition, by making the back surface of the mold stamper rough, we were able to improve adhesion to the resin, slow down the flow rate of the resin, and suppress the generation of bubbles.
嫌%性樹脂を用いているのではみだした樹脂は未硬化と
なり、後にふきとることにより簡単に除去できる。Since a %-resistant resin is used, the protruding resin remains uncured and can be easily removed by wiping it off afterwards.
次に本発明の2P法の製造法について図面を用いて説明
する。Next, the 2P manufacturing method of the present invention will be explained using the drawings.
(実施例) 第1図は本発明の詳細な説明するための概略図である。(Example) FIG. 1 is a schematic diagram for explaining the present invention in detail.
1は表面にビット、案内溝等が凹凸の形状で電鋳法等に
より形成された金型スタンパであり、裏面は2μm程度
の荒さの粗面処理を行う。表面は例えばエレクトロンシ
ート5等により保護しておく。この金型スタンパを回転
台6の上に芯だしカラー7をもちいて位置合わせを行い
ながら置く。次にスタンパ裏面の中周部に粘度100c
ps程度の嫌気性樹脂8を一定量塗布する。この上に芯
だしカラー7をもちいて位置合わせをおこないなから4
のステンレス等の金属の補強材を貼合わせる。尚この補
強材の金型スタンパ面と接触する面は、0.5μm以下
の表面仕上げ精度で鏡面仕上げにする。貼合わせた状態
のまま一昼夜放置し、樹脂を硬化させる。Reference numeral 1 denotes a mold stamper on which bits, guide grooves, etc. are formed in an uneven shape by electroforming or the like on the front surface, and the back surface is roughened to a roughness of about 2 μm. The surface is protected by, for example, an electron sheet 5 or the like. This mold stamper is placed on a rotary table 6 while being aligned using a centering collar 7. Next, apply a viscosity of 100c to the middle circumference of the back of the stamper.
A certain amount of anaerobic resin 8 of about ps is applied. Do not align using centering collar 7 on top of this.
A reinforcing material made of metal such as stainless steel is attached. The surface of this reinforcing material that comes into contact with the mold stamper surface is mirror-finished with a surface finish accuracy of 0.5 μm or less. Leave the bonded parts together for a day and night to allow the resin to harden.
次に貼合わせを行った金型スタンパを用いて従来と同様
に2P成形を行う。Next, 2P molding is performed in the same manner as in the past using the bonded mold stamper.
本発明のスタンパ固定法を用い2P成形を行った複製基
板は従来の真空固定を用いた2P成形基板に比較し、2
P樹脂の膜厚むらがなく、機械特性のよい複製基板が得
られた。また繰り返し成形をおこなっても金型スタンパ
の平坦性が悪くなることはなかった。The replicated substrate that was 2P molded using the stamper fixing method of the present invention was 2P molded using the conventional vacuum fixing method.
A replicated substrate with good mechanical properties and no unevenness in the P resin film thickness was obtained. Moreover, even after repeated molding, the flatness of the mold stamper did not deteriorate.
(発明の効果)
以上説明したごとく本発明の製造方法によれば平坦性の
よい金型スタンパが得られた。この為、この金型スタン
パをもちいて成形した複製基板は樹脂の膜厚の均一性が
よく、機械特性も優れているものが得られた。(Effects of the Invention) As explained above, according to the manufacturing method of the present invention, a mold stamper with good flatness was obtained. Therefore, the replicated substrate molded using this mold stamper had good uniformity in resin film thickness and excellent mechanical properties.
裏面を粗面にした金型スタンパを用いているので貼合わ
せ用の樹脂との密着力が向上し、繰り返し使用が可能で
あるとともに、貼合わせた金型スタンパの平坦性もよく
なる。Since a mold stamper with a roughened back surface is used, the adhesion to the bonding resin is improved, allowing repeated use, and the flatness of the bonded mold stamper is also improved.
第1図は本発明の第1の実施例を説明するための工程図
、第2図は従来の複製ディスクの製造方法を説明するた
めの工程図である。
図において1は表面にピット、案内溝等が凹凸の形状で
形成された金型スタンパ、2は紫外線硬化樹脂、3は円
盤状の透明基板、4はステンレス等の金属の補強材、5
は金製スタンパの表面を保護する為のエレクトロンシー
ト、6は回転台、7は芯だしカラー、8は嫌気性樹脂、
9は真空吸引口、1oは真空発生器である。FIG. 1 is a process diagram for explaining a first embodiment of the present invention, and FIG. 2 is a process diagram for explaining a conventional method for manufacturing a duplicate disk. In the figure, 1 is a mold stamper with pits, guide grooves, etc. formed in an uneven shape on the surface, 2 is an ultraviolet curing resin, 3 is a disc-shaped transparent substrate, 4 is a reinforcing material made of metal such as stainless steel, and 5
is an electron sheet to protect the surface of the gold stamper, 6 is a rotary table, 7 is a centering collar, 8 is an anaerobic resin,
9 is a vacuum suction port, and 1o is a vacuum generator.
Claims (1)
的強度を補強するために用いる補強材の鏡面仕上げした
面を嫌気性接着剤を用いて貼合わせることを特徴とする
スタンパの製造方法。A method for producing a stamper, which comprises bonding the roughened back surface of a mold stamper and the mirror-finished surface of a reinforcing material used to reinforce the mechanical strength of the stamper using an anaerobic adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2128190A JPH03225646A (en) | 1990-01-30 | 1990-01-30 | Production of stamper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2128190A JPH03225646A (en) | 1990-01-30 | 1990-01-30 | Production of stamper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03225646A true JPH03225646A (en) | 1991-10-04 |
Family
ID=12050753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2128190A Pending JPH03225646A (en) | 1990-01-30 | 1990-01-30 | Production of stamper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03225646A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689470A (en) * | 1991-11-07 | 1994-03-29 | Nec Corp | Lining method for stamper |
| WO1998055995A3 (en) * | 1997-06-02 | 1999-03-18 | Toolex Alpha Ab | Semi-manufactured stamper |
| WO1999004393A3 (en) * | 1997-07-16 | 1999-04-22 | Toolex Alpha Ab | Semi-manufactured stamper and method of manufacturing the same |
| JP2006165371A (en) * | 2004-12-09 | 2006-06-22 | Canon Inc | Transfer apparatus and device manufacturing method |
| JP2011035408A (en) * | 2010-08-30 | 2011-02-17 | Canon Inc | Imprint device and device manufacturing method |
-
1990
- 1990-01-30 JP JP2128190A patent/JPH03225646A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689470A (en) * | 1991-11-07 | 1994-03-29 | Nec Corp | Lining method for stamper |
| WO1998055995A3 (en) * | 1997-06-02 | 1999-03-18 | Toolex Alpha Ab | Semi-manufactured stamper |
| WO1999004393A3 (en) * | 1997-07-16 | 1999-04-22 | Toolex Alpha Ab | Semi-manufactured stamper and method of manufacturing the same |
| JP2006165371A (en) * | 2004-12-09 | 2006-06-22 | Canon Inc | Transfer apparatus and device manufacturing method |
| US7815424B2 (en) | 2004-12-09 | 2010-10-19 | Canon Kabushiki Kaisha | Imprinting machine and device manufacturing method |
| US8834144B2 (en) | 2004-12-09 | 2014-09-16 | Canon Kabushiki Kaisha | Imprinting machine and device manufacturing method |
| JP2011035408A (en) * | 2010-08-30 | 2011-02-17 | Canon Inc | Imprint device and device manufacturing method |
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