JPH0322584A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH0322584A JPH0322584A JP15894889A JP15894889A JPH0322584A JP H0322584 A JPH0322584 A JP H0322584A JP 15894889 A JP15894889 A JP 15894889A JP 15894889 A JP15894889 A JP 15894889A JP H0322584 A JPH0322584 A JP H0322584A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- base film
- electrodes
- printed
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、印刷タイプのフレキシブルプリント基板（
以下ＦＰＯと呼ぶ）に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a printing type flexible printed circuit board (
(hereinafter referred to as FPO).
第４園は例えば「電子材料Ｊ Ｖｏｌ−２７（１９８８
年１２月）第６８〜７８ページに掲載された、従来のＦ
ＰＯの構戒を示す図で、第４図イは、ＴＰＯのＩｌ威を
示す断面図、口はＦＰＯが他の接触子（コネクタやスイ
ッチ等）と接触する部分（コンタクト部）の構戎を示す
断面図、ハはコンタクト部近傍（シート部を含む）の構
或を示す平面図で、図において、ｌはベースフイルム、
２は銀ペースト、３はレジスト、４はカーボンペースト
である。For example, the fourth garden is “Electronic Materials J Vol-27 (1988
December 2016) The conventional F
Figure 4A is a cross-sectional view showing the structure of the TPO, and the opening shows the structure of the part (contact part) where the FPO contacts other contacts (connectors, switches, etc.). C is a plan view showing the structure of the vicinity of the contact portion (including the seat portion);
2 is a silver paste, 3 is a resist, and 4 is a carbon paste.
第４図イに示すようにＦＰＯのシート部は、ペースフィ
ルム１上に銀ペースト２及びレジスト３をスクリーン印
刷により形成し、フレキシビリティを有する導体パター
ンシ一トを構或している。As shown in FIG. 4A, the sheet portion of the FPO is formed by screen printing a silver paste 2 and a resist 3 on a paste film 1 to form a flexible conductor pattern sheet.
また、第４図ロに示すようにＴＰＯのコンタクト部は、
ポリエステルフイルムなどで作られたべ一スフイルムｌ
上に、導体パターンとしてフレキシビリテイを有する銀
ペースト２をスクリーン印刷、焼成し、さらにその上に
銀ペーストを置うよウナ形でカーボンペースト４をスク
リーン印刷、焼戒している。In addition, as shown in Figure 4B, the contact part of the TPO is
Base film made from polyester film etc.
A flexible silver paste 2 is screen-printed and fired as a conductor pattern on top, and carbon paste 4 is screen-printed and fired in a shape such that the silver paste is placed on top of it.
従来のＦＰＯは以上のように構威されているので、高密
度実装が進むにつれて、ピッチが小さくなると、マイグ
レーション（銀の移行現象）という問題点がある。マイ
グレーションは電極間に直流電圧が印加され（一般に５
ｖ以上になると、起こりやすくなると言われている）、
高湿度になると起こりやすくなり、マイグレーションが
発生すると、亀極間が短絡する。Since the conventional FPO is structured as described above, as the pitch becomes smaller as higher density packaging progresses, there is a problem of migration (silver migration phenomenon). Migration is performed by applying a DC voltage between the electrodes (generally 5
It is said that it becomes more likely to occur when the value exceeds v).
This is more likely to occur when the humidity is high, and when migration occurs, a short circuit occurs between the turtle electrodes.
この発明はかかる課題を解決するためになされたもので
、電極間（パターン間）が小さくなってもマイグレーシ
ョンが発生しない構造の印刷フレキシブルプリント基板
を得ることを目的とする。The present invention was made to solve this problem, and an object of the present invention is to obtain a printed flexible printed circuit board with a structure in which migration does not occur even if the distance between electrodes (between patterns) becomes small.
この発四にかかるＦＰＯは、マイグレーションを防止す
るために、電極間にスリット（切り込み）または絶縁層
の壁、または熱戒型による突起を設けたものである。This type of FPO is provided with slits (cuts), walls of an insulating layer, or thermal protrusions between electrodes in order to prevent migration.
〔作用〕
この発明においてＧ；！、８つの手段のいずれか、即ち
電極間にスリット（切り込み）を設けるか、電極間に絶
縁層の壁を設けるか、電極間に熱成型による突起を設け
ることによりマイグレーションを防止することができる
。[Function] In this invention, G;! Migration can be prevented by any of eight means: providing slits (cuts) between the electrodes, providing walls of an insulating layer between the electrodes, or providing protrusions by thermoforming between the electrodes.
以下、この発明の実施例を図面について説明する。第１
図はこの発明の一実施例であるＦＰＯの構戒を示す図で
・第１図イは電極間にスリット（切り込み）を設けた場
合のシート部の構或を示す横断面図、ロはコンタクト部
の構或を示す横断面図、ハはコンタクト部近傍（シート
部も含む）の構或を示す平面図で、各図中同一符号は向
一または相当部分を示す。５はースリットで、醒極間に
マイグレーションが発生したとしても、スリット５のと
ころで防止することができる。Embodiments of the present invention will be described below with reference to the drawings. 1st
The figure shows the configuration of an FPO that is an embodiment of this invention. Figure 1A is a cross-sectional view showing the structure of the seat section when a slit (cut) is provided between the electrodes, and B is a contact. C is a cross-sectional view showing the structure of the contact portion, and C is a plan view showing the structure of the vicinity of the contact portion (including the seat portion). In each figure, the same reference numeral indicates a corresponding portion. 5 is a slit, so even if migration occurs during the awakening phase, it can be prevented at the slit 5.
この実施例におけるＦＰＯは、第１図ロ、ハに示すよう
に、コンタクト部はポリエステルなどで作られたベース
フイルム１上に、導体パターンとしてフレキシビリテイ
を有する銀ヘースト２をスクリーン印刷、焼或し、その
上にさらに、カーボンペースト４をスクリーン印刷、焼
威した後、５のスリット加工（切り込み）を施こす。As shown in FIG. 1 (b) and (c), the FPO in this embodiment has a contact portion formed by screen printing, baking or baking a flexible silver haze 2 as a conductor pattern on a base film 1 made of polyester or the like. Then, after screen printing carbon paste 4 and burning it, slit processing (cutting) 5 is performed.
または、ポリエステルなどで作られたベースフィルム１
に、直接５のスリット加工を行なった後、銀ヘースト２
やカーボンペースト４をスクリーン印刷、焼戚する方法
でもよい。Or base film 1 made of polyester etc.
After directly performing the slit process of 5, the silver haste 2
Alternatively, a method of screen printing and annealing carbon paste 4 may be used.
第２図はこの発明の他の実施例を示す図で、この実施例
はスリットではなく、絶縁層の壁を設けたものであり、
第１図と同一符号は同一または相当部分を示し、６はこ
の実施例における絶縁層の壁で、電極間にマイグレーシ
ョンが発生しても、この絶縁層の樽６で防止することが
できる。なお、この絶縁層の壁６はポリエステルフイル
ムでもよいし、他のプラスチックフイルムでもよい。ま
た、厚サについては、銀ペースト２とカーボンペースト
４の厚さを合わせた８０μｍ以上が望ましい。FIG. 2 is a diagram showing another embodiment of the present invention, in which a wall of an insulating layer is provided instead of a slit,
The same reference numerals as in FIG. 1 indicate the same or corresponding parts, and 6 is the wall of the insulating layer in this embodiment. Even if migration occurs between the electrodes, the barrel 6 of this insulating layer can prevent it. Note that the wall 6 of this insulating layer may be made of polyester film or other plastic film. Further, regarding the thickness, it is desirable that the combined thickness of the silver paste 2 and the carbon paste 4 be 80 μm or more.
また第８図に示すように、熱成型による突起を設けても
よい。この実施例は第１図と向一符号は同一または相当
部分を示し、７はこの実施例における熱戒型による突起
で、電極間にマイグレーションが発生しても、この熱或
型による突起７で防止することができる。なお、この熱
成型は印刷後フイルムを熱或型する方法が一般的で、熱
威型の方法は、金型、真空或型等が用いられる。Furthermore, as shown in FIG. 8, projections may be provided by thermoforming. In this embodiment, the same or equivalent parts are indicated by the same or corresponding parts as in FIG. 1, and 7 is a thermal type projection in this example. It can be prevented. Note that this thermoforming is generally performed by heating the film after printing, and the heat molding method uses a mold, a vacuum mold, or the like.
この発明は以上説明したように、ＴＰＯのコンタクト部
の電極間にスリット、または絶縁＃または熱或型による
突起を設ける手段とを備えることにより、電極から発生
するマイグレーションを防止することができ、高密度実
装に対応したファインピンチになっても心配がないとい
う効果がある。As explained above, this invention can prevent migration occurring from the electrodes by providing a slit between the electrodes of the contact portion of the TPO, or a means for providing a protrusion by insulation or heat molding. This has the advantage that there is no need to worry about fine pinches that correspond to high-density mounting.
第１図はこの発明の一実施例を示す図、第２図、第８図
はこの発明の他の実施例を示す図、第４図は従来のＦＰ
Ｏを示す図で、イはシート部の禍断面図、ロはコンタク
ト部の横断面図、ハはコンタクト部の平面図である。
図中・ １はベースフイルム、’２は銀ペースト、３は
レジスト、４はカーボンペースト、５はスリット、６は
絶縁層の檄、７は熱戒型による突起である。
なお図中同一符号は同一または柑尚部分を示す。FIG. 1 shows one embodiment of the present invention, FIGS. 2 and 8 show other embodiments of the invention, and FIG. 4 shows a conventional FP.
In the drawings, A is a cross-sectional view of the seat portion, B is a cross-sectional view of the contact portion, and C is a plan view of the contact portion. In the figure, 1 is a base film, 2 is a silver paste, 3 is a resist, 4 is a carbon paste, 5 is a slit, 6 is a hole in the insulating layer, and 7 is a protrusion formed by a thermal mold. Note that the same reference numerals in the figures indicate the same or different parts.
Claims (1)
ストを印刷、焼成して形成した配線パターン部と、さら
に上記銀系ペースト上にカーボンペーストを印刷、焼成
して形成したコンタクト部とを有する印刷フレキシブル
プリント基板において、上記コンタクト部の電極間にス
リツト、または絶縁層の壁、または熱成型による突起を
設けたことを特徴とする印刷フレキシブルプリント基板
。A printed flexible print having a base film, a wiring pattern section formed by printing and baking a silver paste on the base film, and a contact section formed by printing and baking a carbon paste on the silver paste. A printed flexible printed circuit board, characterized in that the substrate is provided with a slit, a wall of an insulating layer, or a protrusion formed by thermoforming between the electrodes of the contact portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15894889A JPH0322584A (en) | 1989-06-20 | 1989-06-20 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15894889A JPH0322584A (en) | 1989-06-20 | 1989-06-20 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0322584A true JPH0322584A (en) | 1991-01-30 |
Family
ID=15682832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15894889A Pending JPH0322584A (en) | 1989-06-20 | 1989-06-20 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322584A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0729871U (en) * | 1993-11-05 | 1995-06-02 | 信越ポリマー株式会社 | Flexible printed circuit board |
| JP2007318040A (en) * | 2006-05-29 | 2007-12-06 | Fujikura Ltd | Wiring board |
-
1989
- 1989-06-20 JP JP15894889A patent/JPH0322584A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0729871U (en) * | 1993-11-05 | 1995-06-02 | 信越ポリマー株式会社 | Flexible printed circuit board |
| JP2007318040A (en) * | 2006-05-29 | 2007-12-06 | Fujikura Ltd | Wiring board |
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