JPH03225904A - Applying method of conductive paste onto multilayer chip - Google Patents

Abstract

PURPOSE:To enable efficient and reliable application of conductive paste for forming an outer electrode even onto a small multilayer chip by cutting grooves, for separating into individual ships, into a laminate and then filling the grooves with the conductive paste thereafter cutting the laminate in the center of the conductive paste. CONSTITUTION:Grooves 11, 11... are cut, by means of a diamond blade 30, into a laminate 10 having rear surface being held by an adhesive tape 20. Conductive paste 12 is then applied on the cutting grooves 11, 11... and filled, therein. The conductive paste 12 is then baked and hardened. Cutting grooves 13, 13... are then made, by means of the diamond blade, in the center of the conductive paste 12. Consequently, the conductive paste 12 filled in the initially cut grooves 11 is separated from the opposite sides of the grooves 11, 11 by means of the later cut grooves 13. Thereafter, grooves 14, 14... are cut to separate the laminate into individual chips 50, 50.... According to this method, the conductive paste 12, 12 is applied accurately and simultaneously onto the opposite ends of a large number of multilayer chips 50, 50... and outer electrodes 15, 15 are formed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a laminated electronic component formed by laminating insulating sheets such as ceramic green sheets, and in particular, to a method for manufacturing a laminated electronic component formed by laminating insulating sheets such as ceramic green sheets, and in particular to a method for manufacturing a laminated electronic component formed by laminating insulating sheets such as ceramic green sheets. The present invention relates to a method of applying conductive paste to.

[Prior Art] Multilayer electronic components such as multilayer capacitors and multilayer coils are composed of a laminate made of insulating sheets such as ceramic green sheets with electrode patterns formed on their surfaces, and this laminate is assembled into individual multilayer chips. It is manufactured by cutting, separating, and forming external electrodes on this stacked chip.

In this case, conventionally, a conductive paste for forming external electrodes was applied to both ends of the laminated chip by the method described below. That is, as shown in FIG. 4(a), a jig 4 is prepared in which an elastic body 2.2 made of rubber or the like for growing a plurality of holes 1.1 is attached to a frame 3 made of aluminum or the like. do. Then, as shown in FIG. 2B, the individually cut laminated chips 5 are inserted into the plurality of holes 1.1 of this elastic body 2.2, and the ends on which the conductive paste is to be applied are inserted. Align the height to the specified height. Then, these inserted and fixed laminated chips 5
The end portion of the conductive paste is dipped into the conductive paste 7 in the paste tank 6 to apply the conductive paste. Furthermore, if the conductive paste is to be applied to the other end of the laminated chip 5, the laminated chip 5 is pushed out to the opposite side of the rubber plate 4 as shown by the broken line in FIG. 4(b). , the other end of the laminated chip 5 is made to protrude. Thereafter, conductive paste 7 is applied to the other end in the same manner.

Then, external electrodes are formed by baking these applied conductive pastes.

[Problems to be Solved by the Invention] However, in the method for applying conductive paste for laminated chips according to the prior art, the plurality of holes 1 of the elastic body 2.2
It is difficult to perform so-called leveling, in which the protruding height of the tip of the laminated chip 5 is made constant by inserting it into the stacked chips 5, and as a result, the amount of conductive paste that adheres to the tip becomes uneven. In particular, the small laminated chip 5 can be inserted into the hole 1 of the rubber plate 4 as described above. 1... It is extremely difficult to hold it securely. For this reason, the length 1. A laminated chip for a small laminated electronic component with a width of 6 mm and a width of 0.8 mm is prepared using the conventional method described above.
It was difficult to apply the conductive paste accurately and reliably.

Furthermore, in this conventional method, the laminated chips 5, which have been individually cut and separated, are separated into a plurality of holes 1 of the elastic body 2.2.
(2)... However, this work is not suitable for automation, and it is not possible to form both external electrodes at once. Therefore, there was a problem that a large amount of manual labor was required, resulting in poor productivity.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, an object of the present invention is to provide a method that can reliably and efficiently apply a conductive paste for external electrodes even to a small multilayer chip.

[Means for Solving the Problems] That is, in order to achieve the above object, the present invention provides a method for applying a conductive paste to individual laminated chips separated from a laminated body. A method for applying conductive paste to a laminated chip includes forming a cutting groove for separating the chips, then applying and filling the cutting groove with conductive paste, and cutting the center portion of the conductive paste.

[Function 4- According to the conductive paste application method according to the present invention, the end faces of the individual laminated chips are coated and filled with the conductive paste into the cutting grooves for cutting and separating the laminated body into individual laminated chips. conductive paste is applied to the However, since this conductive paste is applied across the end faces of the two laminated chips that should be separated by the cutting groove, by cutting the conductive paste in the center, the conductive paste can be applied to the end faces of the individual laminated chips. separated as a layer that adheres to the surface.

Furthermore, these steps consist of cutting the laminate and applying conductive paste to predetermined portions, and both of these steps are suitable for automation.

[Embodiments] Examples of the present invention will be described below with reference to the drawings.

FIG. 1(a) shows a laminate 10 in which a plurality of ceramic green sheets on which electrode patterns are formed using conductive paste or the like are laminated.

This stacked body 10 is cut and separated from each other by forming cutting grooves in a grid pattern, and is separated into individual stacked chips. At this time, an adhesive tape 20 is attached to the lower surface of the laminate 10, and the laminate 10 is held so as not to be separated from each other by the cut grooves.

FIG. 1(b) shows cutting grooves 11, 11,
... is shown. For example, dimension designation 16
In the manufacturing process of the multilayer ceramic capacitor No. 08, the grooves 1, 1, 11... have a groove width of 0. 6mm, groove pitch 1°7 steps.

Next, as shown in FIG. 1(C), conductive paste 1 is applied to the cutting grooves II, 11, etc. using, for example, a squeegee rubber.
Apply 2 and fill. After that, this conductive paste)12
is baked and hardened, for example, at a temperature of about 800°C. Thereafter, as shown in FIG. 2(d), 15J grooves 13, 13, . . . are formed in the center of the conductive paste 12 using a diamond blade of a dicing machine.

At this time, the groove width of the grooves 13, 13... is narrower than the groove width of the cutting grooves IL], I..., for example, the cutting groove 1.
If the width of 1, II... is 0.6m+n, the width should be about 0°1. As a result, as shown in FIG. 2, the conductive paste 12 filled in the first cutting groove 11 is transferred to the first cutting groove ILI by the cutting groove 13 formed later.
The layers deposited on both sides of the cut surface of I are separated from each other.

Next, as shown in FIG. 1(d), the other cutting groove 13
, IS... in the direction perpendicular to the other cutting groove 14.1.
4... and the stacked body into individual stacked chips 50.5
Separate into 0... For example, in the manufacturing process of a multilayer ceramic capacitor with a nominal size of 1608, the cutting groove 14
．． The groove width of 14... is 0. 1mm, groove pitch is 0
．． Let 9-=I.

A laminated chip 50 with external electrodes 15.15 formed by the method described above is shown in FIG. Its dimensions are the nominal dimension 1608, length I=1.1+
u+, width w=0. At both ends of the 8mm laminated electronic component,
An external electrode 15.15 with a thickness d=0.25 is formed,
The overall length is L"1.6 mm. It is difficult to reliably apply conductive paste to a laminated chip of this size using the conventional method described above.

According to the method of the invention, a large number of stacked chips 50.
The task is to accurately apply conductive paste 12.12 to both ends of the electrodes 50 to form external electrodes 15.15. And, as already mentioned, the method is suitable for automation.

The laminated chip with external electrodes formed on both ends is fired, and further subjected to insulating coating, plating, etc. as necessary, to complete a laminated chip type ceramic capacitor having external electrodes on both ends.

In the above embodiment, the manufacturing process of a multilayer capacitor was explained as an example, but the present invention is not limited thereto. For example, a conductive paste may be applied to both ends of a multilayer chip such as a multilayer inductor, which is obtained by cutting and separating a multilayer body. It can be widely applied to processes.

[Effects of the Invention] As is clear from the above explanation, the method of applying conductive paste to laminated chips according to the present invention allows conductive paste to be applied to both ends of even small laminated chips, which was impossible with conventional methods. can be applied reliably and efficiently, and can provide a method suitable for automation.

[Brief explanation of drawings]

1(a) to (d) are perspective views of a laminate showing a method of applying a conductive paste to a multilayer chip according to the present invention; FIG. 2 is a partially enlarged sectional view showing details of the method of applying the conductive paste;
FIG. 3 is a perspective view showing an example of a laminated chip with external electrodes formed by the method described above, FIG. FIG. 2 is a cross-sectional view of a main part showing a method of applying a conductive paste using a method for applying a conductive paste. lO...Laminated body 11.13.14...Cutting groove 1
2... Conductive paste 15... External electrode 50...
・Laminated chip 9 - Display of procedural amendment case No. 1990 Patent Application No. 21825 Title of invention Method of applying conductive paste to laminated chip Relationship with the person who amends the case Patent applicant address 6-chome, Ueno, Taito-ku, Tokyo Mr. 16 No. 20
Taiyo Yuden Co., Ltd.
Company representative Personal address 3-3-40 Gokenmachi, Mito City, Ibaraki Prefecture Date of amendment order (voluntary) Contents of amendment to drawings subject to amendment 1 (

Claims (1)

[Claims] A method of applying conductive paste to individual laminated chips separated from a laminate includes forming cutting grooves for separating the laminate into individual laminated chips, and then applying and filling the cutting grooves with conductive paste. A method for applying conductive paste to a laminated chip, the method comprising cutting the conductive paste at the center.