JPH03230926A - Manifold for molding multi-material hot runner - Google Patents

Abstract

PURPOSE:To obtain a manifold for molding a multi-material hot runner having a narrow installation area and capable of simplifying the electric wiring for temperature rising by providing two or more sprues corresponding to the nozzle, and also providing respectively separately runner channels for connecting each sprue and hot runner bushes. CONSTITUTION:In this manifold for molding a multi-material hot runner, numeral 10 shows a sprue to be in contact with one nozzle 1 of a molding machine, 11 denotes a runner channel through which resin material passes, and 13 is a communicating path to be in contact with a hot chip bush 12. And, 17 is a sprue to be in contact with another nozzle 1 of the molding machine, 18 is a runner channel, and 19 is a hot chip bush. Respective sprues 10, 17, runner channels 11, 18, and communicating paths 13, 19 do not intersect with respect to each other. And, the manifold 14 is equipped with a heater 15, temperature sensor 16 or the like for raising temperature up. By this construction, as a number of manifold can be reduced, the installation area of whole manifold can be narrowed. And, as a number of installation of heater, sensor, control or the like can also be reduced in correspondence to such reduction, as a result, the electric wiring can be simplified.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multi-material hot runner molding manifold used when molding two or more resin materials.

Conventional technology Injects resin through two or more nozzles that come into contact with the molding machine,
In the case of resin molding in which the resin material flows into the hot chip bushing through a runner in a manifold, the structure of the manifold is shown in Fig. 2, which includes a sprue 2 in contact with the nozzle 1 of the molding machine, a runner in the manifold 3 through which the resin material flows. 4. It consists of a connecting path 6 connected to the hot chip 5, a heater 7 for increasing the temperature of the manifold 3, and a temperature sensor 8.

Furthermore, there are as many manifolds 3 as there are nozzles 1 of the molding machine.

The resin material injected from one nozzle 1 of the molding machine passes through a sprue 2, a runner 4, and a runner 4 provided in one manifold 3.
It flows through the connecting road 6 and flows to the hot chip 5.

At this time, in order to control the ease of flow, current is applied to the heater 7, and the temperature of the manifold 3 is increased while being controlled by the temperature sensor 8. Furthermore, other manifold 3
The same effect is applied to

Problems to be Solved by the Invention As described above, the conventional manifold configuration has two nozzles for each nozzle.
It was necessary to provide more than one individual unit.

This poses a problem in that the installation area of the manifold becomes large.

In addition, in order to raise the temperature of the manifold to a level suitable for resin molding, it is necessary to install a heater and temperature sensor for each manifold, and to use a power supply and temperature controller for each manifold or for multiple manifolds at once. Therefore, there is a problem that the electrical wiring becomes complicated.

The present invention provides a multi-material hot runner molding manifold that has a small installation area and can simplify electrical wiring for heating.

Means to solve problems The present invention is characterized in that a plurality of runners are provided.

Function: With the above configuration, the number of installed manifolds can be reduced, so the installation area of the entire manifold can be reduced. Furthermore, the number of installed heaters, sensors, controllers, etc. can be reduced by the amount of the reduction, so electrical wiring can be simplified.

Embodiment A multi-material hot runner molding manifold according to an embodiment of the present invention will be described with reference to FIG.

In the figure, 10 is a sprue in contact with one nozzle 1 of the molding machine, 11 is a runner through which a resin material passes, and 13 is a communication path in contact with a hot chip bush 12.

17 is a sprue in contact with the other nozzle 1 of the molding machine 18
is the hot water path, and 19 is the hora 1 to tipbutsuyu. Each sprue 10.17, runners 11, 18, and connecting paths 13.19 do not intersect with each other. Moreover, this manifold 14 is
Heater 15 and temperature sensor 16 for increasing the temperature
The injected resin material is equipped with manifold 1.
The water flows to the hot depth 12 through one sprue 10 provided in the hot water bath 4, a runner 11, and a connecting path 13. The behavior of the resin material injected from the other nozzle 1 of the molding machine is also similar.

At this time, a current is applied to the heater 15 to control the ease of flow, and the temperature of the manifold 14 is raised while being controlled by the temperature sensor 16.

Effects of the Invention According to the present invention, the installation area of the entire manifold can be reduced, and the electrical wiring can be simplified.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a multi-material hot runner molding manifold according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional example. 1... Nozzle, 10.17... Sprue 11゜18... Runway, 12.19...
...Hot Chitubbu Soshu.

Claims (1)

[Claims] In a multi-material hot runner molding manifold equipped with a runner for flowing resin injected from multiple nozzles into a molding machine to a hot tip bush, two or more sprues corresponding to the nozzles are provided, and each sprue is A multi-material hot runner molding manifold characterized by having separate runners connecting the hot runner bushings.