JPH0323645A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To surely execute an inner lead bonding operation without damaging a semiconductor chip even when bump heights are irregular by a method wherein many hold-down sheets whose oneside ends have been fixed to a picture- frame-shaped hold-down frame are formed so as to be extended toward the central part of the frame. CONSTITUTION:A picture-frame-shaped hold-down frame 8 is attached to the lower part of a hold-down substrate 7. Many hold-down sheets 9 whose one-side ends of the many hold-down sheet' 9 are fixed to the hold-down frame 8 and which are extended toward the central part from the frame 8 are formed. The individual holddown sheets 9 are formed so as to correspond to individual leads of a TAB tape; stainless steel or the like which is corrosion-resistant and whose hardness and elasticity are proper is used as their material. When electrodes 3 and leads 5 are held down by using the respectively independent hold-down sheets 9, an inner lead bonding operation can be executed surely without damaging a semiconductor chip even when bump heights at tip lower parts of the electrodes 3 and the leads 5 are irregular.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an inner lead bonding device for holding a semiconductor chip on the lead of a tape automated bonding (hereinafter abbreviated as TAB) tape.
In particular, the present invention relates to improvements in the bonding presser jig used in the device.

[Conventional technology]

The bonding between the leads of the TAB tape and the semiconductor chip is carried out by attaching the electrodes 3 of the semiconductor chip 2 on the stage l to the electrodes 3 of the semiconductor chip 2, which is held by a plastic film 4, as shown in FIGS. 3(A) and 3(B). A common method is to align the inner tips of the leads 5, press and heat all the leads at the same time with a presser block 6, apply ultrasonic vibrations if necessary, and join the leads 5 and electrodes 3 all at once. In order to facilitate this bonding, the lower part of the tip of the lead 5 or the electrode 3 is usually used.
A soft metal bump is provided on the top, so that even if there is some variation in the height of the bump or the tips of the leads are slightly uneven, there will be no problem in joining the inner leads. .

[Problem to be solved by the invention]

However, in this method, if some of the bumps on the lead tip or electrode are extremely low in height, the bonding at that portion may not be performed properly. In order to eliminate such bonding defects, it is conceivable to increase the pressing pressure of the presser block 6, but increasing this pressure unnecessarily causes damage to the semiconductor block 2, which is not preferable.

SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding device that can flexibly and reliably perform bonding regardless of variations in bump height by eliminating the drawbacks of the above-mentioned batch pressing method.

[Means to solve the problem]

In order to achieve the above object, the device of the present invention includes a picture frame-shaped presser frame and a number of presser plates each having one end fixed to the frame and extending from the frame toward the center. The board is TAB
It is characterized in that it is equipped with an inner lead bonding holding jig adapted to correspond to each lead of the tape.

FIG. 1 is a diagram showing the concept of the holding jig for inner lead bonding used in the present invention, and FIG.
) (7) XX sectional view, Figure 1. (B:l;t. It is a YY cross-sectional view of FIG. 1(A).

In FIG. 1, a frame-shaped presser frame 8 is attached below the presser base plate 7, and this presser frame 8 includes a large number of pressers I! 9 is provided to fix one end and extend from the frame 8 toward the center, and each holding plate 9 is arranged to correspond to each lead of the TAB tape as shown in FIG. . This presser plate 9 needs to have appropriate hardness and elasticity as well as corrosion resistance, and is suitably made of stainless steel, copper alloy, or the like used as a spring material. The shape and dimensions of the presser plate 9 may be determined as appropriate depending on the characteristics of the material used. Since this presser plate 9 is exposed to a heated atmosphere, if the material is made of a material with poor corrosion resistance, the peeled rust will contaminate the semiconductor chip 2. For this reason, corrosion resistance is required.

[For production]

According to such a holding jig, the electrode 3 and the lead 5 are held down by independent holding plates 9, as shown in FIG. If there is an extremely low bump height at the bottom of the tip of the T1 pole 3''2 or the lead 5, a larger load will be applied to the holding board 7 to hold down the electrode 3 and lead 5. In that case, the other holding plates will use their elasticity to relieve the excessive load, and the load will not be directly transmitted to the semiconductor chip, so damage can be effectively prevented. [Effects of the Invention] According to the present invention, inner lead bonding can be performed reliably without damaging the semiconductor chip, regardless of variations in bump height.

[Brief explanation of drawings]

Fig. 1 is a diagram conceptually showing the holding jig for inner lead bonding used in the present invention, Fig. 2 is a diagram explaining bonding using this jig, and Fig. 3 is a diagram showing the inner lead using the conventional batch holding method. It is a figure explaining bonding. 2... Semiconductor chip, 3... Electrode, 4... Plastic film, 5... Lead, 6... Holder block, 7... Holder substrate, 8... Holder frame, 9...・Press plate. Figure 1 (A) 9 Figure 1 (B)

Claims (1)

[Claims] This is an inner lead bonding device that holds a semiconductor chip on the lead of a TAB tape, and includes a picture frame-shaped holding frame and a number of holding plates whose one end is fixed to the frame and which extends from the frame toward the center. Each holding plate has a TAB
A bonding device comprising an inner lead bonding holding jig adapted to correspond to each lead of a tape.