JPH032375Y2 - - Google Patents

Description

[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) The present invention relates to a soldering conveyance device in which a board to be soldered is held and conveyed by a pair of conveyance claws. .

(Prior Art) As shown in FIG. 3, an automatic soldering line includes a pair of guide frames 15 disposed above a fluxer 11, a preheater 12, a solder bath 13, and a cooling fan 14. An endless conveyance chain 16 is movably provided inside the guide frame 15, and as shown in FIG. A printed wiring board 18 as a board to be soldered is held and transported on an automatic soldering line shown in FIG. 3, and soldering to the printed wiring board 18 is automatically performed.

(Problems to be Solved by the Invention) The conventional guide frame 15 is made of rolled steel or the like and has a cross section as shown in FIG. It is heated in the solder bath 13 and expands or warps greatly. In particular, since the guide frame 15 is made of rolled steel or the like, it is likely to be distorted due to residual stress during uneven heating.

The purpose of the present invention is to protect this guide frame from the heating of the preheater and the solder bath.

[Structure of the idea]

(Means for Solving the Problems) In the present invention, a conveyance chain 16 is movably provided along a pair of guide frames 15 disposed above the preheater 12 and the solder bath 13. In a soldering conveyance device in which a board to be soldered 18 is held and conveyed by a pair of protruding conveyance claws 17, a cooling duct portion 31 through which a cooling fluid flows inside the guide frame 15 is provided. It has been established.

(Function) The present invention forces the guide frame 15 heated by the radiant heat of the preheater 12 and the melted solder heat of the solder bath 13 by passing a cooling fluid such as air or water through the cooling duct portion 31. cool,
This guide frame 15 is prevented from elongation, warping, and distortion.

(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIGS. 1 and 2.

As shown in FIG.
, an upper plate part 21, an outer plate part 22 provided below from both sides of the upper plate part 21, and an inner plate part 23 provided at a distance inside the outer plate part 22 on both sides. , and a lower plate part 24 provided between the lower ends of the inner plate parts 23 on both sides are integrally formed by drawing.

A guide rail 26 fixed to each of the plate parts 22 and 23 is provided in a pair of recesses 25 formed between the outer plate part 22 and the inner plate part 23 on both sides.
The conveyance chain 16 is slidably fitted therebetween.

Furthermore, in the center of the guide frame 15,
A cooling duct portion 3 formed by the upper side plate portion 21, inner side plate portions 23 on both sides, and lower side plate portion 24.
1 is provided.

As shown in FIG. 2, this cooling duct section 3
The openings at both ends of the cooling duct section 31 are closed by lids 32, and a cooling fluid supply port 33 is provided at one end of the cooling duct section 31, and a cooling fluid discharge port 34 is provided at the other end. It is being

Then, cooling fluid such as cooling air or cooling water is forcibly supplied into the cooling duct section 31 from the supply port section 33, and this cooling fluid guides the guides from the preheater 12 and the solder bath 13. The heat applied to the frame 15 is absorbed, and the heat is discharged to the outside from the discharge port 34 together with the cooling fluid.

In the above embodiment, the cooling duct portion 31 is integrally molded inside the guide frame 15, but the cooling duct portion may be provided by incorporating a separate duct member inside the guide frame 15.

[Effect of idea]

According to the present invention, since the cooling duct portion through which the cooling fluid flows is provided inside the guide frame, the cooling fluid flowing through the duct portion is applied to the guide frame from the preheater and the solder bath. The generated heat is efficiently released to the outside,
There is no risk that the temperature of the guide frame will rise excessively. Therefore, stretching, warping, distortion, etc. of the guide frame can be prevented.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an embodiment of the soldering transfer device of the present invention, Fig. 2 is a perspective view of its guide frame, Fig. 3 is a plan view of an automatic soldering line, and Fig. 4 is a conventional soldering transfer device. It is a sectional view showing a conveyance device for soldering. 12... Preheater, 13... Solder bath, 15
... Guide frame, 16 ... Conveyance chain, 17
. . . Conveyance claw, 18 . . . Printed wiring board as a board to be soldered, 31 . . . Cooling duct section.

Claims (1)

[Scope of utility model registration request] A conveyor chain is provided so as to be movable along a pair of guide frames disposed above the preheater and the solder bath, and the board to be soldered is held between a pair of conveyor claws protruding from the chain. What is claimed is: 1. A soldering conveying device for conveying a soldering device, characterized in that a cooling duct portion through which a cooling fluid flows is provided inside the guide frame.