JPH03237795A - Thick film printed wiring board - Google Patents

Thick film printed wiring board

Info

Publication number
JPH03237795A
JPH03237795A JP3464890A JP3464890A JPH03237795A JP H03237795 A JPH03237795 A JP H03237795A JP 3464890 A JP3464890 A JP 3464890A JP 3464890 A JP3464890 A JP 3464890A JP H03237795 A JPH03237795 A JP H03237795A
Authority
JP
Japan
Prior art keywords
gold
silver
thin film
pad
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3464890A
Other languages
Japanese (ja)
Inventor
Yoshiatsu Yamashita
山下　芳温
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP3464890A priority Critical patent/JPH03237795A/en
Publication of JPH03237795A publication Critical patent/JPH03237795A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To improve the wettability for gold based brazing filler metal at the time of parts mounting, by constituting a pad for parts mounting as the three-layered structure of a substratum electrode composed of silver-palladium and the like, a gold conductor wiring, and a gold thin film. CONSTITUTION:On a pad part for parts mounting on a ceramic substrate 1, conductor paste such as solder resistant silver-palladium, silver-platinum, and silver is printed as a substratum electrode 3 by screen-printing method, and baked. Gold paste is used, and a conductor wiring 2 is formed on the substratum electrode 3 by printing baking. On the gold conductor wiring 2, a gold thin film 4 is formed by printing baking gold paste for thin film use which contains little glass component and is excellent in purity. A chip parts 6 is formed on the gold thin film 4 by using gold based brazing filler metal 5 such as gold-tin and gold-antimony. Since the pad is constituted as the three-layered structure of the silver-palladium substratum electrode 3, the gold conductor wiring 2, and the gold thin film 4, the wettability of gold based brazing filler metal 5 used at the time of chip mounting is improved and the workability also are improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はハイブリッドＩＣ用の厚膜印刷配線基板に関し
、特に高密度、高性能、高信頼性を要求される金導体厚
膜印刷配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film printed wiring board for hybrid IC, and particularly to a gold conductor thick film printed wiring board that requires high density, high performance, and high reliability. .

〔従来の技術〕[Conventional technology]

近年、コンピュータ、通信２周辺端末装置等々の小型化
、高性能化を実現するためのＩＣ，ＬＳＩの発展は、半
導体技術の飛躍的な進歩により、めざましいものがある
。これに伴い、ＩＣ，ＬＳＩを搭載する回路基板として
の厚膜印刷配線基板も小型化、高性能化が要求されてい
る。In recent years, the development of ICs and LSIs to realize the miniaturization and high performance of computers, communication peripheral terminal devices, etc. has been remarkable due to the dramatic advances in semiconductor technology. Along with this, thick film printed wiring boards as circuit boards on which ICs and LSIs are mounted are also required to be smaller in size and have higher performance.

従来の一般的なスクリーン印刷法を用いた金導体厚膜印
刷配線基板の製造方法を第２図を用いて説明する。A method of manufacturing a gold conductor thick film printed wiring board using a conventional general screen printing method will be explained with reference to FIG.

まず、９６％アルミナセラミック基体を用いたセラミッ
ク基板ｌ上にスクリーン印刷法により、例えば銀−パラ
ジウム（Ａｇ−Ｐｄ）導体ペーストを、部品搭載パッド
部の下地電極３として印刷して焼成する。次に回路導体
として金（Ａｕ）導体ペーストを印刷・焼成して金導体
配線２を形成する。その後、同様の方法により厚膜抵抗
体等を形成し、金導体厚膜印刷配線基板を製造する。First, by screen printing, for example, a silver-palladium (Ag-Pd) conductor paste is printed as the base electrode 3 of the component mounting pad portion on a ceramic substrate l using a 96% alumina ceramic base and fired. Next, a gold (Au) conductor paste is printed and fired as a circuit conductor to form a gold conductor wiring 2. Thereafter, thick film resistors and the like are formed by the same method to produce a gold conductor thick film printed wiring board.

チップ部品６は、金−アンチモン等の金糸のろう材５を
用いて銀−パラジウム下地電極３と金導体配線２からな
るパッド上に搭載する。The chip component 6 is mounted on a pad consisting of a silver-palladium base electrode 3 and a gold conductor wiring 2 using a gold thread brazing material 5 such as gold-antimony.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の厚膜印刷配線基板は、部品を搭載するパ
ッド部の下地電極として、銀−パラジウムを使用してい
るため、部品搭載に用いるろう材に対する耐性が強く、
パッドの密着強度も高いという長所がある。しかしその
半面、その上に形成される金導体配線２と銀−パラジウ
ム下地電極３の２層構造をとるため、膜厚が厚くなり、
ペースト中のガラス成分が表面に浮き出し、ろう材５に
対する濡れ性が低下し、作業性が悪くなるという欠点が
ある。The above-mentioned conventional thick-film printed wiring board uses silver-palladium as the base electrode of the pad portion on which components are mounted, so it has high resistance to the brazing material used for mounting components.
It has the advantage of having high adhesion strength to the pad. However, on the other hand, since it has a two-layer structure of the gold conductor wiring 2 and the silver-palladium base electrode 3 formed thereon, the film thickness becomes thicker.
This has the drawback that the glass component in the paste stands out on the surface, reducing the wettability to the brazing filler metal 5 and impairing workability.

本発明の目的は、ろう材に対する濡れ性の良好な部品搭
載用パッドを有する厚膜印刷配線基板を提供することに
ある。An object of the present invention is to provide a thick film printed wiring board having component mounting pads that have good wettability with brazing material.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の厚膜印刷配線基板は、絶縁基板上に設けられた
部品搭載用のパッドを有する厚膜印刷配線基板において
、前記パッドは順次設けられた下地電極と金導体配線と
金薄膜とからなる３層構造を有するものである。The thick film printed wiring board of the present invention is a thick film printed wiring board having a pad for mounting components provided on an insulating substrate, wherein the pad is composed of a base electrode, a gold conductor wiring, and a gold thin film provided in this order. It has a three-layer structure.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の断面図であり、チップ部品
を搭載した場合を示す。以下製造方法と共に説明する。FIG. 1 is a sectional view of one embodiment of the present invention, showing a case where chip components are mounted. The manufacturing method will be explained below.

まず、セラミック基板１上の部品搭載用パッド部に半田
耐性の強い銀−パラジウム、銀−白金。First, silver-palladium and silver-platinum, which have strong solder resistance, are used for the component mounting pads on the ceramic substrate 1.

銀等の導体ペーストを下地電極として、スクリーン印刷
法により印刷し焼成する。本実施例では、酸化雰囲気中
で焼成でき、しかも比較的安価な銀−パラジウムを使用
し、下地電極３を形成した。Using a conductive paste such as silver as a base electrode, it is printed by screen printing and fired. In this example, the base electrode 3 was formed using silver-palladium, which can be fired in an oxidizing atmosphere and is relatively inexpensive.

次に、金ペーストを用い、同様の方法により銀−パラジ
ウム下地電極３上を含む部分に金導体配線２を印刷・焼
成して形成する。Next, gold conductor wiring 2 is printed and fired on a portion including the silver-palladium base electrode 3 using a similar method using gold paste.

次にパッド部の金導体配線２上に、ガラス成分が少なく
純度の高い薄膜用金ペーストを印刷・焼成して金薄膜４
を形成する。チップ部品６は、金錫、金−アンチモン等
の金糸のろう材５を用いて金薄膜４上に形成する。本実
施例においては、金薄Ｂ４の厚みは２μｍ以下で−ある
。またガラス成分はほとんど含まれておらず金薄膜４の
金の純度は１００％に近いものである。Next, a thin film gold paste with a low glass content and high purity is printed and fired on the gold conductor wiring 2 of the pad part, and the gold thin film 4 is printed and fired.
form. The chip component 6 is formed on the gold thin film 4 using a brazing material 5 of gold thread such as gold tin or gold-antimony. In this example, the thickness of the gold thin B4 is 2 μm or less. Moreover, almost no glass component is included, and the purity of the gold in the gold thin film 4 is close to 100%.

このように、本実施例により得られた金導体厚膜印刷配
線基板では、パッドが銀−パラジウム下地電極３と金導
体配線２と金薄膜４との３層構造となっているため、チ
ップ搭載時に用いる金糸のろう材５の濡れ性が極めて良
く、作業性も格段に向上させることが出来た。As described above, in the gold conductor thick film printed wiring board obtained in this example, the pad has a three-layer structure of the silver-palladium base electrode 3, the gold conductor wiring 2, and the gold thin film 4, so that it is easy to mount the chip. The wettability of the brazing filler metal 5 made of gold thread, which is sometimes used, was extremely good, and the workability was also significantly improved.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、部分搭載用のパッドを、
銀−パラジウム等からなる下地電極と金導体配線と金薄
膜との３層構造とすることにより、部品搭載時の金糸ろ
う材に対する濡れ性を向上させ、作業性を大幅に改善で
きる効果がある。As explained above, the present invention provides a pad for partial mounting,
A three-layer structure consisting of a base electrode made of silver-palladium or the like, gold conductor wiring, and a thin gold film has the effect of improving wettability to the gold thread brazing material during component mounting and greatly improving workability.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の断面図、第２図は従来の厚
膜印刷配線基板の一例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of an example of a conventional thick film printed wiring board.

Claims (1)

【特許請求の範囲】[Claims] 　絶縁基板上に設けられた部品搭載用のパッドを有する
厚膜印刷配線基板において、前記パッドは順次設けられ
た下地電極と金導体配線と金薄膜とからなる３層構造を
有することを特徴とする厚膜印刷配線基板。A thick film printed wiring board having a pad for mounting components provided on an insulating substrate, characterized in that the pad has a three-layer structure consisting of a base electrode, a gold conductor wiring, and a gold thin film provided in sequence. Thick film printed circuit board.
JP3464890A 1990-02-14 1990-02-14 Thick film printed wiring board Pending JPH03237795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3464890A JPH03237795A (en) 1990-02-14 1990-02-14 Thick film printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3464890A JPH03237795A (en) 1990-02-14 1990-02-14 Thick film printed wiring board

Publications (1)

Publication Number Publication Date
JPH03237795A true JPH03237795A (en) 1991-10-23

Family

ID=12420264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3464890A Pending JPH03237795A (en) 1990-02-14 1990-02-14 Thick film printed wiring board

Country Status (1)

Country Link
JP (1) JPH03237795A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897553A (en) * 1994-09-21 1996-04-12 Toyo Commun Equip Co Ltd Conductive pattern structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897553A (en) * 1994-09-21 1996-04-12 Toyo Commun Equip Co Ltd Conductive pattern structure

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