JPH0324237U - - Google Patents
Info
- Publication number
- JPH0324237U JPH0324237U JP8463289U JP8463289U JPH0324237U JP H0324237 U JPH0324237 U JP H0324237U JP 8463289 U JP8463289 U JP 8463289U JP 8463289 U JP8463289 U JP 8463289U JP H0324237 U JPH0324237 U JP H0324237U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- tip
- fusible alloy
- chuck
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Manufacture Of Switches (AREA)
- Fuses (AREA)
Description
第１図は本考案に係る接合装置の一実施例を示
す概略図、第２図と第３図は可溶合金を利用した
温度ヒユーズとその動作後の状態を示す断面図、
第４図は従来の接合装置の一具体例を示す概略図
である。
１，２……リード線、３……可溶合金、１６，
１７，１８，１９……チヤツク、２０，２１，２
２，２３……加熱手段。
FIG. 1 is a schematic diagram showing an embodiment of a joining device according to the present invention, FIGS. 2 and 3 are sectional views showing a temperature fuse using a fusible alloy and its state after operation,
FIG. 4 is a schematic diagram showing a specific example of a conventional joining device. 1, 2... Lead wire, 3... Fusible alloy, 16,
17, 18, 19...chuck, 20, 21, 2
2, 23...Heating means.
Claims (1)
リード線の先端部を所定温度に加熱すると共に、
チヤツクで把持された可溶合金の接合予定部分に
上記先端部を当接させて上記接合予定部分を溶融
させ、リード線と可溶合金を接合するものであつ
て、 上記リード線の先端部を把持するリード線チヤ
ツクと、上記リード線もしくは更にリード線先端
部を非接触に加熱する加熱手段とを具備したこと
を特徴とする接合装置。[Claims for Utility Model Registration] When joining the lead wire and the fusible alloy, the tip of the lead wire is heated to a predetermined temperature, and
The tip of the fusible alloy gripped by a chuck is brought into contact with the part to be joined to melt the part to be joined, thereby joining the lead wire and the fusible alloy. A bonding device comprising: a lead wire chuck for gripping; and heating means for heating the lead wire or the tip of the lead wire in a non-contact manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8463289U JPH0324237U (en) | 1989-07-18 | 1989-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8463289U JPH0324237U (en) | 1989-07-18 | 1989-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0324237U true JPH0324237U (en) | 1991-03-13 |
Family
ID=31633238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8463289U Pending JPH0324237U (en) | 1989-07-18 | 1989-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0324237U (en) |
-
1989
- 1989-07-18 JP JP8463289U patent/JPH0324237U/ja active Pending